Process for producing bonded body and process for producing power module substrate

Patent metadata

Field	Value
Publication number	US-10370303-B2
Application number	US-201515304544-A
Country	US
Kind code	B2
Filing date	Apr 16, 2015
Priority date	Apr 25, 2014
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

Disclosed is provided a process for producing a bonded body by bonding a ceramic member made of a ceramic to a Cu member made of Cu or a Cu alloy, the process including: a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material containing Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and a heating step of heating the ceramic member and the Cu member which are laminated together.

First claim

The invention claimed is:

1. A process for producing a bonded body by bonding a ceramic member made of a ceramic and a Cu member made of Cu or a Cu alloy together, the process comprising:
a laminating step of laminating the Cu member on a first surface side of the ceramic member via a brazing material consisting of Cu and a eutectic element which has a eutectic reaction with Cu, and via an active metal; and
a heating step of heating the ceramic member and the Cu member which are laminated together,
wherein the eutectic element is one element or two or more elements selected from Ca, Ge, Sr, Sn, Sb, Ba, La, Ce, and Al.

2. The process for producing a bonded body according to claim 1 ,
wherein in the laminating step, the brazing material is disposed on the ceramic member, and the active metal is disposed on the Cu member.

3. The process for producing a bonded body according to claim 1 ,
wherein in the laminating step, an Al member made of Al or an Al alloy is further laminated on a second surface side of the ceramic member, and
wherein in the heating step, the ceramic member, the Cu member, and the Al member which are laminated together are heated.

4. The process for producing a bonded body according to claim 1 ,
wherein the ceramic member is made of any one of Si 3 N 4 , AlN, or Al 2 O 3 .

5. A process for producing a power module substrate in which a Cu plate made of Cu or a Cu alloy is disposed on a first surface of a ceramic substrate,
wherein the ceramic substrate and the Cu plate are bonded together using the process for producing a bonded body according to claim 1 .

6. The process for producing a bonded body according to claim 2 ,
wherein in the laminating step, an Al member made of Al or an Al alloy is further laminated on a second surface side of the ceramic member, and
wherein in the heating step, the ceramic member, the Cu member, and the Al member which are laminated together are heated.

7. The process for producing a bonded body according to claim 2 ,
wherein the ceramic member is made of any one of Si 3 N 4 , AlN, or Al 2 O 3 .

8. The process for producing a bonded body according to claim 3 ,
wherein the ceramic member is made of any one of Si 3 N 4 , AlN, or Al 2 O 3 .

9. The process for producing a bonded body according to claim 6 ,
wherein the ceramic member is made of any one of Si 3 N 4 , AlN, or Al 2 O 3 .

10. A process for producing a power module substrate in which a Cu plate made of Cu or a Cu alloy is disposed on a first surface of a ceramic substrate,
wherein the ceramic substrate and the Cu plate are bonded together using the process for producing a bonded body according to claim 2 .

11. A process for producing a power module substrate in which a Cu plate made of Cu or a Cu alloy is disposed on a first surface of a ceramic substrate,
wherein the ceramic substrate and the Cu plate are bonded together using the process for producing a bonded body according to claim 3 .

12. A process for producing a power module substrate in which a Cu plate made of Cu or a Cu alloy is disposed on a first surface of a ceramic substrate,
wherein the ceramic substrate and the Cu plate are bonded together using the process for producing a bonded body according to claim 4 .

Assignees

• Mitsubishi Materials Corp

Inventors

• Terasaki Nobuyuki
• Nagatomo Yoshiyuki

Classifications

• H10W40/60

  Securing means for detachable heating or cooling arrangements, e.g. clamps · CPC title

• H01L23/40

  Electricity · mapped topic

• B23K35/30

  with the principal constituent melting at less than 1550°C · CPC title

• C22C21/00

  Alloys based on aluminium · CPC title

• B23K35/302 Primary

  Cu as the principal constituent · CPC title