Low scattering silica glass and method for heat-treating silica glass

US10370281B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10370281-B2
Application numberUS-201615014359-A
CountryUS
Kind codeB2
Filing dateFeb 3, 2016
Priority dateAug 15, 2013
Publication dateAug 6, 2019
Grant dateAug 6, 2019

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

Provides is low scattering silica glass suitable as a material of an optical communication fiber. Silica glass has a fictive temperature of at least 1,000° C. and a void radius of at most 0.240 nm, as measured by positron annihilation lifetime spectroscopy. A method for heat-treating silica glass is also provided, which comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 30 MPa, and cooling the silica glass at an average temperature-decreasing rate of at least 40° C./min during cooling within a temperature range of from 1,200° C. to 900° C. A method for heat-treating silica glass also comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 140 MPa, and cooling the silica glass in an atmosphere under a pressure of at least 140 MPa during cooling within a temperature range of from 1,200° C. to 900° C.

First claim

Opening claim text (preview).

What is claimed is: 1. Silica glass, which has a fictive temperature of at least 1,000° C. and a void radius of at most 0.240 nm, as measured by positron annihilation lifetime spectroscopy, wherein a content of SiO 2 in the silica glass is at least 99.7 mass %, an OH content in the silica glass is at most 50 ppm, a content of an alkali metal component in the silica glass is at most 100 ppm, and a Rayleigh scattering coefficient of the silica glass with respect to light at 1.55 μm is at most 0.065 dB/Km. 2. Silica glass, which has a refractive index of at least 1.460 and an annihilation lifetime τ 3 of at most 1.56 ns when a positron is captured by a void and annihilates, wherein a content of SiO 2 in the silica glass is at least 99.7 mass %, an OH content in the silica glass is at most 50 ppm, a content of an alkali metal component in the silica glass is at most 100 ppm, and a Rayleigh scattering coefficient of the silica glass with respect to light at 1.55 μm is at most 0.065 dB/Km. 3. A method for heat-treating silica glass, which comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 30 MPa, and cooling the silica glass at an average temperature-decreasing rate of at least 55° C./min during cooling within a temperature range of from 1,200° C. to 900° C., wherein the silica glass of claim 2 is produced. 4. A method for heat-treating silica glass, which comprises holding silica glass to be heat-treated in an atmosphere at a temperature of at least 1,200° C. and at most 2,000° C. under a pressure of at least 140 MPa, and cooling the silica glass in an atmosphere under a pressure of at least 140 MPa during cooling within a temperature range of from 1,200° C. to 900° C., wherein the silica glass of claim 2 is produced. 5. The method for heat-treating silica glass according to claim 3 , which further comprises cooling the silica glass in an atmosphere under a pressure of at least 0.1 MPa within a temperature range of from 900° C. to 200° C. 6. The method for heat-treating silica glass according to claim 3 , wherein the scattering coefficient of the silica glass after the heat treatment decreases to 60% or less of the value before the heat treatment. 7. The method for heat-treating silica glass according to claim 3 , wherein the void radius of the silica glass as measured by positron annihilation lifetime spectroscopy after the heat treatment decreases to 98% or less of the value before the heat treatment. 8. An optical communication fiber, which uses the silica glass as defined in claim 1 . 9. An optical member for lithography, which uses the silica glass as defined in claim 1 . 10. An optical communication fiber, which uses the silica glass as defined in claim 2 . 11. An optical member for lithography, which uses the silica glass as defined in claim 2 .

Assignees

Inventors

Classifications

  • with more than 90% silica by weight, e.g. quartz {(C03C3/045 takes precedence)} · CPC title

  • Annealing or re-heating the drawn fibre prior to coating · CPC title

  • doped with titanium · CPC title

  • doped with germanium · CPC title

  • Hydroxyl ion (OH) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US10370281B2 cover?
Provides is low scattering silica glass suitable as a material of an optical communication fiber. Silica glass has a fictive temperature of at least 1,000° C. and a void radius of at most 0.240 nm, as measured by positron annihilation lifetime spectroscopy. A method for heat-treating silica glass is also provided, which comprises holding silica glass to be heat-treated in an atmosphere at a tem…
Who is the assignee on this patent?
Agc Inc
What technology area does this patent fall under?
Primary CPC classification C03B37/02727. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Aug 06 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).