Microelectromechanical device, a microelectromechanical system, and a method of manufacturing a microelectromechanical device

Patent metadata

Field	Value
Publication number	US-10370242-B2
Application number	US-201715662389-A
Country	US
Kind code	B2
Filing date	Jul 28, 2017
Priority date	Jul 29, 2016
Publication date	Aug 6, 2019
Grant date	Aug 6, 2019

Abstract

A microelectromechanical device, a microelectromechanical system, and a method of manufacturing a microelectromechanical device, wherein the microelectromechanical device may include: a substrate; a diaphragm mounted to the substrate; a first electrode mounted to the diaphragm; a second electrode mounted to the substrate; wherein the first electrode is laterally adjacent to the second electrode; and wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.

First claim

What is claimed is:

1. A microelectromechanical device comprising:
a substrate;
a diaphragm mounted to the substrate;
a first electrode mounted to the diaphragm, the first electrode comprising a plurality of first fingers having a cross-sectional height greater than a cross-sectional width both taken perpendicular to a longest dimension of a first finger of the plurality of first fingers;
a second electrode mounted to the substrate, the second electrode comprising a plurality of second fingers having a cross-sectional height greater than a cross-sectional width both taken perpendicular to a longest dimension of a second finger of the plurality of second fingers;
wherein the first electrode is laterally adjacent to the second electrode and the plurality of first fingers and the plurality of second fingers are interdigitated; and
wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.

2. The microelectromechanical device of claim 1 , further comprising:
a third electrode mounted to either side of the diaphragm or the substrate,
wherein the third electrode is laterally adjacent to the first electrode or the second electrode.

3. The microelectromechanical device of claim 2 ,
wherein the gap between the first electrode and the second electrode is less than a distance from the first electrode to the third electrode and a distance from the second electrode to the third electrode.

4. The microelectromechanical device of claim 1 ,
wherein the first electrode is arranged a first distance from the diaphragm and the second electrode is arranged a second distance from the diaphragm, and wherein the first distance is different from the second distance.

5. The microelectromechanical device of claim 1 ,
wherein each finger of the plurality of first fingers and each finger of the plurality of second fingers are equidistant to each other.

6. The microelectromechanical device of claim 1 , wherein the plurality of first fingers and the plurality of second fingers comprise:
adjacent fingers having a first distance between each other and further adjacent fingers having a second distance between each other;
wherein the first distance is different than the second distance.

7. The microelectromechanical device of claim 1 ,
wherein each finger of the plurality of first fingers is arranged off-centered between two fingers of the plurality of second fingers.

8. The microelectromechanical device of claim 1 ,
wherein the plurality of first fingers and the plurality of second fingers comprise:
at least one pair of first fingers of the plurality of first fingers adjacent to each other and
at least one pair of second fingers of the plurality of second fingers adjacent to each other.

9. The microelectromechanical device of claim 1 ,
wherein each finger of the plurality of first fingers and each finger of the plurality of second fingers are parallel with each other.

10. The microelectromechanical device of claim 1 ,
wherein each finger of the plurality of first fingers and each finger of the plurality of second fingers is arranged radially with respect to a common vertical axis.

11. The microelectromechanical device of claim 1 ,
wherein the plurality of first fingers and the plurality of second fingers are interdigitated in a concentric shell profile with respect to a common vertical axis.

12. The microelectromechanical device of claim 1 ,
wherein the first electrode is integral with the diaphragm.

13. The microelectromechanical device of claim 1 ,
wherein the first electrode further comprises at least one via coupling the first electrode to the diaphragm.

14. The microelectromechanical device of claim 1 ,
wherein the second electrode further comprises a structure coupling the second electrode to the substrate, wherein the structure is pre-stressed to displace the second electrode in a vertical direction.

15. The microelectromechanical device of claim 1 ,
wherein the second electrode further comprises a spring coupling the second electrode to the substrate to further displace the second electrode in a vertical direction.

16. A microelectromechanical system comprising:
the microelectromechanical device of claim 1 and
a circuit electrically coupled to the first electrode and the second electrode, the circuit configured to detect a movement of the first electrode and the second electrode relative to each other and to output a signal representing the movement.

17. The microelectromechanical system of claim 16 ,
wherein the circuit is further configured to provide a potential to at least one of the first electrode and the second electrode.

18. A microelectromechanical device comprising:
a substrate;
a diaphragm mounted to the substrate;
a first electrode mounted to the diaphragm, the first electrode comprising a plurality of first fingers;
a second electrode mounted to the substrate, the second electrode comprising a plurality of second fingers;
wherein the first electrode is laterally adjacent to the second electrode and the plurality of first fingers and the plurality of second fingers are interdigitated;
wherein the plurality of first fingers and the plurality of second fingers comprise:
adjacent fingers having a first distance between each other and further adjacent fingers having a second distance between each other;
wherein the first distance is different than the second distance;

and
wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.

19. A microelectromechanical device comprising:
a substrate;
a diaphragm mounted to the substrate;
a first electrode mounted to the diaphragm, the first electrode comprising a plurality of first fingers;
a second electrode mounted to the substrate, the second electrode comprising a plurality of second fingers;
wherein the first electrode is laterally adjacent to the second electrode and the plurality of first fingers and the plurality of second fingers are interdigitated;
wherein each finger of the plurality of first fingers and each finger of the plurality of second fingers is arranged radially with respect to a common vertical axis; and
wherein the diaphragm is arranged over a gap between the first electrode and the second electrode.

Assignees

• Infineon Technologies Ag

Inventors

• Dehe Alfons
• Herrmann Matthias Friedrich
• Manz Johannes

Classifications

• B81C3/001

  Bonding of two components · CPC title

• B81B2201/033

  Comb drives · CPC title

• B81B2201/0257

  Microphones or microspeakers · CPC title

• B81B7/02 Primary

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

• B81B7/0009

  Structural features, others than packages, for protecting a device against environmental influences (B81C1/00777 takes precedence) · CPC title