Manufacturable laser diode

Patent metadata

Field	Value
Publication number	US-10367334-B2
Application number	US-201615176076-A
Country	US
Kind code	B2
Filing date	Jun 7, 2016
Priority date	Feb 10, 2014
Publication date	Jul 30, 2019
Grant date	Jul 30, 2019

Abstract

A method for manufacturing a laser diode device includes providing a substrate having a surface region and forming epitaxial material overlying the surface region, the epitaxial material comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active layer region. The epitaxial material is patterned to form a plurality of dice, each of the dice corresponding to at least one laser device, characterized by a first pitch between a pair of dice, the first pitch being less than a design width. Each of the plurality of dice are transferred to a carrier wafer such that each pair of dice is configured with a second pitch between each pair of dice, the second pitch being larger than the first pitch.

First claim

What is claimed is:

1. An intermediate structure of a laser device, comprising:
an epitaxial structure comprising an n-type cladding region, an active region comprising at least one active layer overlying the n-type cladding region, and a p-type cladding region overlying the active region;
a gallium and nitrogen containing substrate; and
a single sacrificial region disposed between the n-type cladding region of the epitaxial structure and the gallium and nitrogen containing substrate, the single sacrificial region having a narrower lateral width than each of the n-type cladding region, the active region, and the p-type cladding region.

2. The intermediate structure of claim 1 wherein the epitaxial structure comprises at least one of GaN, AlN, InN, InGaN, AlGaN, InAlN, InAlGaN, or one or more of AlAs, GaAs, GaP, InP, AlP, AlGaAs, AlInAs, InGaAs, AlGaP, AlInP, InGaP, AlInGaP, AlInGaAs, or AlInGaAsP.

Assignees

• Soraa Laser Diode Inc

Inventors

• Mclaurin Melvin
• Sztein Alexander
• Hsu Po Shan
• Goutain Eric
• Steigerwald Dan
• Raring James W

Classifications

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5363

  the connected ends being wedge-shaped · CPC title

• H10W72/536

  the connected ends being ball-shaped · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W72/073

  of die-attach connectors · CPC title