Method of forming superconducting wiring layers with low magnetic noise
US-2018219150-A1 · Aug 2, 2018 · US
Shadow mask sidewall tunnel junction for quantum computing
US10367134B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10367134-B2 |
| Application number | US-201715616193-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 7, 2017 |
| Priority date | Jun 7, 2017 |
| Publication date | Jul 30, 2019 |
| Grant date | Jul 30, 2019 |
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- Title
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Abstract
Official abstract text for this publication.
A technique relates to forming a sidewall tunnel junction. A first conducting layer is formed using a first shadow mask evaporation. A second conducting layer is formed on a portion of the first conducting layer, where the second conducting layer is formed using a second shadow mask evaporation. An oxide layer is formed on the first conducting layer and the second conducting layer. A third conducting layer is formed on part of the oxide layer, such that the sidewall tunnel junction is positioned between the first conducting layer and the third conducting layer.
First claim
Opening claim text (preview).
What is claimed is: 1. A tunnel junction device comprising: a first conducting layer having a height dimension greater than a width dimension, wherein a bottom of the first conducting layer is nearest to a substrate and a top of the first conducting layer is farthest from the substrate, wherein the height dimension extends vertically from the bottom to the top; an oxide layer formed on the first conducting layer; and a second conducting layer on the oxide layer covering a side portion of the first conducting layer, such that the oxide layer forms a sidewall tunnel junction between the second conducting layer and the side portion of the first conducting layer, wherein an angled portion of the second conducting layer is formed on a top of the first conducting layer such that an angled tunnel junction is formed, wherein the angled portion having a triangular shaped surface positioned to the angled tunnel junction. 2. The tunnel junction device of claim 1 , wherein the oxide layer covers a top portion of the first conducting layer, such that the sidewall tunnel junction is also formed between the second conducting layer and the top portion of the first conducting layer. 3. The tunnel junction device of claim 1 , wherein the oxide layer covers another side portion of the first conducting layer, the another side portion being opposite the side portion. 4. The tunnel junction device of claim 3 , wherein the second conducting layer is absent from the oxide layer covering the another side portion of the first conducting layer. 5. The tunnel junction device of claim 1 , wherein the first and second conducting layers are superconducting materials. 6. The tunnel junction device of claim 1 , wherein a patch of the second conducting layer is formed on the substrate opposite the sidewall tunnel junction.
Assignees
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Classifications
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Electricity · mapped topic
Quantum computing, i.e. information processing based on quantum-mechanical phenomena · CPC title
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Frequently asked questions
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- What does patent US10367134B2 cover?
- A technique relates to forming a sidewall tunnel junction. A first conducting layer is formed using a first shadow mask evaporation. A second conducting layer is formed on a portion of the first conducting layer, where the second conducting layer is formed using a second shadow mask evaporation. An oxide layer is formed on the first conducting layer and the second conducting layer. A third cond…
- Who is the assignee on this patent?
- IBM
- What technology area does this patent fall under?
- Primary CPC classification H01L39/223. Mapped technology areas include Electricity.
- When was this patent published?
- Publication date Tue Jul 30 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
- What related patents are in patentsdb?
- We list 5 related publications on this page (citations in our corpus or others sharing the same primary CPC).