Surface mount electronic component

Patent metadata

Field	Value
Publication number	US-10366830-B2
Application number	US-201815904804-A
Country	US
Kind code	B2
Filing date	Feb 26, 2018
Priority date	Feb 27, 2017
Publication date	Jul 30, 2019
Grant date	Jul 30, 2019

Abstract

A surface mount electronic component includes an element including a dielectric layer that includes a first main surface and a second main surface, a first external electrode disposed on the first main surface, a second external electrode disposed on the second main surface, a first metal terminal connected to the first external electrode, a second metal terminal connected to the second external electrode, and an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals. Upper and lower surfaces of the exterior material are flat or substantially flat.

First claim

What is claimed is:

1. A surface mount electronic component comprising:
an element including a dielectric layer including a first main surface and a second main surface;
a first external electrode disposed on the first main surface;
a second external electrode disposed on the second main surface;
a first metal terminal connected to the first external electrode;
a second metal terminal connected to the second external electrode; and
an exterior material covering at least a portion of the element, the first and second external electrodes, and the first and second metal terminals; wherein
upper and lower surfaces of the exterior material are flat or substantially flat;
the first metal terminal includes:
a first bonding portion connected to the first external electrode;
a first extending portion connected to the first bonding portion and extending in a direction parallel or substantially parallel to the first main surface with a space from the first main surface;
a second extending portion connected to the first extending portion and extending towards the element;
a third extending portion connected to the second extending portion and extending in the direction parallel or substantially parallel to the first main surface;
a fourth extending portion connected to the third extending portion and extending in a mounting direction; and
a first mounting portion connected to the fourth extending portion and mounted on a mounting substrate;

the second metal terminal includes:
a second bonding portion connected to the second external electrode;
a fifth extending portion connected to the second bonding portion and extending in a direction parallel or substantially parallel to the second main surface with a space from the second main surface;
a sixth extending portion connected to the fifth extending portion and extending towards the element;
a seventh extending portion connected to the sixth extending portion and extending in the direction parallel or substantially parallel to the second main surface;
an eighth extending portion connected to the seventh extending portion and extending in the mounting direction; and
a second mounting portion connected to the eighth extending portion and mounted on the mounting substrate;

in the first bonding portion, a distal end of the first bonding portion is disposed in a direction away from the first main surface from an intermediate portion of the first bonding portion towards the distal end, and the first bonding portion is in surface contact with the first external electrode at the intermediate portion located on an opposite side of the distal end;
a first cut-out portion is provided in a portion in which the second extending portion of the first metal terminal and the third extending portion of the first metal terminal intersect with each other;
the second bonding portion includes a bifurcated distal end and is in surface contact with the second external electrode at the bifurcated portion;
a second cut-out portion is provided in the fifth extending portion of the second metal terminal;
a third cut-out portion is provided in a portion in which the sixth extending portion of the second metal terminal and the seventh extending portion of the second metal terminal intersect with each other; and
the first, second and third cut-out portions are covered with the exterior material.

2. The surface mount electronic component according to claim 1 , wherein
the first external electrode and the first metal terminal are connected by a bonding material;
the second external electrode and the second metal terminal are connected by the bonding material; and
the bonding material is a lead-free solder.

3. The surface mount electronic component according to claim 2 , wherein the lead-free solder is a Sn-10Sb to Sn-15Sb alloy solder.

4. The surface mount electronic component according to claim 1 , wherein the first external electrode and the second external electrode include a first electrode layer made of a Ni—Ti alloy and a second electrode layer made of Cu.

5. The surface mount electronic component according to claim 4 , wherein each of the first external electrode and the second external electrode includes two of the first electrode layers and two of the second electrode layers that are alternately arranged.

6. The surface mount electronic component according to claim 4 , wherein a thickness of each of the first and second electrode layers is not less than about 0.1 μm and not more than about 0.35 μm.

7. The surface mount electronic component according to claim 1 , wherein the exterior material is made of a thermosetting epoxy resin.

8. The surface mount electronic component according to claim 1 , wherein
the element has a disk shape;
a diameter of an outer shape of the element is not less than about 3.4 mm and not more than about 5.0 mm; and
a thickness t of the element is not less than about 0.90 mm and not more than about 0.95 mm.

9. The surface mount electronic component according to claim 1 , wherein the element includes a single ceramic plate.

10. The surface mount electronic component according to claim 1 , wherein the element is made of a dielectric ceramic primarily including at least one of BaTiO 3 , CaTiO 3 , SrTiO 3 , and CaZrO 3 .

11. The surface mount electronic component according to claim 1 , wherein the element is a capacitor.

12. The surface mount electronic component according to claim 1 , wherein
the element has a disk shape;
a diameter of an outer shape of the element is not less than about 3.0 mm and not more than about 6.0 mm; and
a thickness t of the element is not less than about 0.80 mm and not more than about 1.2 mm.

13. The surface mount electronic component according to claim 1 , wherein each of the first and second external electrodes is made of at least one of Cu, Ni, Cr, Ag, Pd, Au, Ti, Ag—Pd alloy, Cu—Ni alloy, Cu—Ti alloy, Ni—Cr alloy, and Ni—Ti alloy.

14. The surface mount electronic component according to claim 1 , wherein a thickness of each of the first and second external electrodes is not less than about 0.7 μm and not more than about 1.2 μm.

15. The surface mount electronic component according to claim 1 , wherein each of the first and second metal terminals includes a terminal body and a plating film provided on a surface of the terminal body.

16. The surface mount electronic component according to claim 15 , wherein the terminal body is made of Ni, Fe, Cu, Ag, Cr, or an alloy primarily including one or more of Ni, Fe, Cu, Ag, and Cr.

17. The surface mount electronic component according to claim 15 , wherein a thickness of the terminal body is not less than about 0.05 mm and not more than about 0.5 mm.

18. The surface mount electronic component according to claim 15 , wherein the plating film includes a lower plating film provided on a surface of the terminal body and an upper plating film provided on a surface of the lower plating film.

19. The surface mount electronic component according to claim 18 , wherein the lower layer plating film is made of Ni, Fe, Cu, Ag, Cr, or an alloy primarily including one or more of Ni, Fe, Cu, Ag, and Cr.

20. The surface mount electronic component according to claim 18 , wherein the upper layer plating film is made of Sn, Ag, Au, or an alloy primarily including one or more of Sn, Ag, and Au.

Assignees

• Murata Manufacturing Co

Inventors

• Fukuda Masaki
• Fukada Yuji
• Furui Jinya
• Inoue Takashi
• Yamamoto Takashi

Classifications

• H01G4/1272

  Semiconductive ceramic capacitors · CPC title

• H01C7/008

  Thermistors (H01C7/02 - H01C7/06 take precedence) · CPC title

• H01G4/01

  Form of self-supporting electrodes · CPC title

• H01G4/1218

  based on titanium oxides or titanates (H01G4/1245 takes precedence) · CPC title

• H01C7/003

  Thick film resistors · CPC title