Electrochemical plating methods
US-2015357195-A1 · Dec 10, 2015 · US
US2016273120A1 · US · A1
| Field | Value |
|---|---|
| Publication number | US-2016273120-A1 |
| Application number | US-201414777706-A |
| Country | US |
| Kind code | A1 |
| Filing date | Feb 18, 2014 |
| Priority date | Mar 18, 2013 |
| Publication date | Sep 22, 2016 |
| Grant date | — |
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There is provided a silver-plated product wherein a surface layer of silver is formed on the surface of an underlying layer of nickel formed on a base material, the silver-plated product having a good bendability. In a silver-plated product which comprises a base material of copper or a copper alloy, an underlying layer of nickel formed on the base material, and a surface layer of silver formed on the surface of the underlying layer, the surface layer having a thickness of 10 μm or less, the thickness of the underlying layer is 2 μm or less, preferably 1.5 μm or less, and the area fraction in {200} orientation of the surface layer is 15% or more, preferably 25% or more.
Opening claim text (preview).
1 . A silver-plated product comprising: a base material; an underlying layer of nickel which is formed on the base material; and a surface layer of silver which is formed on a surface of the underlying layer, wherein the underlying layer has a thickness of 2 μm or less, and an area fraction in {200} orientation of the surface layer is 15% or more. 2 . A silver-plated product as set forth in claim 1 , wherein said base material is made of copper or a copper alloy. 3 . A silver-plated product as set forth in claim 1 , wherein said surface layer has a thickness of 10 μm or less. 4 . A contact or terminal part which is made of a silver-plated product as set forth in any one of claims 1 through 3.
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