Cutting apparatus

US10361102B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10361102-B2
Application numberUS-201815875242-A
CountryUS
Kind codeB2
Filing dateJan 19, 2018
Priority dateJan 20, 2017
Publication dateJul 23, 2019
Grant dateJul 23, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the dresser board is cut. The elastic wave detection sensor produces an output signal representing the detected elastic wave when the cutting blade cuts the dresser board and is dressed thereby, the output signal being variable as the cutting blade is progressively dressed by the dresser board. A control unit stores in advance, as a threshold value, the value of the output signal when the dressing of the cutting blade is completed. The control unit stops cutting the dresser board with the cutting blade and finishes the dressing of the cutting blade when the output signal produced by the elastic wave detection sensor reaches the threshold value.

First claim

Opening claim text (preview).

What is claimed is: 1. A cutting apparatus comprising: a holding table for holding a plate-shaped workpiece; a cutting unit including a cutting blade that has a cutting edge for cutting the plate-shaped workpiece held on said holding table; a cutting-feed unit for cutting-feeding said holding table and said cutting unit relatively to each other in cutting-feed directions; an indexing-feed unit for indexing-feeding said holding table and said cutting unit relatively to each other in indexing-feed directions perpendicular to said cutting-feed directions; an elastic wave detection sensor disposed in either one of said cutting unit and said holding table, for detecting an elastic wave produced when the plate-shaped workpiece held on said holding table is cut by said cutting blade; and a control unit for controlling said cutting-feed unit and said indexing-feed unit, wherein said elastic wave detection sensor produces an output signal representing the detected elastic wave when said cutting blade cuts a dresser board held on said holding table and is dressed thereby, said output signal being variable as said cutting blade is progressively dressed by said dresser board, and said control unit includes a storage unit that stores in advance, a threshold value, which is a previously determined value corresponding to an output signal produced by said elastic wave detection sensor when the dressing of said cutting blade is completed, and said control unit stops cutting said dresser board with said cutting blade and finishes the dressing of said cutting blade on the dresser board held on said holding table when the output signal produced by said elastic wave detection sensor reaches the threshold value stored in said storage unit.

Assignees

Inventors

Classifications

  • Process monitoring, e.g. flow or thickness monitoring · CPC title

  • for supporting or gripping · CPC title

  • Apparatus for mechanical treatment or grinding or cutting · CPC title

  • H10P52/00Primary

    Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

  • Computer numerical control means · CPC title

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Frequently asked questions

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What does patent US10361102B2 cover?
A cutting apparatus includes a cutting unit including a cutting blade that has a cutting edge for cutting a dresser board. An elastic wave detection sensor is disposed in the cutting unit, for detecting an elastic wave produced when the dresser board is cut. The elastic wave detection sensor produces an output signal representing the detected elastic wave when the cutting blade cuts the dresser…
Who is the assignee on this patent?
Disco Corp
What technology area does this patent fall under?
Primary CPC classification H10P72/0428. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jul 23 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).