Resin, and arf dry photoresist composition comprising same and application
US-2024302749-A1 · Sep 12, 2024 · US
US10359698B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10359698-B2 |
| Application number | US-59215609-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 19, 2009 |
| Priority date | Nov 19, 2008 |
| Publication date | Jul 23, 2019 |
| Grant date | Jul 23, 2019 |
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New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprises one or more materials that have hetero-substituted carbocyclic aryl groups. Particularly preferred photoresists of the invention can exhibit reduced leaching of resist materials into an immersion fluid contacting the resist layer during immersion lithography processing.
Opening claim text (preview).
What is claimed is: 1. A method for processing a photoresist composition, comprising: (a) applying on a substrate a layer of a photoresist composition comprising: (i) one or more resins, (ii) a photoactive component, and (iii) one or more materials that are distinct from and substantially non-mixable with the one or more resins, and the one or more materials comprise 1) hetero-substituted multi-ring carbocyclic aryl groups and 2) one or more C(OH)(CF 3 ) 2 moieties; and (b) immersion exposing the photoresist composition layer to radiation activating for the photoresist composition wherein immersion fluid directly contacts the photoresist composition layer; wherein the one or more materials migrate to top or upper portions of the photoresist coating layer. 2. The method of claim 1 wherein the one or more materials (iii) comprise resins that comprise hetero-substituted multi-ring carbocyclic aryl groups. 3. The method of claim 2 wherein the one or more resins (iii) comprise hydroxy naphthyl groups. 4. The method of claim 1 , wherein the one or more substantially non-mixable materials comprise one or more photoacid labile groups. 5. A method for processing a photoresist composition, comprising: (a) applying on a substrate a layer of a photoresist composition comprising: (i) one or more resins, (ii) a photoactive component, and (iii) one or more materials that are distinct from and substantially non-mixable with the one or more resins, and the one or more materials comprise 1) hetero-substituted multi-ring carbocyclic aryl groups, 2) one or more C(OH)(CF 3 ) 2 moieties and 3) silicon substitution; and (b) immersion exposing the photoresist composition layer to radiation activating for the photoresist composition wherein immersion fluid directly contacts the photoresist composition layer. 6. The method of claim 5 , wherein the one or more substantially non-mixable materials comprise one or more photoacid labile groups. 7. A method for processing a photoresist composition, comprising: (a) applying on a substrate a layer of a photoresist composition comprising: (i) one or more resins, (ii) a photoactive component, and (iii) one or more resins that (1) are distinct from and substantially non-mixable with the (i) one or more resins, and (2) comprise 1) hetero-substituted multi-ring carbocyclic aryl groups, and 2) one or more C(OH)(CF 3 ) 2 groups; and (b) immersion exposing the photoresist composition layer to radiation activating for the photoresist composition wherein immersion fluid directly contacts the photoresist composition layer; wherein the one or more materials migrate to top or upper portions of the photoresist coating layer. 8. The method of claim 7 wherein the (iii) one or more resins comprise hydroxyl naphthyl.
the macromolecular compound being present in a chemically amplified negative photoresist composition · CPC title
in the presence of a fluid, e.g. immersion; using fluid cooling means · CPC title
with perfluoro compounds, e.g. for dry lithography (G03F7/0048 takes precedence) · CPC title
with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors · CPC title
characterised by the solvents or agents facilitating spreading, e.g. tensio-active agents · CPC title
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