Light emitting diode chip having a small area and slim thickness, light emitting device and electronic device including the same

Patent metadata

Field	Value
Publication number	US-10359153-B2
Application number	US-201816166159-A
Country	US
Kind code	B2
Filing date	Oct 22, 2018
Priority date	Oct 16, 2015
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

A light emitting diode chip includes: a first conductive type semiconductor layer disposed on a substrate; a mesa disposed on the first conductive type semiconductor layer and including an active layer and a second conductive type semiconductor layer; at least one groove disposed on a side surface of the mesa forming a concave region; an extension electrode forming ohmic contact with the first conductive type semiconductor layer in the concave region; an insulation layer covering the extension electrode, the first conductive type semiconductor layer, and the mesa, and including at least one first opening exposing the extension electrode and a second opening; a first pad electrode disposed on the insulation layer and electrically connected to the first conductive type semiconductor layer through the first opening; and a second pad electrode disposed on the insulation layer and electrically connected to the second conductive type semiconductor layer through the second opening.

First claim

What is claimed is:

1. A light-emitting device, comprising:
a substrate comprising an edge side at a periphery;
a semiconductor stack on the substrate and comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer;
a via through the second semiconductor layer and the active layer to expose a second surface of the first semiconductor layer;
a first pad electrode covering the via and contacting a upper surface of the first semiconductor layer; and
a insulation layer comprising a first opening exposing the first semiconductor layer and a second opening exposing the second semiconductor layer;
wherein the substrate comprises a surface exposed around the semiconductor stack and an edge side,
wherein the first semiconductor layer comprises a first outside wall,
wherein the second semiconductor layer comprises a second outside wall,
wherein the insulation layer covers the first outside wall of the first semiconductor layer and the second outside wall of the second semiconductor layer, and contacts the surface of the substrate exposed around the semiconductor stack,
wherein the insulation layer comprises a portion contacting the surface of the substrate, and wherein the portion of the insulating layer comprises an edge side, and
wherein the edge side of the substrate is spaced apart from the edge side of the insulating layer.

2. A light emitting device comprising:
a substrate;
a semiconductor stack on the substrate and comprising a first semiconductor layer, a second semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer;
an insulation layer covering the first semiconductor layer and the second semiconductor layer, the insulation layer comprising at least one first opening exposing the first semiconductor layer and a second opening disposed on the second semiconductor layer;
at least one groove disposed on a side surface of the active layer and the second semiconductor layer forming a concave region; and
a first electrode disposed on the insulation layer and electrically connected to the first semiconductor layer through the first opening;
wherein the first opening of the insulation layer comprises a first region and a second region, and
wherein the first region is located in the groove and the second region is outside of the groove.

3. The light emitting device of claim 1 , wherein the substrate having a plurality of protrusions on the surface of the substrate.

4. The light emitting device of claim 3 , wherein an edge side of the insulation layer located on the one of plurality of protrusions.

5. The light emitting device of claim 1 , wherein the insulation layer comprises dielectric material.

6. The light emitting device of claim 5 , wherein the insulation layer comprises an interface layer and a plurality of dielectric layers, the dielectric layers disposed on the interface layer.

7. The light emitting device of claim 6 , wherein the interface layer having a thickness of about 0.2 μm to about 1.0 μm.

8. The light emitting device of claim 6 , wherein the plurality of dielectric layers has a reflectivity of 90% or higher with respect to light having an angle of incidence of 0° to 60° at a wavelength of 400 nm to 700 nm.

9. The light emitting device of claim 1 , further comprising a contact electrode between the insulation layer and the second semiconductor layer, the contact electrode comprises indium tin oxide (ITO).

10. The light emitting device of claim 2 , wherein the first electrode covers the first region of the first opening.

11. The light emitting device of claim 10 , further comprising a second electrode disposed on the insulation layer and electrically connected to the second semiconductor layer through the second opening.

12. The light emitting device of claim 2 , further comprising a contact electrode between the insulation layer and the second semiconductor layer, the contact electrode comprises indium tin oxide(ITO).

13. The light emitting device of claim 12 , the second opening of the insulation layer exposes the portion of the contact electrode.

14. The light emitting device of claim 2 , further comprising a wavelength conversion part disposed on the substrate.

15. The light emitting device of claim 14 , the wavelength conversion part comprises a transparent resin and phosphor particles, wherein the phosphor particles are uniformly dispersed in the transparent resin or the phosphor particles are concentrated in a region under the wavelength conversion part.

16. The light emitting device of claim 2 , the insulation layer covers an edge side of the first semiconductor layer.

17. The light emitting device of claim 2 , wherein the active layer and the second semiconductor layer further comprise a through-hole exposing the first conductive type semiconductor layer,
the insulation layer further comprises an opening exposing the first conductive type semiconductor layer in the through-hole, and
the first pad electrode is electrically connected to the first conductive type semiconductor layer through the through-hole.

Assignees

• Seoul Viosys Co Ltd

Inventors

• Kim Ye Seul
• Kim Kyoung Wan
• Woo Sang Won
• Kim Ji Hye

Classifications

• H10W74/15

  on active surfaces of flip-chip devices, e.g. underfills · CPC title

• H10W90/00

  Package configurations · CPC title

• H01L33/42

  Electricity · mapped topic

• H01L33/0033

  Electricity · mapped topic

• H01L33/46

  Electricity · mapped topic