Nickel solution for forming film and film-forming method using same

Patent metadata

Field	Value
Publication number	US-10358734-B2
Application number	US-201415026366-A
Country	US
Kind code	B2
Filing date	Oct 2, 2014
Priority date	Oct 3, 2013
Publication date	Jul 23, 2019
Grant date	Jul 23, 2019

Abstract

A nickel solution for forming a film that can suppress generation of hydrogen gas between a solid electrolyte membrane and a substrate while the solid electrolyte membrane and the substrate are brought into contact with each other. The pH of the nickel solution for forming a film is in the range of 4.2 to 6.1. The nickel solution for forming a film further contains a pH buffer solution that has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film.

First claim

The invention claimed is:

1. A method for forming a nickel film comprising:
disposing a solid electrolyte membrane between an anode and a substrate that functions as a cathode,
bringing a nickel solution containing a pH buffer solution into contact with the solid electrolyte membrane, thereby supplying nickel ions to the solid electrolyte membrane,
bringing the solid electrolyte membrane into contact with the substrate, and
applying a voltage across the anode and the substrate to deposit nickel onto a surface of the substrate from the nickel ions contained in the nickel solution in the solid electrolyte membrane to form a nickel film containing the nickel on the surface of the substrate, wherein
a pH of the nickel solution is in a range of 4.2 to 6.1,
wherein the pH buffer solution has a buffer function in the range of the pH and does not form insoluble salts or complexes with the nickel ions during formation of the film,
the pH buffer solution is an acetic acid-acetate buffer solution or a succinic acid-succinate buffer solution and the pH buffer solution contains no sodium ions or potassium ions, and
wherein the nickel ions in the nickel solution move through the solid electrolyte membrane from a side of the solid electrolyte membrane facing the anode to a side of the solid electrolyte membrane facing the cathode.

2. The method according to claim 1 , wherein cations contained in the pH buffer solution are nickel ions or ions of metal with lower ionization tendency than nickel.

3. The method according to claim 1 , wherein the pH buffer solution is one of an acetic acid-nickel acetate buffer solution or a succinic acid-nickel succinate buffer solution.

4. The method according to claim 1 , further comprising flowing the nickel solution containing the pH buffer solution to the inside of the anode.

5. The method according to claim 1 , wherein the anode is porous.

6. The method according to claim 1 , wherein the solid electrolyte membrane is impregnated with nickel ions.

7. The method according to claim 1 , wherein the solid electrolyte membrane is a fluorine-based resin, a hydrocarbon-based resin, a polyamic acid resin, or a resin with an ion exchange function.

8. The method according to claim 1 , wherein the solid electrolyte membrane has a recess that covers the surface of the anode facing the solid electrolyte membrane.

Assignees

• Toyota Motor Co Ltd

Inventors

• Hiraoka Motoki
• Yanagimoto Hiroshi
• Sato Yuki
• SHIMMEI Yoshitaka
• Akamatsu Kensuke

Classifications

• H10P14/47

  Electrolytic deposition, i.e. electroplating; Electroless plating · CPC title

• C25D7/12

  Semiconductors · CPC title

• C25D17/002

  Cell separation, e.g. membranes, diaphragms · CPC title

• H01L21/2885

  Electricity · mapped topic

• C25D3/00

  Electroplating: Baths therefor · CPC title