Electronic component containing substrate

Patent metadata

Field	Value
Publication number	US-10356908-B2
Application number	US-201715444425-A
Country	US
Kind code	B2
Filing date	Feb 28, 2017
Priority date	Sep 1, 2014
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

An electronic component containing substrate includes a substrate, a first electronic component mounted on a main surface of the substrate, and an embedment layer provided on the main surface of the substrate and embedding the first electronic component. The first electronic component is a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion and a first side portion and a second side portion between which the layered portion lies and having two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other. The first side portion is located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular to the main surface of the substrate. The embedment layer is smaller in elastic modulus than the substrate.

First claim

What is claimed is:

1. An electronic component containing substrate comprising:
a substrate;
a first electronic component mounted on a main surface of the substrate; and
an embedment layer provided on the main surface of the substrate and embedding the first electronic component;
the first electronic component including a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion including a ceramic dielectric layer and an internal electrode which are alternately layered and a first side portion and a second side portion between which the layered portion is located and including two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other and an external electrode connected to the internal electrode and provided on a surface of the ceramic multilayer body;
the first side portion being located between the layered portion and the main surface of the substrate in a direction of thickness which is a direction perpendicular or substantially perpendicular to the main surface of the substrate; and
the embedment layer being lower in elastic modulus than the substrate; wherein
the electronic component containing substrate includes a central plane located at a position in the direction of thickness where the central plane passes through the ceramic multilayer body and portions above and under the central plane in the direction of thickness of the electronic component containing substrate mutually cancel vibrations.

2. The electronic component containing substrate according to claim 1 , wherein in the direction of thickness, the first side portion of the ceramic multilayer body is greater in thickness than the second side portion.

3. The electronic component containing substrate according to claim 1 , wherein
the first electronic component includes an electrode terminal connected to the external electrode; and
the electrode terminal is connected to the substrate.

4. The electronic component containing substrate according to claim 1 , wherein
the first electronic component further includes an interposer located between the first side portion and the substrate; and
the interposer is connected to the substrate.

5. The electronic component containing substrate according to claim 1 , wherein in the direction of thickness, the central plane of the electronic component containing substrate is located between a central plane of the layered portion of the first electronic component and the second side portion of the ceramic multilayer body.

6. The electronic component containing substrate according to claim 1 , further comprising a second electronic component mounted on the main surface of the substrate and embedded in the embedment layer; wherein
the second electronic component includes a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion including a ceramic dielectric layer and an internal electrode which are alternately layered and a pair of side portions between which the layered portion lies and including two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other and an external electrode connected to the internal electrode and provided on a surface of the ceramic multilayer body;
one of the side surfaces of the ceramic multilayer body of the first electronic component and one of the side surfaces of the ceramic multilayer body of the second electronic component are opposed to each other with the embedment layer being interposed;
in the direction of thickness which is the direction perpendicular to the main surface of the substrate, an interval between a central plane of the layered portion of the first electronic component and the main surface of the substrate is greater than an interval between a central plane of the layered portion of the second electronic component and the main surface of the substrate; and
in the direction of thickness, a central plane of the electronic component containing substrate is located between the central plane of the layered portion of the first electronic component and the central plane of the layered portion of the second electronic component.

7. The electronic component containing substrate according to claim 6 , wherein in the direction of thickness, an interval between the central plane of the layered portion of the first electronic component and the central plane of the electronic component containing substrate is smaller than an interval between the central plane of the layered portion of the second electronic component and the central plane of the electronic component containing substrate.

8. The electronic component containing substrate according to claim 1 , further comprising a second electronic component mounted on the main surface of the substrate and embedded in the embedment layer; wherein
the second electronic component includes a multilayer ceramic capacitor including a ceramic multilayer body including a layered portion including a ceramic dielectric layer and an internal electrode which are alternately layered and a pair of side portions between which the layered portion lies and including two end surfaces opposed to each other and side surfaces connecting the two end surfaces to each other and an external electrode connected to the internal electrode and provided on a surface of the ceramic multilayer body;
one of the side surfaces of the ceramic multilayer body of the first electronic component and one of the side surfaces of the ceramic multilayer body of the second electronic component are opposed to each other with the embedment layer being interposed; and
a direction of layering of the ceramic dielectric layer and the internal electrode in the ceramic multilayer body of the first electronic component is perpendicular or substantially perpendicular to a direction of layering of the ceramic dielectric layer and the internal electrode in the ceramic multilayer body of the second electronic component.

9. The electronic component containing substrate according to claim 8 , wherein the first electronic component and the second electronic component are directly connected to each other through a conductive pattern.

10. The electronic component containing substrate according to claim 8 , wherein with the main surface of the substrate being defined as a reference surface, a height of a center of the layered portion of the first electronic component is intermediate between a height of a lowest portion and a height of a highest portion of the layered portion of the second electronic component and a height of a center of the layered portion of the second electronic component is intermediate between a height of a lowest portion and a height of a highest portion of the layered portion of the first electronic component.

11. The electronic component containing substrate according to claim 1 , wherein a surface of the embedment layer includes a recess portion.

12. The electronic component containing substrate according to claim 11 , wherein the recess portion reduces vibration of the substrate which occurs with distortion in the first electronic component caused by application of a voltage in an audible frequency range.

13. The electronic component containing substrate according to claim 12 , wherein the recess portion includes a lowest portion located lower than a center of the layered portion of the first electronic component, with the main surface of the substrate being defined as a reference surface.

14. The electronic component containing substrate according to claim 11 , wherein the recess portion further includes an inserted member being

Assignees

• Murata Manufacturing Co

Inventors

• Hattori Kazuo
• Fujimoto Isamu
• Takahashi Masaru
• Fujii Choichiro
• Adachi Hirobumi

Classifications

• H05K2201/0133

  Elastomeric or compliant polymer · CPC title

• H05K3/4697 Primary

  having cavities, e.g. for mounting components (H05K3/4691 takes precedence) · CPC title

• H05K3/28

  Applying non-metallic protective coatings {(H05K3/0091 takes precedence; methods for intermediate insulating layers for build-up multilayer circuits H05K3/4673)} · CPC title

• H05K1/0271

  Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion · CPC title

• H01G4/005

  Electrodes · CPC title