Encapsulated LED lens with bottom reflectors

Patent metadata

Field	Value
Publication number	US-10355182-B2
Application number	US-201414763873-A
Country	US
Kind code	B2
Filing date	Mar 6, 2014
Priority date	Mar 13, 2013
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

A lens is affixed over an LED die mounted on a substrate to encapsulate the LED die. The lens may have a top surface shaped as a dome or other shape to achieve the desired light pattern. The lens has a cavity for the LED die. A reflector pattern is molded into the bottom surface of the lens, such as one or more facet rings with an angled surface surrounding the LED die. The angled surface of the facet ring reflects the downward or shallow light emission from the LED die upward. A plurality of facet rings of different radii and heights may be formed in the bottom of the lens for shaping the light emission. Any suitable shape of facet may be used. The facet rings may be formed to cause the LED module to emit a narrow beam or other light emission patterns.

First claim

What is claimed is:

1. A light-emitting device, comprising:
a light emitting diode (LED) die mounted on a substrate; and
a solid molded lens surrounding the LED die, the lens having a width that is smaller than a width of the substrate, the lens being affixed to the substrate via an adhesive material, and the lens having a non-flat bottom surface including:
(a) a plurality of angled first surface portions arranged to define a first continuous groove that surrounds the LED die and a second continuous groove that surrounds both the LED die and the first continuous groove, the plurality of angled first surfaces arranged over a substantially flat portion of the substrate; and
(b) a second surface portion surrounding the LED die that is substantially parallel to the substrate, the second surface portion being affixed to the substrate via the adhesive material, the second surface portion being situated between the first continuous groove and the second continuous groove; and

a gap between the plurality of angled first surfaces arranged and the substantially flat portion of the substrate.

2. The light-emitting device of claim 1 , wherein the top surface of the lens is a dome.

3. The light-emitting device of claim 1 , wherein the top surface of the lens is shaped to further redirect light.

4. The light-emitting device of claim 1 , wherein:
the first continuous groove is ring-shaped and defined by two angled first surface portions that are inclined towards one another, and
the second continuous groove is ring-shaped and defined by two different angled first surface portions that are inclined towards one another.

5. The light-emitting device of claim 4 , wherein the first continuous groove has a first height, and the second continuous groove has a second height that is greater than the first height.

6. The light-emitting device of claim 1 , further comprising a third surface portion overlying the LED die that is surrounded by the first groove and the second groove, the third surface portion being integral with the plurality of angled first surface portions and the second surface portion, such that the third surface portion defines at least a portion of a cavity in which the LED die is located, the device further comprising a filling formed in the cavity to encapsulate the LED die.

7. The device of claim 6 , the device further comprising a filling formed in the cavity to encapsulate the LED die, the filling having a first index of refraction that is greater than one of a second index of refraction of the lens and a third index of refraction of the LED die.

8. The device of claim 7 , wherein the filling is also formed of the adhesive material.

9. The light-emitting device of claim 1 , wherein the substrate has a reflective surface.

10. The device of claim 1 , wherein the gap comprises air.

11. A method of operating a light emitting device comprising:
energizing a light emitting diode (LED) die that is mounted on a substrate, the LED die emitting light from a top surface of the LED die as well as from side surfaces of the LED die; and
redirecting at least some of the light emitted by the side surfaces of the LED die by a solid molded lens surrounding the LED die, the lens having a width that is smaller than a width of the substrate, the lens being affixed to the substrate via an adhesive material, and the lens having a non-flat bottom surface including:
(a) a plurality of angled first surface portions arranged to define a first continuous groove that surrounds the LED die and a second continuous groove that surrounds both the LED die and the first continuous groove, and
(b) a second surface portion surrounding the LED die that is substantially parallel to the substrate, the second surface portion being affixed to the substrate via the adhesive material, the second surface portion being situated between the first continuous groove and the second continuous groove; and

a gap between the plurality of angled first surfaces arranged and a substantially flat portion of the substrate.

12. The method of claim 11 , wherein:
the first continuous groove is ring-shaped and defined by two angled first surface portions that are inclined towards one another, and
the second continuous groove is ring-shaped and defined by two different angled first surface portions that are inclined towards one another.

Assignees

• Lumileds Llc

Inventors

• Daeschner Walter
• Diana Frederic Stephane
• Mala Mohiuddin
• Haque Ashim Shatil
• Butterworth Mark Melvin

Classifications

• H10W72/20

  Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps · CPC title

• H01L2224/13

  Electricity · mapped topic

• H01L33/60

  Electricity · mapped topic

• H01L33/58 Primary

  Electricity · mapped topic

• H01L33/54

  Electricity · mapped topic