Optimized configurations to integrate steering diodes in low capacitance transient voltage suppressor (TVS)

Patent metadata

Field	Value
Publication number	US-10354990-B2
Application number	US-201715721883-A
Country	US
Kind code	B2
Filing date	Sep 30, 2017
Priority date	Nov 16, 2006
Publication date	Jul 16, 2019
Grant date	Jul 16, 2019

Abstract

A transient-voltage suppressing (TVS) device disposed on a semiconductor substrate including a low-side steering diode, a high-side steering diode integrated with a main Zener diode for suppressing a transient voltage. The low-side steering diode and the high-side steering diode integrated with the Zener diode are disposed in the semiconductor substrate and each constituting a vertical PN junction as vertical diodes in the semiconductor substrate whereby reducing a lateral area occupied by the TVS device. In an exemplary embodiment, the high-side steering diode and the Zener diode are vertically overlapped with each other for further reducing lateral areas occupied by the TVS device.

First claim

I claim:

1. A transient voltage suppressing (TVS) device disposed on a semiconductor substrate comprising:
a pair of steering diodes including a high side steering diode and a low side steering diode wherein the high side steering diode includes a PN junction disposed below a top surface of the semiconductor substrate in contact with a high side I/O pad that is connected to a low side I/O pad of the low side steering diode thus interconnecting the high side and low side steering diodes wherein the high side and low side steering diodes are further integrated with a main Zener diode for suppressing a transient voltage wherein the Zener diode constituting a PN junction as vertical diodes connected to a Vcc terminal through a top doped region under the top surface of the semiconductor substrate wherein the Zener diode is triggered for conducting a current along a vertical direction when an input voltage from the I/O pads is higher than a Vcc voltage; and
the high side steering diode is overlapped with the Zener diode between two isolation trenches wherein the low side steering diode is disposed on an opposite side of one of the isolation trenches.

2. The transient voltage suppressing (TVS) device of claim 1 wherein:
the high side steering diode further includes a P-epitaxial layer interfacing with a buried N dopant region and the Zener diode comprises the buried N-dopant region interfacing a deep buried body dopant region having a higher dopant concentration than the P-epitaxial layer.

3. The transient voltage suppressing (TVS) device of claim 1 wherein:
the high side steering diodes further includes a lightly doped body dopant epitaxial layer disposed below the high side I/O pad and above a buried source dopant layer and the buried source dopant region is above a shallow body dopant region having a higher body dopant concentration than the lightly doped body region underneath that is functioning as part of the Zener diode and further for reducing a junction capacitance of the high side steering diodes.

4. The transient voltage suppressing (TVS) device of claim 1 wherein:
the low side steering diodes comprises a lightly doped body dopant epitaxial layer disposed below the low side I/O pad and the lightly doped body dopant epitaxial layer is disposed above and interfaces a source region.

5. The transient voltage suppressing (TVS) device of claim 1 wherein:
the semiconductor substrate further includes a bottom electrode disposed on a bottom surface of the semiconductor substrate for connecting to a ground voltage.

6. The transient voltage suppressing (TVS) device of claim 1 wherein:
The isolation trenches extend vertically to a depth in the semiconductor substrate below the Zener diode.

7. The transient voltage suppressing (TVS) device of claim 1 wherein:
a Vcc electrode disposed above the top doped region of the Zener diode and the Vcc electrode is insulated from the high side and low side I/O pad by a top insulation layer.

8. The transient voltage suppressing (TVS) device of claim 1 further comprising:
the semiconductor substrate further includes a top P-type epitaxial layer and a buried N-type dopant region below the P-type epitaxial layer and the high side steering diode is a PN junction between the top P-type epitaxial layer and the N-type buried dopant region.

Assignees

• Bobde Madhur
• Alpha & Omega Semiconductor

Inventors

• Bobde Madhur

Classifications

• H10P30/22

  using masks · CPC title

• H01L29/66371

  Electricity · mapped topic

• H01L29/7412

  Electricity · mapped topic

• H01L29/66106

  Electricity · mapped topic

• H01L27/0255

  Electricity · mapped topic