Substrate Processing Method, Apparatus, and System
US-2024363405-A1 · Oct 31, 2024 · US
US10354842B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10354842-B2 |
| Application number | US-201514940831-A |
| Country | US |
| Kind code | B2 |
| Filing date | Nov 13, 2015 |
| Priority date | Nov 13, 2015 |
| Publication date | Jul 16, 2019 |
| Grant date | Jul 16, 2019 |
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An apparatus, for use in a processing chamber is provided. A pneumatic cylinder is provided. A manifold with a supply and an exhaust is controllably connected to the pneumatic cylinder. A dry gas supply is in fluid connection with and provides positive pressure to the exhaust of the manifold.
Opening claim text (preview).
What is claimed is: 1. An apparatus, for use in a processing chamber, comprising: a pneumatic cylinder; a manifold with a supply and an exhaust controllably connected to the pneumatic cylinder; and a dry gas supply in fluid connection with and providing positive pressure to the exhaust of the manifold, wherein the fluid connection between the dry gas supply and the exhaust of the manifold, comprises: an exhaust regulator in fluid connection with the dry gas supply; and a reservoir directly connected between the exhaust regulator and the exhaust of the manifold, wherein the reservoir is not directly connected to the supply of the manifold. 2. The apparatus, as recited in claim 1 , further comprising a supply regulator connected between the dry gas supply and the supply of the manifold wherein the supply regulator and the exhaust regulator are connected in parallel. 3. An apparatus for use in a processing chamber, comprising: a pneumatic cylinder; a manifold with a supply and an exhaust controllably connected to the pneumatic cylinder; a dry gas supply in fluid connection with and providing positive pressure to the exhaust of the manifold, wherein the fluid connection between the dry gas supply and the exhaust of the manifold, comprises: an exhaust regulator in fluid connection with the dry gas supply; and a reservoir directly connected between the exhaust regulator and the exhaust of the manifold; and wherein a bowl forming a part of the processing chamber is in fluid connection with the dry gas supply, wherein the bowl is connected in parallel with the exhaust regulator and the supply regulator. 4. The apparatus, as recited in claim 3 , wherein the dry gas supply is a dry air supply or an N 2 supply. 5. The apparatus, as recited in claim 4 , wherein the pneumatic cylinder is part of a pin lifter in a plasma processing chamber. 6. The apparatus, as recited in claim 1 , wherein the reservoir has a volume and the pneumatic cylinder pulls in a volume of gas, wherein the volume of the reservoir is at least three times the volume of gas that the pneumatic cylinder pulls in as the pneumatic cylinder is being operated. 7. The apparatus, as recited in claim 1 , wherein the dry gas supply is a dry air supply or an N 2 supply. 8. The apparatus, as recited in claim 1 , wherein the pneumatic cylinder is part of a pin lifter in a plasma processing chamber. 9. An apparatus for processing a substrate, comprising: a plasma processing confinement chamber comprising: a substrate support for supporting a substrate within the plasma processing confinement chamber; a pressure control valve for regulating the pressure in the plasma processing confinement chamber; at least one electrode for providing power to the plasma processing confinement chamber for sustaining a plasma; and a gas inlet for providing gas into the plasma processing chamber enclosure; at least one RF power source electrically connected to the at least one electrode; a gas source in fluid connection with the gas inlet; a lifter for moving the substrate; a pneumatic cylinder connected to the lifter; a manifold with a supply and an exhaust controllably connected to the pneumatic cylinder; a dry gas supply in fluid connection with and providing positive pressure to the exhaust of the manifold, wherein the fluid connection between the dry gas supply and the exhaust of the manifold, comprises: an exhaust regulator in fluid connection with the dry gas supply; and a reservoir directly connected between the exhaust regulator and the exhaust of the manifold, wherein the reservoir is not directly connected to the supply of the manifold; and a controller controllably connected to the gas source, the at least one RF power source, and the manifold. 10. The apparatus, as recited in claim 9 , further comprising a supply regulator connected between the dry gas supply and the supply of the manifold wherein the supply regulator and the exhaust regulator are connected in parallel. 11. The apparatus, as recited in claim 10 , further comprising a bowl forming a part of the processing chamber wherein the bowl is in fluid connection with the dry gas supply, wherein the bowl is connected in parallel with the exhaust regulator and the supply regulator. 12. The apparatus, as recited in claim 11 , wherein the dry gas supply is a dry air supply or an N 2 supply. 13. The apparatus, as recited in claim 12 , wherein the pneumatic cylinder is part of a pin lifter in a plasma processing chamber. 14. The apparatus, as recited in claim 9 , wherein the reservoir has a volume and the pneumatic cylinder pulls in a volume of gas, wherein the volume of the reservoir is at least three times the volume of gas that the pneumatic cylinder pulls in as the pneumatic cylinder is being operated. 15. The apparatus, as recited in claim 9 , wherein the dry gas supply is a dry air supply or an N 2 supply. 16. The apparatus, as recited in claim 9 , wherein the pneumatic cylinder is part of a pin lifter in a plasma processing chamber.
characterised by lifting arrangements, e.g. lift pins · CPC title
Gas control, e.g. control of the gas flow · CPC title
Use of plasma, radiation or electromagnetic fields · CPC title
using radio frequency discharges · CPC title
Controlling or regulating the coating process {(C23C16/45557, C23C16/279 take precedence)} · CPC title
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