Nonwoven joint tape having low moisture expansion properties and method for using same

US10352050B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10352050-B2
Application numberUS-201715699800-A
CountryUS
Kind codeB2
Filing dateSep 8, 2017
Priority dateDec 12, 2006
Publication dateJul 16, 2019
Grant dateJul 16, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The invention is directed to a joint tape for finishing a joint between boards having a nonwoven substrate that does not swell substantially in the presence of water. The invention further provides a method of finishing a joint between boards having the steps of (i) applying a joint tape of the invention to a joint between boards by embedding the joint tape in a first coat of joint compound, (ii) applying a second coat of joint compound over the tape, wherein step (ii) is carried out before the joint tape and joint compound applied in step (i) have substantially dried, and optionally (iii) applying a third fill or finish coat of joint compound over the tape, wherein step (iii) is carried out before the joint tape and second coat have substantially dried.

First claim

Opening claim text (preview).

The invention claimed is: 1. A joint tape comprising a nonwoven substrate comprising at least about 30 wt. % synthetic polymeric fibers and less than about 50 wt. % but greater than 0 wt. % glass fibers, wherein the synthetic polymeric fibers are polyester, polyethylene, polypropylene, nylon, polyacetate, polyacrylic, polystyrene, polyvinyl acetate, rayon, polyvinylchloride, or copolymers thereof, or combinations thereof, the nonwoven substrate having a thickness of about 0.012 inches or less and having, as determined according to ASTM C474-05: (a) a crosswise percent expansion of less than about 1.3% (b) a lengthwise percent expansion of less than about 0.2%, and (c) a tensile strength of at least about 15 pounds-force per inch in the cross direction; the joint tape having a fluid permeability measured as air resistance according to TAPPI T-460 of about 6 seconds or less. 2. The joint tape of claim 1 , the nonwoven substrate having, as determined according to ASTM C474-05: (a) a crosswise percent expansion of less than 0.8%; (b) a lengthwise percent expansion of less than 0.1%; and (c) a tensile strength of at least 20 pounds-force per inch in the cross direction. 3. The joint tape of claim 1 , wherein the nonwoven substrate comprises a binder. 4. The joint tape of claim 3 , wherein the binder is polyvinyl alcohol, polyvinyl acetate, polyethylene vinyl acetate, polyvinylchloride, starch, or cross-linked starch, or combinations thereof. 5. The joint tape of claim 1 , wherein the nonwoven substrate is coated at least in part with a bond enhancing agent. 6. The joint tape of claim 5 , wherein the bond enhancing agent is selected from the group consisting of polymers formed from vinyl acetate, vinyl alcohol, vinyl chloride, acrylic acid, ethyl vinyl acetate, and ethyl vinyl chloride, starch, and combinations thereof.

Assignees

Inventors

Classifications

  • by applying, incorporating or activating chemical or thermoplastic bonding agents, e.g. adhesives (in combination with needling D04H1/488) · CPC title

  • Nonwoven fabric [i.e., nonwoven strand or fiber material] · CPC title

  • characterised by the joints between neighbouring elements, e.g. with joint fillings or with tongue and groove connections {(not used, see E04F13/0889)} · CPC title

  • Paper; Textile fabrics · CPC title

  • Implements for finishing work on buildings (for working or treating building elements of stone or stone-like material B28D) · CPC title

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What does patent US10352050B2 cover?
The invention is directed to a joint tape for finishing a joint between boards having a nonwoven substrate that does not swell substantially in the presence of water. The invention further provides a method of finishing a joint between boards having the steps of (i) applying a joint tape of the invention to a joint between boards by embedding the joint tape in a first coat of joint compound, (i…
Who is the assignee on this patent?
United States Gypsum Co
What technology area does this patent fall under?
Primary CPC classification E04F19/062. Mapped technology areas include Fixed Constructions.
When was this patent published?
Publication date Tue Jul 16 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).