Diodes offering asymmetric stability during fluidic assembly

Patent metadata

Field	Value
Publication number	US-10347513-B2
Application number	US-201815859673-A
Country	US
Kind code	B2
Filing date	Jan 1, 2018
Priority date	Jun 23, 2016
Publication date	Jul 9, 2019
Grant date	Jul 9, 2019

Abstract

Embodiments are related to systems and methods for fluidic assembly, and more particularly to systems and methods for assuring deposition of elements in relation to a substrate.

First claim

What is claimed is:

1. A substrate for fluidic assembly, the substrate comprising:
a plurality of wells extending from a top surface of the substrate, wherein each of the plurality of wells is configured to accept a post enhanced diode, wherein the post enhanced diode includes a post extending from a top surface of a diode structure, wherein an orientation of a post enhanced diode where the post extends away from the substrate is a non-inverted orientation, and wherein an orientation of a post enhanced diode where the post extends toward the substrate is an inverted orientation; and
at least one groove extending into the top surface of the substrate and configured such that the post enhanced diode traversing the at least one groove in the non-inverted orientation is more mechanically stable than the post enhanced diode traversing the at least one groove in the inverted orientation.

2. The substrate of claim 1 , wherein a depth of the groove into the substrate is less than a distance from an edge of a top surface of the diode structure to an edge of the post.

3. The substrate of claim 1 , wherein a width of the groove at the top surface of the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the post.

4. The substrate of claim 1 , wherein the at least one groove is a series of two or more parallel grooves.

5. The substrate of claim 4 , wherein the series of two or more parallel grooves are co-located in a region of the substrate that does not include any of the plurality of wells.

6. The substrate of claim 1 , wherein the at least one groove extends in a line across a portion of the substrate, wherein the line has a length, a width at the top surface of the substrate, and a depth into the substrate, wherein the width is less than the length, wherein the post of the post enhanced diode exhibits a first height, wherein the diode structure of the post enhanced diode exhibits a second height, wherein an overall height of the post enhanced diode is the first height plus the second height, and wherein the width of the at least one groove is less than the second height.

7. The substrate of claim 6 , wherein the line is selected from a group consisting of: a straight line, and a curvilinear line.

8. The substrate of claim 1 , wherein the at least one groove extends in a line across a portion of the substrate, wherein the line has a length, a width at the top surface of the substrate, and a depth into the substrate, wherein the width is less than the length, wherein the post of the post enhanced diode exhibits a distance from an upper surface at an outer perimeter of the diode structure to an upper surface of an outer perimeter of the post, and wherein the width of the at least one groove is less than the distance.

9. The substrate of claim 8 , wherein the line is selected from a group consisting of: a straight line, and a curvilinear line.

10. The substrate of claim 1 , wherein the at least one groove extends in a line across a portion of the substrate, and wherein:
the line is selected from a group consisting of: a straight line, and a curvilinear line; and
wherein at least one sidewall of the line extending into the substrate is tapered.

11. The substrate of claim 10 , wherein the opposing sidewall of the line extending into the substrate is substantially vertical.

12. The substrate of claim 1 , wherein the at least one groove is/are located together at a first region on the substrate and the plurality of wells are located together at a second region on the substrate, and wherein the first region does not overlap the second region.

13. The substrate of claim 1 , wherein the at least one groove is/are intermixed between the plurality of wells across the top surface of the substrate.

14. A substrate for fluidic assembly, the substrate comprising:
a plurality of wells extending from a top surface of the substrate, wherein each of the plurality of wells is configured to accept a post enhanced diode, wherein the post enhanced diode includes a post extending from a top surface of a diode structure, wherein an orientation of a post enhanced diode where the post extends away from the substrate is a non-inverted orientation, and wherein an orientation of a post enhanced diode where the post extends toward the substrate is an inverted orientation; and
at least one structure disposed about the top surface of the substrate and configured such that the post enhanced diode traversing the at least one structure in the non-inverted orientation is more mechanically stable than the post enhanced diode traversing the at least one structure in the inverted orientation.

15. The substrate of claim 14 , wherein the at least one structure includes a groove extending into the top surface, and wherein a depth of the groove into the substrate is less than a distance from an edge of a top surface of the diode structure to an edge of the post.

16. The substrate of claim 15 , wherein the groove extends in a line across a portion of the substrate, and wherein:
the line is selected from a group consisting of: a straight line, and a curvilinear line; and
wherein at least one sidewall of the line extending into the substrate is tapered.

17. The substrate of claim 16 , wherein the opposing sidewall of the line extending into the substrate is substantially vertical.

18. The substrate of claim 14 , wherein a width of the structure at the top surface of the substrate is less than a distance from an edge of the top surface of the diode structure to an edge of the post.

19. The substrate of claim 14 , wherein the at least one structure includes a series of two or more parallel grooves extending into the top surface.

20. The substrate of claim 19 , wherein the series of two or more parallel grooves are co-located in a region of the substrate that does not include any of the plurality of wells.

21. The substrate of claim 14 , wherein the at least one structure includes a groove extending in a line across a portion of the substrate, wherein the line has a length, a width at the top surface of the substrate, and a depth into the substrate, wherein the width is less than the length, wherein the post of the post enhanced diode exhibits a first height, wherein the diode structure of the post enhanced diode exhibits a second height, wherein an overall height of the post enhanced diode is the first height plus the second height, and wherein the width of the at least one groove is less than the second height.

22. The substrate of claim 21 , wherein the line is a straight line.

23. The substrate of claim 14 , wherein the at least one structure includes a groove extending in a line across a portion of the substrate, wherein the line has a length, a width at the top surface of the substrate, and a depth into the substrate, wherein the width is less than the length, wherein the post of the post enhanced diode exhibits a distance from an upper surface at an outer perimeter of the diode structure to an upper surface of an outer perimeter of the post, and wherein the width of the at least one groove is less than the distance.

24. The substrate of claim 23 , wherein the line is a straight line.

Assignees

• Sharp Laboratories America Inc
• Elux Inc

Inventors

• Schuele Paul John
• Heine David Robert
• Crowder Mark Albert
• Garner Sean Mathew
• Zhan Changqing
• Shinde Avinash Tukaram
• Sasaki Kenji Alexander
• Ulmer Kurt Michael

Classifications

• H10W90/00

  Package configurations · CPC title

• H10W72/0198

  batch processes · CPC title

• H10H29/142 Primary

  Two-dimensional arrangements, e.g. asymmetric LED layout · CPC title

• H10P72/16 Primary

  Trays for chips · CPC title

• H10P72/0438 Primary

  Apparatus for making assemblies not otherwise provided for, e.g. package constructions · CPC title