Wafer, and liquid ejection chip
US-12479206-B2 · Nov 25, 2025 · US
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Uyama Masaya patents
Uyama Masaya is listed as an inventor on 54 patents in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Uyama Masaya |
| Total patents | 54 |
| First publication | Jan 22, 2015 |
| Latest publication | Nov 25, 2025 |
Notable patents
Publications ranked by popularity score, then publication date.
Liquid ejection head and method for manufacturing the same
US-2025269645-A1 · Aug 28, 2025 · US
Liquid ejection head and method for manufacturing the same
US-12311667-B2 · May 27, 2025 · US
Liquid ejection head
US-2025074051-A1 · Mar 6, 2025 · US
Liquid ejection apparatus and liquid tank
US-12220924-B2 · Feb 11, 2025 · US
Wafer, and liquid ejection chip
US-2024190132-A1 · Jun 13, 2024 · US
Liquid ejection apparatus and liquid tank
US-2023050852-A1 · Feb 16, 2023 · US
Liquid ejection head and method for manufacturing the same
US-2023030043-A1 · Feb 2, 2023 · US
Liquid ejection apparatus and liquid tank
US-11511548-B2 · Nov 29, 2022 · US
Liquid ejection head
US-11161351-B2 · Nov 2, 2021 · US
Recent patents
Latest publications not already listed above.
Liquid ejection head and method of manufacturing same
US-11135838-B2 · Oct 5, 2021 · US
Liquid ejection apparatus and liquid tank
US-2021237462-A1 · Aug 5, 2021 · US
Method of forming film on substrate and method of manufacturing liquid ejection head
US-11081349-B2 · Aug 3, 2021 · US
Liquid ejection head and method of manufacturing same
US-11027548-B2 · Jun 8, 2021 · US
Liquid ejection head
US-11020971-B2 · Jun 1, 2021 · US
Liquid ejection head and a manufacturing method of the same
US-11001062-B2 · May 11, 2021 · US
Semiconductor element, recording element substrate, and liquid discharge head
US-10906304-B2 · Feb 2, 2021 · US
Method of forming film on substrate and method of manufacturing liquid ejection head
US-2020227252-A1 · Jul 16, 2020 · US
Liquid ejection head and a manufacturing method of the same
US-2020189275-A1 · Jun 18, 2020 · US
Liquid ejection head
US-2020147962-A1 · May 14, 2020 · US
Perforated substrate processing method and liquid ejection head manufacturing method
US-10632754-B2 · Apr 28, 2020 · US
Liquid ejection head
US-2020101759-A1 · Apr 2, 2020 · US
Method for manufacturing perforated substrate, method for manufacturing liquid ejection head, and method for detecting flaw
US-10538090-B2 · Jan 21, 2020 · US
Semiconductor element, recording element substrate, and liquid discharge head
US-2020001605-A1 · Jan 2, 2020 · US
Liquid ejection head and method of manufacturing same
US-2020001604-A1 · Jan 2, 2020 · US
Liquid ejection head and method of manufacturing same
US-2019366713-A1 · Dec 5, 2019 · US
Method for forming film and method for manufacturing inkjet print head
US-10343403-B2 · Jul 9, 2019 · US
Liquid ejection head, method for manufacturing the same, and printing method
US-10286664-B2 · May 14, 2019 · US
Perforated substrate processing method and liquid ejection head manufacturing method
US-2019111682-A1 · Apr 18, 2019 · US
Liquid discharge head, manufacturing method therefor, and recording method
US-10150292-B2 · Dec 11, 2018 · US
Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Canon Kk | 54 |
| Uyama Masaya | 2 |
| Terui Makoto | 1 |
| Kanasugi Yuichiro | 1 |
| Harada Kouji | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| B41J2/1628 | 43 |
| B41J2/1603 | 43 |
| B41J2/1631 | 35 |
| B41J2/1629 | 29 |
| B41J2/1642 | 27 |