Apparatus for reducing noise in electronic device

Patent metadata

Field	Value
Publication number	US-2016249456-A1
Application number	US-201614993523-A
Country	US
Kind code	A1
Filing date	Jan 12, 2016
Priority date	Feb 23, 2015
Publication date	Aug 25, 2016
Grant date	—

Abstract

An electronic device with a reduced noise may include a printed circuit board and a signal creating unit mounted on the printed circuit board and configured to create at least one signal. The electronic device may also include at least one power via configured to connect a power terminal of the signal creating unit with a main power line disposed in the printed circuit board. The electronic device further includes at least one ground via configured to connect a ground terminal of the signal creating unit with a main ground disposed in the printed circuit board. In this electronic device, the ground via is disposed in parallel with the power via.

First claim

What is claimed is:

1 . An electronic device comprising:
a printed circuit board including a main power line and a main ground; a signal creating unit including a power terminal and a ground terminal mounted on the printed circuit board, and configured to create at least one signal; at least one power via configured to connect the power terminal with the main power line; and at least one ground via configured to connect the ground terminal with the main ground, wherein the ground via is disposed in parallel with the power via.

2 . The electronic device of claim 1 , wherein the power via and the ground via are positioned under the signal creating unit.

3 . The electronic device of claim 1 , further comprising:
a receiver configured to output an audio signal, wherein the signal creating unit is disposed at an upper part of the electronic device and located near the receiver.

4 . The electronic device of claim 3 , wherein the receiver does not comprises tele-coil.

5 . The electronic device of claim 1 , wherein the power via and the ground via are disposed by turns in a single row or column.

6 . The electronic device of claim 1 , wherein the power via and the ground via are disposed by turns in two or more rows or columns.

7 . The electronic device of claim 1 , wherein the power via and the ground via are disposed within a distance for allowing the offset of magnetic fields.

8 . The electronic device of claim 1 , wherein magnetic fields created by electric currents flowing through the power via and the ground via are offset by each other.

9 . The electronic device of claim 1 , wherein the ground via is formed independently from the main ground.

10 . The electronic device of claim 1 , wherein the main ground includes a ground line disposed in parallel with the main power line at length.

11 . The electronic device of claim 10 , wherein magnetic fields created by electric currents flowing through the main power line and the ground line are offset by each other.

12 . The electronic device of claim 1 , wherein the electronic device supports hearing aid compatibility (HAC).

13 . The electronic device of claim 1 , wherein the signal creating unit is a battery coupling unit configured to connect a battery with the printed circuit board.

14 . The electronic device of claim 1 , wherein the at least one signal is generated from a connection line between the signal creating unit and other electronic component.

Assignees

• Samsung Electronics Co Ltd

Inventors

• YOUN Jonghyeok
• Cho Jaehyung
• Chung Myungkyoon

Classifications

• H05K1/18 Primary

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• H05K2201/09636

  Details of adjacent, not connected vias · CPC title

• H05K1/0222

  for shielding around a single via or around a group of vias, e.g. coaxial vias or vias surrounded by a grounded via fence · CPC title

• H05K2201/09609

  Via grid, i.e. two-dimensional array of vias or holes in a single plane · CPC title

• H05K1/115 Primary

  Via connections; Lands around holes or via connections (H05K1/112 takes precedence) · CPC title