Light-emitting device with metal bump

Patent metadata

Field	Value
Publication number	US-10340431-B2
Application number	US-201815867218-A
Country	US
Kind code	B2
Filing date	Jan 10, 2018
Priority date	Dec 24, 2014
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

This disclosure discloses a light-emitting device. The light-emitting device includes a light-emitting diode, a pad electrically connected to the active layer, a metal bump formed on the pad, and a reflective insulation layer. The metal bump has a first side surface and a first bottom surface, wherein the first bottom surface comprises a curved boundary, a longer axis, and a shorter axis. The reflective insulation layer is directly contacting the first side surface, and exposing the first bottom surface.

First claim

What is claimed is:

1. A light-emitting device comprising:
a light-emitting diode comprising:
an active layer; and
a pad electrically connected to the active layer;

a metal bump, formed under the pad in a cross-sectional view, and having a first side surface and a first bottom surface which is observed in a bottom view different from the cross-sectional view;
a reflective insulation layer enclosing the metal bump in a configuration of exposing the first bottom surface and directly contacting the first side surface; and
a plurality of scratched lines directly formed on the first bottom surface,
wherein the metal bump has an oval shape in the bottom view, and
wherein the reflective insulation layer has a bottommost surface which is flush or coplanar with the metal bump.

2. The light-emitting device of claim 1 , wherein the first side surface comprises a curved portion.

3. The light-emitting device of claim 1 , further comprising a wavelength conversion layer formed on the reflective insulation layer and the light-emitting diode.

4. The light-emitting device of claim 3 , wherein the wavelength conversion layer has a sidewall which is substantially coplanar with the reflective insulation layer.

5. The light-emitting device of claim 1 , wherein the metal bump includes a lead-free solder.

6. The light-emitting device of claim 1 , wherein the pad comprises an area and the metal bump comprises a projection area projected to the area, and the projection area is smaller than the area.

7. The light-emitting device of claim 1 , further comprising a top surface opposite to the first bottom surface and a plurality of scratched lines formed on the top surface.

8. The light-emitting device of claim 1 , further comprising a wavelength conversion layer, wherein the light-emitting diode further comprises an insulation layer formed on the active layer and having a side surface covered by the wavelength conversion layer.

9. The light-emitting device of claim 1 , wherein the reflective insulation layer has a second bottom surface substantially coplanar with the first bottom surface.

10. The light-emitting device of claim 1 , further comprising a wavelength conversion layer, wherein the light-emitting diode further comprises a semiconductor layer with a second side surface covered by the wavelength conversion layer.

11. The light-emitting device of claim 1 , wherein the light-emitting diode further comprises an insulation layer on which the reflective insulation layer is formed.

12. The light-emitting device of claim 1 , further comprising a wavelength conversion layer covering the light-emitting diode and having a side wall covered by the reflective insulation layer.

13. The light-emitting device of claim 12 , wherein the wavelength conversion layer and the reflective insulation layer have top surfaces substantially coplanar with each other.

14. The light-emitting device of claim 1 , wherein the reflective insulation layer comprises reflective particles.

15. The light-emitting device of claim 1 , wherein at least one of the plurality of scratched lines is extended on the reflective insulation layer and the metal bump.

Assignees

• Epistar Corp

Inventors

• Kuo Jai-Tai
• Hsieh Min-Hsun
• Lai Lung-Kuan
• Cheng Wei-Kang
• Liu Chien-Liang
• Renn Yih-Hua
• Chen Shou-Lung
• Ko Tsun-Kai
• Pu Chi-Chih

Classifications

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• H01L33/62 Primary

  Electricity · mapped topic

• H01L2224/18

  Electricity · mapped topic

• H01L33/507

  Electricity · mapped topic

• H01L33/46

  Electricity · mapped topic