Semiconductor devices and methods of manufacturing
US-12166025-B2 · Dec 10, 2024 · US
US8999736B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-8999736-B2 |
| Application number | US-84084810-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jul 21, 2010 |
| Priority date | Jul 4, 2003 |
| Publication date | Apr 7, 2015 |
| Grant date | Apr 7, 2015 |
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Official abstract text for this publication.
A method of making an optoelectronic system in accordance with the present disclosure is disclosed. The method includes providing a temporary substrate; providing un-packaged optoelectronic elements having sidewalls, top surfaces, and bottom surfaces, at least one of the unpackaged optoelectronic elements having an electrode provided on a side of the bottom surfaces; attaching the bottom surfaces to the temporary substrate such that a trench is formed between two of the un-packaged optoelectronic elements; providing an adhesive material to fully fill the trench and cover the un-packaged optoelectronic elements such that the sidewalls and top surfaces of the un-packaged optoelectronic elements are fully enclosed by the adhesive material; providing a transparent substrate on the adhesive material; and removing the temporary substrate without removing all the adhesive material covering the optoelectronic elements.
Opening claim text (preview).
What is claimed is: 1. A method of making an optoelectronic system comprising: providing a temporary substrate; providing un-packaged optoelectronic elements having sidewalls, top surfaces, and bottom surfaces, at least one of the unpackaged optoelectronic elements having an electrode provided on a side of the bottom surfaces; attaching the bottom surfaces to the temporary substrate such that a trench is formed between two of the un-packaged optoelectronic elements; providin…
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