Surface treated copper foil for high speed printed circuit board products including the copper foil and methods of making

Patent metadata

Field	Value
Publication number	US-10337115-B1
Application number	US-201815863256-A
Country	US
Kind code	B1
Filing date	Jan 5, 2018
Priority date	Jan 5, 2018
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

Surface treated copper foils for use in high speed circuits on the order of 100 MHz or greater contain a reverse treated layer of copper nodules on the drum side of the electrolytically deposited copper foil to form a lamination side to be laminated to a dielectric material to form a copper clad laminate. Methods of forming the surface treated copper foil, and printed circuit boards (PCB) from the copper clad laminates are also described. The surface treated copper foils, copper clad laminates and PCBs can be incorporated into various electronic devices in which high speed signals are employed, including personal computers, mobile communications, including cellular telephones and wearables, self-driving vehicles, including cars and trucks, and aviation devices, including manned and unmanned vehicles, including airplanes, drones, missiles and space equipment including satellites, spacecraft, space stations and extra-terrestrial habitats and vehicles.

First claim

We claim:

1. A surface treated copper foil for use in a high speed printed circuit board comprising:
an electrolytically deposited copper foil having a drum side and a deposit side, and
a layer of nodules deposited directly on, and only on, the drum side of the electrolytically deposited copper foil to form a nodule treated drum side of the surface treated copper foil;
wherein the nodule treated drum side of the surface treated copper foil exhibits a surface roughness (Rz) in the range of 1.5 to 3.1 μm; and,
wherein the nodule treated drum side of the surface treated copper foil exhibits a difference of reflectance between 570 nm and 610 nm in the range of 15% to 30%.

2. The surface treated copper foil of claim 1 , wherein the nodule treated drum side exhibits a reflectance at 570 nm in the range of 20% to 30%.

3. The surface treated copper foil of claim 1 , wherein the nodule treated drum side exhibits a reflectance at 610 nm in the range of 44% to 51%.

4. The surface treated copper foil of claim 1 , wherein the nodule treated drum side exhibits a gloss at 60° in the range of 0.5 to 5.1.

5. The surface treated copper foil of claim 1 , further comprising a copper plating layer over the layer of nodules.

6. The surface treated copper foil of claim 5 , further comprising a zinc layer over each of the copper plating layer and the deposit side of the electrolytically deposited copper foil.

7. The surface treated copper foil of claim 6 , further comprising a nickel layer on the zinc layer over the copper plating layer.

8. The surface treated copper foil of claim 1 , further comprising a silane coupling treated layer formed by treating the surface treated copper foil with a silane coupling agent.

9. The surface treated copper foil of claim 8 , wherein the silane coupling agent comprises a 3-glycidoxypropyl triethoxysilane.

10. The surface treated copper foil of claim 8 , wherein the silane coupling agent comprises a 3-aminopropyltriethoxysilane.

11. A copper clad laminate comprising the surface treated copper foil of claim 1 and a dielectric resin, the dielectric resin exhibiting a Dk<3.9 and a Df<0.012 under test conducted according to IPC-TM 650 No. 2.5.5.13.

12. A printed circuit board comprising the copper clad laminate of claim 11 .

13. An electronic component comprising the printed circuit board of claim 12 .

14. An electronic device comprising the electronic component of claim 13 .

15. The electronic device of claim 14 , wherein the electronic device processes high frequency signals of at least 100 MHz.

16. The electronic component of claim 13 , wherein the electronic component processes high frequency signals of at least 100 MHz.

17. The surface treated copper foil of claim 1 , wherein the nodules in the nodule layer have a diameter of less than 3 μm.

18. The surface treated copper foil of claim 17 , wherein the nodules have a diameter of less than 2 μm.

19. A surface treated copper foil for use in a high speed printed circuit board for processing high frequency signal of at least 100 MHz comprising:
an electrolytically deposited copper foil having a drum side and a deposit side, and
an electroplated layer of copper nodules deposited directly on, and only on, the drum side of the electrolytically deposited copper foil to form a nodule treated drum side of the surface treated copper foil;
wherein the nodule treated drum side of the surface treated copper foil exhibits a surface roughness (Rz) in the range of 1.5 to 3.1 μm; and,
wherein the nodule treated drum side of the surface treated copper foil exhibits a difference of reflectance between 570 nm and 610 nm in the range of 15% to 30%.

Assignees

• Chang Chun Petrochemical Co Ltd

Inventors

• Lai Yao-Sheng
• Cheng Kuei-Sen
• Chou Jui-Chang

Classifications

• C25D5/48

  After-treatment of electroplated surfaces · CPC title

• C25F3/26

  of refractory metals · CPC title

• C25D5/028

  one side electroplating, e.g. substrate conveyed in a bath with inhibited background plating · CPC title

• C25D15/00

  Electrolytic or electrophoretic production of coatings containing embedded materials, e.g. particles, whiskers, wires · CPC title

• C25D7/0614

  Strips or foils · CPC title