Electronic device based on multilayer thin film and method for manufacturing the same using a three-dimensional structure
US-2024309503-A1 · Sep 19, 2024 · US
US10337101B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10337101-B2 |
| Application number | US-201615376867-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 13, 2016 |
| Priority date | Dec 13, 2016 |
| Publication date | Jul 2, 2019 |
| Grant date | Jul 2, 2019 |
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A chemical vapor deposition method comprises flowing a carrier liquid through a reactor. A fluid comprising one or more reactants is introduced into the carrier liquid. The fluid is at a first temperature and first pressure and is sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid. Each of the microreactors comprise a discrete volume of the fluid and have a surface boundary defined by an interface of the fluid with the carrier liquid. The fluid is heated and optionally pressurized to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products. The plurality of chemical vapor deposition products are separated from the carrier liquid. A system for carrying out the method of the present disclosure is also taught.
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What is claimed is: 1. A method comprising: flowing a carrier liquid through a reactor; introducing a fluid comprising one or more reactants into the carrier liquid, the fluid being at a first temperature and first pressure and being sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid, each of the microreactors comprising a discrete volume of the fluid surrounded by the carrier liquid and having a surface boundary defined by an interface of the fluid with the carrier liquid; heating and optionally pressurizing the fluid to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products, the surface boundary acting as a substrate for the chemical vapor deposition reaction; and separating the plurality of chemical vapor deposition products from the carrier liquid. 2. The method of claim 1 , wherein the fluid comprising one or more reactants is predominately a gas at the first temperature and first pressure. 3. The method of claim 1 , wherein the fluid comprising one or more reactants is predominately a liquid at the first temperature and first pressure and is predominately a gas at the second temperature and second pressure. 4. The method of claim 1 , wherein the deposition reaction comprises reacting the one or more reactants at the surface boundary of the microreactor to form a shell. 5. The method of claim 4 , further comprising maintaining a discrete volume of the fluid to be sufficiently constant during the deposition reaction so as to avoid fracturing of the microreactors. 6. A method comprising: flowing a carrier liquid through a reactor; introducing a fluid comprising one or more reactants into the carrier liquid, the fluid being at a first temperature and first pressure and being sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid, each of the microreactors comprising a discrete volume of the fluid and having a surface boundary defined by an interface of the fluid with the carrier liquid; heating and optionally pressurizing the fluid to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products; and separating the plurality of chemical vapor deposition products from the carrier liquid, wherein maintaining the discrete volume to be sufficiently constant comprises at least one of: 1) increasing a hydrostatic pressure at the surface boundary of the microreactors while heating the fluid and 2) decreasing the hydrostatic pressure while cooling the fluid. 7. The method of claim 4 , wherein the discrete volume of the fluid changes during the deposition reaction so as to fracture the microreactors. 8. The method of claim 1 , wherein the one or more reactants comprise a first reactant and a second reactant. 9. The method of claim 8 , wherein the first reactant reacts at the second temperature to form an outer layer of a shell and the second reactant reacts at a third temperature that is higher than the second temperature to deposit an inner layer on an inner surface of the outer layer. 10. The method of claim 1 , wherein a solid catalyst is provided at the surface boundary of the microreactor. 11. The method of claim 10 , wherein the solid catalyst is in the form of a nanoparticle. 12. A method comprising: flowing a carrier liquid through a reactor; introducing a fluid comprising one or more reactants into the carrier liquid, the fluid being at a first temperature and first pressure and being sufficiently immiscible in the carrier liquid so as to form a plurality of microreactors suspended in the carrier liquid, each of the microreactors comprising a discrete volume of the fluid and having a surface boundary defined by an interface of the fluid with the carrier liquid; heating and optionally pressurizing the fluid to a second temperature and second pressure at which a chemical vapor deposition reaction occurs within the microreactors to form a plurality of chemical vapor deposition products; and separating the plurality of chemical vapor deposition products from the carrier liquid, wherein a solid catalyst is provided at the surface boundary of the microreactor and the chemical vapor deposition products are carbon nanotubes. 13. The method of claim 1 , wherein the carrier liquid comprises one or more compounds chosen from molten salts, alkanes and mixtures thereof. 14. The method of claim 1 , where the one or more reactants comprise a compound chosen from a hydrocarbon, silane, O 2 , WF 6 , AlCl 3 , Copper(II) bis(hexafluoroacetylacetonate), (CH 3 ) 3 Al, Fe(CO) 5 , [(CH 3 ) 2 N] 4 Hf, W(CO) 6 , C 5 H 4 CH 3 Pt(CH 3 ) 3 , and combinations thereof. 15. The method of claim 1 , further comprising cooling the plurality of chemical vapor deposition products to a third temperature that is sufficiently below the second temperature so that chemical vapor deposition terminates. 16. The method of claim 1 , further comprising allowing the microreactors to rise to a surface of the carrier liquid, thereby releasing waste fluid from the microreactors. 17. The method of claim 6 , wherein the carrier liquid comprises one or more compounds chosen from molten salts, alkanes and mixtures thereof. 18. The method of claim 6 , where the one or more reactants comprise a compound chosen from a hydrocarbon, silane, O 2 , WF 6 , AlCl 3 , Copper(II) bis(hexafluoroacetylacetonate), (CH 3 ) 3 Al, Fe(CO) 5 , [(CH 3 ) 2 N] 4 Hf, W(CO) 6 , C 5 H 4 CH 3 Pt(CH 3 ) 3 , and combinations thereof. 19. The method of claim 18 , wherein the deposition reaction comprises reacting the one or more reactants at the surface boundary of the microreactor to form a shell. 20. The method of claim 12 , wherein the carrier liquid comprises one or more compounds chosen from molten salts, alkanes and mixtures thereof.
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