Method and apparatus for metering and vaporizing a fluid

Patent metadata

Field	Value
Publication number	US-10334879-B2
Application number	US-201514976053-A
Country	US
Kind code	B2
Filing date	Dec 21, 2015
Priority date	Dec 21, 2015
Publication date	Jul 2, 2019
Grant date	Jul 2, 2019

Abstract

A vaporization device, including a fluid supply containing a vaporizable fluid; a bubble pump operative to pump fluid from the fluid supply to an outlet of the bubble pump; and a fluid vaporization heater located adjacent the outlet of the bubble pump to receive fluid from the bubble pump.

First claim

The invention claimed is:

1. A vaporization device, comprising:
a fluid supply containing a vaporizable fluid;
a bubble pump having an inlet in flow communication with the fluid supply for receiving the vaporizable fluid therefrom, a fluid flow path, flow sequencing heaters located within the fluid flow path, and an outlet, wherein the bubble pump is operative to pump the vaporizable fluid from the fluid supply to the outlet of the bubble pump; and
a planar fluid vaporization heater made of a thin film resistor material, the vaporization heater being separate from the bubble pump located adjacent to the outlet of the bubble pump, wherein the fluid supply and the bubble pump are incorporated onto a printed circuit board, the fluid vaporization heater having a heated fluid contact surface to receive the vaporizable fluid from the outlet of the bubble pump and to heat and thereby vaporize the received fluid into the atmosphere.

2. The vaporization device of claim 1 , wherein the bubble pump and the fluid vaporization heater are located on parallel planes.

3. The vaporization device of claim 1 , wherein the bubble pump and the fluid vaporization heater are located on perpendicular planes.

4. The vaporization device of claim 1 , wherein an angular position of the bubble pump relative to the fluid vaporization heater is variable.

5. The vaporization device of claim 1 , wherein the bubble pump and the fluid vaporization heater are fabricated on a common substrate.

6. The vaporization device of claim 1 , wherein the bubble pump and the fluid vaporization heater are fabricated on different substrates.

7. The vaporization device of claim 1 , wherein the fluid supply is located vertically above the bubble pump.

8. The vaporization device of claim 1 , wherein the fluid vaporization heater is incorporated onto the printed circuit board.

9. The vaporization device of claim 8 , wherein the fluid supply has an inlet located at an end of the printed circuit board opposite the fluid vaporization heater.

10. A vaporization device, comprising:
a fluid supply containing a vaporizable fluid; a bubble pump operative to pump the vaporizable fluid from the fluid supply to an outlet of the bubble pump; and a planar fluid vaporization heater made of a thin film resistor material, the vaporization heater being separate from the bubble pump located adjacent to the outlet of the bubble pump to receive the vaporizable fluid from the bubble pump, wherein the fluid supply and the bubble pump are incorporated onto a printed circuit board, the fluid vaporization heater being operative to heat and thereby vaporize the received fluid into the atmosphere.

11. The vaporization device of claim 10 , wherein the bubble pump and the fluid vaporization heater are located on parallel planes.

12. The vaporization device of claim 10 , wherein the bubble pump and the fluid vaporization heater are located on perpendicular planes.

13. The vaporization device of claim 10 , wherein an angular position of the bubble pump relative to the fluid vaporization heater is variable.

14. The vaporization device of claim 10 , wherein the bubble pump and the fluid vaporization heater are fabricated on a same substrate.

15. The vaporization device of claim 10 , wherein the bubble pump and the fluid vaporization heater are fabricated on different substrates.

16. The vaporization device of claim 10 , wherein the fluid supply is located vertically above the bubble pump.

17. The vaporization device of claim 10 , wherein the fluid vaporization heater is incorporated onto the printed circuit board.

18. The vaporization device of claim 17 , wherein the fluid supply has an inlet located at an end of the printed circuit board opposite the fluid vaporization heater.

19. A method of vaporizing fluid, comprising the steps of:
providing a fluid supply containing a vaporizable fluid; providing a bubble pump in fluid communication with the fluid supply and operating the bubble pump to pump the vaporizable fluid from the fluid supply to an outlet of the bubble pump; providing a planar fluid vaporization heater made of a thin film resistor material, the vaporization heater being separate from the bubble pump adjacent to the outlet of the bubble pump to receive the vaporizable fluid from the bubble pump, wherein the fluid supply and the bubble pump are incorporated onto a printed circuit board, and operating the fluid vaporization heater to heat and thereby vaporize the received fluid into the atmosphere.

Assignees

• Funai Electric Co

Inventors

• Barkley Lucas D

Classifications

• F22B1/287 Primary

  with water in sprays or in films · CPC title

• F04B19/24

  Pumping by heat expansion of pumped fluid · CPC title

• A24F47/008 Primary

  Human Necessities · mapped topic

• F04B19/006

  Micropumps (F04B43/043 and F04B43/095 take precedence) · CPC title

• H05B1/0297

  Heating of fluids for non specified applications · CPC title