Electric assembly including a semiconductor switching device and a clamping diode

Patent metadata

Field	Value
Publication number	US-10333387-B2
Application number	US-201615331548-A
Country	US
Kind code	B2
Filing date	Oct 21, 2016
Priority date	Oct 23, 2015
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

An electric assembly includes a semiconductor switching device with a maximum breakdown voltage rating across two load terminals in an off-state. A clamping diode is electrically connected to the two load terminals and parallel to the switching device. A semiconductor body of the clamping diode is made of silicon carbide. An avalanche voltage of the clamping diode is lower than the maximum breakdown voltage rating of the switching device.

First claim

What is claimed is:

1. An electric assembly, comprising:
a semiconductor switching device configured to withstand a maximum breakdown voltage rating across two load terminals in an off-state; and
a clamping diode electrically connected to the two load terminals and parallel to the switching device, wherein a semiconductor body of the clamping diode comprises silicon carbide and an avalanche voltage of the clamping diode is lower than the maximum breakdown voltage rating of the switching device.

2. The electric assembly of claim 1 , wherein the clamping diode is configured to sustain at least 400% of a maximum long-term load current rating of the switching device for at least 10 ns.

3. The electric assembly of claim 1 , wherein the clamping diode comprises a pn junction effective between a. metal anode and a metal cathode.

4. The electric assembly of claim 1 , wherein the clamping diode comprises field shaping structures configured such that in a blocking mode of the clamping diode an electric field strength has a maximum value in a distance to a metal-semiconductor interface between the semiconductor body and a metal anode of the clamping diode.

5. The electric assembly of claim 4 , wherein the clamping diode comprises a Schottky contact between the semiconductor body and the metal anode.

6. The electric assembly of claim 1 , wherein the clamping diode comprises a central region in a vertical projection of both a metal anode and a metal cathode as well as a termination region surrounding the central region, and wherein a breakdown voltage in the central region is lower than a breakdown voltage in the termination region.

7. The electric assembly of claim 1 , wherein the clamping diode is a merged pin Schottky (MPS) diode.

8. The electric assembly of claim 1 , wherein the clamping diode is a trench MOS barrier Schottky diode.

9. The electric assembly of claim 1 , wherein the clamping diode is a trench oxide pin diode (TOPS) diode.

10. The electric assembly of claim 1 , wherein the clamping diode is an inverse-iniection-dependency-of-emitter-efficiency (IDEE) diode.

11. The electric assembly of claim 1 , wherein the clamping diode is a SiC pin diode.

12. The electric assembly of claim 1 , further comprising:
a free-wheeling diode connected between the two load terminals in parallel to the switching device and to the clamping diode, wherein an avalanche voltage of the clamping diode is lower than a breakdown voltage of the free-wheeling diode.

13. The electric assembly of claim 12 , wherein the free-wheeling diode comprises a silicon pin diode.

14. The electric assembly of claim 12 , wherein the free-wheeling diode comprises a silicon carbide Schottky diode.

15. The electric assembly of claim 1 , further comprising:
at least one further semiconductor switching device electrically arranged in parallel to the switching device.

16. The electric assembly of claim 1 , wherein the switching device comprises a silicon insulated gate bipolar transistor (Si-IGBT).

17. The electric assembly of claim 1 , further comprising:
a feedback circuit electrically connecting an anode electrode of the clamping diode with a gate electrode of the switching device,
wherein the feedback circuit is configured to increases a gate voltage at the gate electrode with increasing current through the reverse-biased clamping diode.

18. The electric assembly of claim 17 , further comprising:
a feedback impedance electrically connected between the anode electrode of the clamping diode and the second load terminal,
wherein the feedback circuit comprises a feedback path electrically connecting the anode electrode of the clamping diode with a control element electrically connected to the gate electrode of the switching device,
wherein the control element is configured to increase a gate voltage at the gate electrode with increasing current through the reverse-biased clamping diode.

19. The electric assembly of claim 18 , wherein the control element is selected from the group consisting of a voltage-controllable voltage, a current source and a gate driver circuit.

20. The electric assembly of claim 1 , wherein the avalanche voltage of the clamping diode is lower than the maximum breakdown voltage rating of the switching device for a total nominal temperature range and for a maximum current rating of the switching device.

21. The electric assembly of claim 1 , wherein the avalanche voltage of the amping diode is at least 300V.

22. An electronic assembly, comprising:
a low-side switch comprising a first electric assembly and a high-side switch comprising a second electric assembly, the low-side switch and the high-side switch electrically arranged in a half-bridge configuration,
wherein at least one of the electric assemblies comprises:
a semiconductor switching device configured to withstand a maximum breakdown voltage rating across two load terminals in an off-state; and
a clamping diode electrically connected to the two load terminals and parallel to the switching device, wherein a semiconductor body of the clamping diode comprises silicon carbide and an avalanche voltage of the clamping diode is lower than the maximum breakdown voltage rating of the switching device for a nominal temperature range of the switching device.

23. An insulated gate bipolar transistor module, comprising:
a half-bridge circuit, comprising a low-side switch comprising a first electric assembly and a high-side switch comprising a second electric assembly,
wherein at least one of the electric assemblies comprises:
a semiconductor switching device configured to withstand a maximum breakdown voltage rating across two load terminals in an off-state; and
a clamping diode electrically connected to the two load terminals and parallel to the switching device, wherein a semiconductor body of the clamping diode comprises silicon carbide and an avalanche voltage of the clamping diode is lower than the maximum breakdown voltage rating of the switching device for a nominal temperature range of the switching device.

24. The insulated gate bipolar transistor module of claim 23 , further comprising:
a gate driver electrically connected to gate terminals of the electric assemblies.

25. An electric assembly, comprising:
a semiconductor switching device configured to withstand a maximum breakdown voltage rating across two load terminals in an off-state;
a clamping diode electrically connected to the two load terminals and parallel to the switching device, wherein an avalanche voltage of the clamping diode is lower than the maximum breakdown voltage rating of the switching device; and
a feedback circuit electrically connecting an anode electrode of the clamping diode with a gate electrode of the switching device,
wherein the feedback circuit is configured to increase or decrease a gate voltage at the gate electrode with increasing current through the reverse-biased clamping diode.

26. The electric assembly of claim 25 , wherein a semiconductor body of the clamping diode comprises silicon carbide.

Assignees

• Infineon Technologies Ag
• Infineon Techonologies Ag

Inventors

• Basler Thomas
• Baburske Roman
• Laven Johannes Georg

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/5475

  multiple bond wires connected to common bond pads at both ends of the wires · CPC title

• H10W72/5473

  multiple bond wires connected to a common bond pad · CPC title

• H10W72/5445

  being orthogonal to a side surface of the chip, e.g. parallel arrangements · CPC title

• H10W90/00

  Package configurations · CPC title