Efficient heat removal from component carrier with embedded diode

Patent metadata

Field	Value
Publication number	US-10332818-B2
Application number	US-201815880055-A
Country	US
Kind code	B2
Filing date	Jan 25, 2018
Priority date	Jan 26, 2017
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

A component carrier has an interconnected stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure, a component embedded in the stack and a diode, and at least one heat removal layer configured for removing heat from the diode and substantially fully covering a whole main surface of the component carrier.

First claim

The invention claimed is:

1. A component carrier, comprising:
an interconnected stack comprising at least one electrically insulating layer structure and/or at least one electrically conductive layer structure;
a component embedded in the interconnected stack and comprising a diode; and
at least one heat removal layer configured for removing heat from the diode and substantially fully covering a whole main surface of the component carrier;
wherein the at least one electrically conductive layer structure comprises a first electrically conductive layer structure which is arranged spaced with regard to an electrically conductive layer as one of the at least one heat removal layer by an electrically insulating and thermally conductive layer as another one of the at least one heat removal layer;
wherein the first electrically conductive layer structure directly electrically contacts an entire first main surface of a respective one of a plurality of components.

2. The component carrier according to claim 1 , further comprising at least one of the following features:
wherein the component is a semiconductor chip in which the diode is monolithically integrated;
wherein the component comprises a cathode pad on one main surface of the component, and an anode pad on an opposing other main surface of the component.

3. The component carrier according to claim 2 , further comprising at least one of the following features:
wherein the cathode pad covers the entire main surface of the component and/or the anode pad covers only part of the opposing other main surface of the component;
wherein at least one of the cathode pad and the anode pad comprises or consists of a metal.

4. The component carrier according to claim 1 , further comprising a plurality of components embedded in the interconnected stack and each comprising a respective diode.

5. The component carrier according to claim 4 , further comprising at least one of the following features:
wherein the components are electrically connected to form a rectifier bridge;
wherein the components are located coplanar.

6. The component carrier according to claim 1 , wherein the at least one electrically conductive layer structure comprises a second electrically conductive layer structure which is arranged spaced with regard to the first electrically conductive layer structure at least by the component and one of the at least one electrically insulating layer structure.

7. The component carrier according to claim 6 , further comprising at least one of the following features:
wherein the second electrically conductive layer structure electrically contacts only a part of a second main surface of the component, a plurality of sections each electrically contacting a respective part of the second main surface of a respective one of a plurality of components;
a plurality of first vertical interconnect structures directly contacting both the second electrically conductive layer structure and the part of the second main surface of the component, wherein at least one of the first vertical interconnect structures, the at least one second vertical interconnect structure and the third vertical interconnect structures comprises at least one of the group consisting of a metal filled laser drill hole, a metal filled mechanical drill hole, a metallic inlay, and a micro-via;
at least one second vertical interconnect structure directly contacting both the first electrically conductive layer structure and the second electrically conductive layer structure.

8. The component carrier according to claim 1 , wherein the at least one electrically conductive layer structure comprises a third electrically conductive layer structure forming at least part of another main surface of the component carrier opposing the main surface formed by the at least one heat removal layer comprising solder material on the third electrically conductive layer structure.

9. The component carrier according to claim 8 , further comprising at least one of the following features:
wherein the third electrically conductive layer structure is a patterned electrically conductive layer composed of a plurality of electrically decoupled separate islands;
a plurality of third vertical interconnect structures directly contacting both the second electrically conductive layer structure and the third electrically conductive layer structure.

10. The component carrier according to claim 1 , further comprising at least one of the following features:
wherein the at least one heat removal layer comprises or consists of an electrically conductive material having a value of thermal conductivity of at least 50 W/mK;
wherein the at least one heat removal layer comprises or consists of an electrically insulating material having a value of thermal conductivity of at least 3 W/mK;
wherein the component comprises a further interconnected stack comprising at least one further electrically insulating layer structure and/or at least one further electrically conductive layer structure in which the diode is embedded so that the component and the stack form a board-in-board array;
wherein the at least one heat removal layer comprises or consists of a material of the group consisting of copper, aluminum, diamond-like carbon, graphene, highly thermally conductive prepreg, and a resin filled with thermally highly conductive filler particles;
wherein the at least one electrically conductive layer structure comprises at least one of the group consisting of copper, aluminum, nickel, silver, gold, palladium, and tungsten, any of the mentioned materials being optionally coated with supra-conductive material;
wherein the at least one electrically insulating layer structure comprises at least one of the group consisting of resin, epoxy resin or Bismaleimide-Triazine resin, FR-4, FR-5, cyanate ester, polyphenylene derivate, glass, prepreg material, polyimide, polyamide, liquid crystal polymer, epoxy-based Build-Up Film, polytetrafluoroethylene, a ceramic, and a metal oxide;
shaped as a plate;
wherein the component carrier is configured as one of the group consisting of a printed circuit board, and a substrate.

11. An electronic device, comprising:
a coupling structure;
a component carrier having an interconnected stack formed with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure,
a component embedded in the interconnected stack and having a diode, and
at least one heat removal layer arranged to remove heat from the diode and substantially fully covering a main surface of the component carrier, the component carrier mechanically connected with the coupling structure so that the diode is electrically coupled to the coupling structure;
wherein the at least one electrically conductive layer structure comprises a first electrically conductive layer structure which is arranged spaced with regard to an electrically conductive layer as one of the at least one heat removal layer by an electrically insulating and thermally conductive layer as another one of the at least one heat removal layer;
wherein the first electrically conductive layer structure directly electrically contacts an entire first main surface of a respective one of a plurality of components.

12. The electronic device according to claim 11 , further comprising at least one of the following features:
the electronic device is configured as at least one of the group consisting of a mains adapter, a rectifier, a DC/DC converter, and a power electronic device;
a heat sink body thermally coupled to the at least one heat removal layer;
wherein the coupling structure is selected from a g

Assignees

• Austria Tech & System Tech
• At & S Austria Tech & Systemtechnik Ag

Inventors

• Morianz Mike
• Weis Gerald
• Stahr Johannes

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/944

  Dispositions of multiple bond pads · CPC title

• H10W72/874

  On different surfaces · CPC title