Efficient heat removal from component carrier with embedded diode
US-10332818-B2 · Jun 25, 2019 · US
This patent family groups 2 related publications across US. Members often share priority claims or equivalent filings in different countries.
| Field | Value |
|---|---|
| Family ID | 57963007 |
| Family type | — |
| Earliest priority | Jan 26, 2017 |
| First filing country | US |
| Member publications | 2 |
| Countries | US |
| Representative publication | US10332818B2 — Efficient heat removal from component carrier with embedded diode |
Best representative member for this family based on priority and filing country.
US10332818B2 — Efficient heat removal from component carrier with embedded diode (published Jun 25, 2019)
Related publications in this family.
US-10332818-B2 · Jun 25, 2019 · US
US-2018211899-A1 · Jul 26, 2018 · US