Ceramic pressure measurement cell and method for production thereof

Patent metadata

Field	Value
Publication number	US-10330549-B2
Application number	US-201414891413-A
Country	US
Kind code	B2
Filing date	Apr 22, 2014
Priority date	May 17, 2013
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

A pressure measurement cell, comprising: a ceramic measurement membrane and a ceramic counterpart. The measurement membrane is joined to the counterpart in a pressure-tight manner forming a pressure chamber between the measurement membrane and the counterpart by means of an active brazing solder. The pressure measurement cell furthermore has a solder stop layer on a surface of the measurement membrane and/or the counterpart, wherein the solder stop layer has a metal oxide or a reduced form of the metal oxide. The metal oxide has at least one oxidation stage, which, assuming an activity coefficient of Rakt=1 at an inverse temperature of 8·10−4/K, has an oxygen coexistence decomposition pressure of not less than 1−23 MPa (10−23· bar) and not more than 1−12 MPa (10−12· bar) and which, assuming an activity coefficient of Rakt=1, at an inverse temperature of 9·10−4/K has an oxygen coexistence decomposition pressure of not less than 1−27 MPa (10−27 bar) and not more than 1−15 MPa (10−15 bar). Suitable metal oxides are, for example, oxides of chromium, tungsten or titanium.

First claim

The invention claimed is:

1. A method of bonding two ceramic components using an active brazing solder, comprising:
providing the two ceramic components;
preparing a solder stop layer on at least one surface of at least one ceramic component, which separates a portion of the surface to be wetted by the solder from a portion to be kept free of the solder;
providing the active brazing solder between the first and the second ceramic component in the surface areas of the first and of the second component to be wetted by the active brazing solder;
heating the ceramic components and the active brazing solder under vacuum up to a temperature at which the active brazing solder melts and reacts with the ceramic components; and
allowing the ceramic components to cool down, wherein:
the solder stop layer comprises a metal oxide, which has an oxygen coexistence decomposition pressure of not less than 10 −24 MPa (10 −23· bar) and not more than 10 −13 MPa (10 −12· bar) at an inverse temperature of 8·10 −4 /K and an oxygen coexistence decomposition pressure of not less than 10 −28 MPa (10 −27 bar) and not more than 10 −16 MPa (10 −15 bar) at an inverse temperature of 9·10 −4 /K;
for producing a pressure measurement cell, the first ceramic component comprises a counterpart and a second ceramic component comprises a measurement membrane, wherein the counterpart is connected pressure-tight with the measurement membrane by means of a joint, formed by said active brazing solder;
the ceramic material of said measurement membrane and said counterpart comprise an aluminum oxide ceramic;
said active brazing solder comprises a Zi-Ni—Ti— containing active brazing solder; and
said solder stop layer has a thickness of no more than 0.2 micron;
wherein the preparation of the solder stop layer comprises sputtering or gas phase deposition of the metal, followed by oxidation; and
wherein the oxidation is carried out by heating in an oxygen-containing atmosphere, and said oxidation takes place by heating to a temperature of not less than 500° C.

2. The method according to claim 1 , wherein:
the solder stop layer comprises an oxide of titanium, chromium or tungsten.

3. The method according to claim 1 , wherein:
the joining of the ceramic components with the active brazing solder material takes place at a temperature of not less than 800° C.

4. The method according to claim 1 , wherein:
the solder stop layer separates a convex surface section that is not to be wetted by the active brazing solder material from a surface section that is to be wetted by the active brazing solder.

5. The method according to claim 1 , wherein: the solder stop layer comprises TiO 2 , Ti 4 O 7 , Cr 2 O 3 , WO 3 and/or WO 2 .

6. The method according to claim 1 , wherein: said oxidation takes place by heating to a temperature of not less than 600° C.

7. The method according to claim 1 , wherein: the oxidation is carried out by heating in air.

8. A method of bonding two ceramic components using an active brazing solder, comprising:
providing the two ceramic components;
preparing a solder stop layer on at least one surface of at least one ceramic component, which separates a portion of the surface to be wetted by the solder from a portion to be kept free of the solder;
providing the active brazing solder between the first and the second ceramic component in the surface areas of the first and of the second component to be wetted by the active brazing solder;
heating the ceramic components and the active brazing solder under vacuum up to a temperature at which the active brazing solder melts and reacts with the ceramic components; and
allowing the ceramic components to cool down, wherein:
the solder stop layer comprises a metal oxide, which has an oxygen coexistence decomposition pressure of not less than 10 −24 MPa (10 −23 bar) and not more than 10 −13 MPa (10 −12 bar) at an inverse temperature of 8·10 −4 /K and an oxygen coexistence decomposition pressure of not less than 10 −28 MPa (10 −27 bar) and not more than 10 −16 MPa (10 −15 bar) at an inverse temperature of 9·10 −4 /K,
the preparation of the solder stop layer comprises sputtering or gas phase deposition of the metal, followed by oxidation, and
the oxidation is carried out by heating in an oxygen-containing atmosphere, and said oxidation takes place by heating to a temperature of not less than 500° C.

9. The method of claim 8 , wherein the oxidation is carried out by heating in air.

Assignees

• Endress Hauser Gmbh Co Kg
• Endress Hauser Se Co Kg

Inventors

• Ponath Nils
• Rossberg Andreas

Classifications

• C04B2237/122

  based on refractory metals · CPC title

• C04B2237/592

  whereby the interlayer is not continuous, e.g. not the whole surface of the smallest substrate is covered by the interlayer · CPC title

• C04B2237/62

  Forming laminates or joined articles comprising holes, channels or other types of openings · CPC title

• G01L9/0075 Primary

  using a ceramic diaphragm, e.g. alumina, fused quartz, glass · CPC title

• B23K35/3606

  Borates or B-oxides · CPC title