Component parts produced by thermoplastic processing of polymer/boron nitride compounds, polymer/boron nitride compounds for producing such component parts, method for producing such component parts and use thereof

Patent metadata

Field	Value
Publication number	US-10328620-B2
Application number	US-201415029526-A
Country	US
Kind code	B2
Filing date	Oct 13, 2014
Priority date	Oct 14, 2013
Publication date	Jun 25, 2019
Grant date	Jun 25, 2019

Abstract

The invention relates to a method for producing a component part having a wall thickness of at most 3 mm on at least one part of the component part, comprising the method step of injection molding by means of an injection mold in an injection molding machine using a polymer/boron nitride compound, wherein the polymer/boron nitride compound comprises a thermoplastically processable polymer material and a heat-conducting filler, wherein the filler comprises platelet-shaped hexagonal boron nitride particles and wherein the injection rate during injection-molding is at most 200 mm/s. The invention further relates to a component part produced using such a method and a polymer/boron nitride compound for producing such a component part. The invention further relates to the use of such a component part for heat dissipation of component parts and assemblies to be cooled.

First claim

The invention claimed is:

1. A method for producing a component part, the component part having a wall thickness of at most 3 mm on at least one part of the component part, comprising injection molding a compound at a melt temperature, the compound comprising a thermoplastically processable polymer material and platelet-shaped hexagonal boron nitride particles, at an injection rate of at most 200 mm/s; wherein
the polymer/boron nitride compound contains no glass fibers;
the melt temperature of the compound during the injection molding is at least 10° C. and at most 60° C. higher than the melting temperature of the polymer material without heat-conducting filler; and either
(a) (i) the injection molding takes place at a mold temperature of at least 30° C. and at most 120° C. lower than the heat deflection temperature of the polymer material without heat-conducting filler, as measured at 0.45 MPa according to DIN EN ISO 75-1/-2, and
(ii) the through-plane thermal conductivity of the component part is at least 1 W/m*K and less than 2.5 W/m*K as measured according to DIN EN ISO 22007-4 on disk-shaped injection-molded samples having a thickness of 2 mm; or

(b) (iii) the injection molding takes place at a mold temperature of at least 5° C. and at most 70° C. lower than the heat deflection temperature of the thermoplastically processable polymer without heat-conducting filler, as measured at 0.45 MPa according to DIN EN ISO 75-1/-2, and
(iv) the through-plane thermal conductivity of the component part is at least 2.5 W/m*K as measured according to DIN EN ISO 22007-4 on disk-shaped injection-molded samples having a thickness of 2 mm.

2. The method of claim 1 , wherein
(a) (i) the injection molding takes place at a mold temperature of at least 30° C. and at most 120° C. lower than the heat deflection temperature of the polymer material without heat-conducting filler, as measured at 0.45 MPa according to DIN EN ISO 75-1/-2, and
(ii) the through-plane thermal conductivity of the component part is at least 1 W/m*K and less than 2.5 W/m*K as measured according to DIN EN ISO 22007-4 on disk-shaped injection-molded samples having a thickness of 2 mm.

3. The method of claim 2 , wherein the melt temperature of the compound is at least 20° C. and at most 50° C.

4. The method of claim 2 , wherein the injection rate is ≤175 mm/s.

5. The method of claim 4 , wherein the injection rate is ≤70 mm/s.

6. A component part having a wall thickness of at most 3 mm on at least one part of the component part, obtained by the method according to claim 2 .

7. The method of claim 1 , wherein
(b) (iii) the injection molding takes place at a mold temperature of at least 5° C. and at most 70° C. lower than the heat deflection temperature of the thermoplastically processable polymer without heat-conducting filler, as measured at 0.45 MPa according to DIN EN ISO 75-1/-2, and
(iv) the through-plane thermal conductivity of the component part is at least 2.5 W/m*K as measured according to DIN EN ISO 22007-4 on disk-shaped injection-molded samples having a thickness of 2 mm.

8. The method of claim 7 , wherein the melt temperature of the compound during the injection molding is at least 20° C. and at most 50° C. lower than the heat deflection temperature of the polymer material without heat-conducting filler, as measured at 0.45 MPa according to DIN EN ISO 75-1/-2.

9. The method of claim 7 , wherein the injection rate is ≤175 mm/s.

10. The method of claim 9 , wherein the injection rate is ≤70 mm/s.

11. A component part having a wall thickness of at most 3 mm on at least one part of the component part, obtained by the method according to claim 7 .

12. A method for producing a component part, the component part having a wall thickness of at most 3 mm on at least one part of the component part, comprising injection molding a compound at a melt temperature, the compound comprising a thermoplastically processable polymer material and platelet-shaped hexagonal boron nitride particles, at an injection rate of at most 200 mm/s; wherein
the compound contains glass fibers,
the injection rate during injection-molding is at least 50 mm/s,
the melt temperature of the compound during the injection molding is at least 10° C. and at most 60° C. higher than the melting temperature of the thermoplastically processable polymer without heat-conducting filler, and
the injection molding takes place at a mold temperature of at least 5° C. and at most 40° C. lower than the heat deflection temperature of the thermoplastically processable polymer without heat-conducting filler, as measured at 0.45 MPa according to DIN EN ISO 75-1/-2.

13. The method according to claim 12 , wherein the melt temperature of the compound during the injection molding is at least 20° C. and at most 55° C. higher than the melting temperature of the polymer material without heat-conducting filler, and wherein the injection molding takes place at a mold temperature of at least 10° C. and at most 30° C. lower than the heat deflection temperature of the thermoplastically processable polymer without heat-conducting filler, as measured at 0.45 MPa according to DIN EN ISO 75-1/-2.

14. The method of claim 12 , wherein the injection rate is ≤175 mm/s.

15. The method of claim 14 , wherein the injection rate is ≤70 mm/s.

16. A component part having a wall thickness of at most 3 mm on at least one part of the component part, obtained by the method according to claim 12 .

Assignees

• 3M Innovative Properties Co

Inventors

• Uibel Krishna B
• Schädel Robert

Classifications

• B29C2945/76531

  Temperature · CPC title

• B29C45/0013 Primary

  using fillers dispersed in the moulding material, e.g. metal particles · CPC title

• B29C2945/76765

  Moulding material · CPC title

• B29K2509/08

  Glass · CPC title

• C08K2003/385

  Binary compounds of nitrogen with boron · CPC title