Inter-stage network for radio frequency amplifier

Patent metadata

Field	Value
Publication number	US-10326409-B2
Application number	US-201715840895-A
Country	US
Kind code	B2
Filing date	Dec 13, 2017
Priority date	Dec 16, 2016
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

A device includes a substrate and a package input terminal. The device includes a driver amplifier mounted to the substrate and configured to receive a radio frequency input signal. A first amplifier is mounted to the substrate. The first amplifier includes a first amplifier input terminal. A second amplifier is mounted to the substrate. The second amplifier includes a second amplifier input terminal. An inter-stage network is connected between the driver amplifier and the first amplifier and between the driver amplifier and the second amplifier. The inter-stage network includes a first capacitor connected between the driver amplifier and the first amplifier input terminal, and an inductor having a first terminal and a second terminal. The first terminal of the inductor is connected to the first capacitor. The inter-stage network includes a second capacitor connected between the second terminal of the inductor and the second amplifier input terminal.

First claim

The invention claimed is:

1. A device, comprising:
a driver amplifier having a driver output terminal;
a main amplifier configured to amplify a main input signal, the main amplifier having a main input terminal;
a peaking amplifier configured to amplify a peaking input signal, the peaking amplifier having a peaking input terminal;
an inter-stage network connected between the driver amplifier and the main amplifier and between the driver amplifier and the peaking amplifier, the inter-stage network including:
a first capacitor having a first terminal and a second terminal, the first terminal of the first capacitor being connected directly to the driver output terminal and the second terminal of the first capacitor being connected directly to the main input terminal to supply the main input signal,
an inductor having a first terminal and a second terminal, the first terminal of the inductor being connected directly to the first terminal of the first capacitor, and
a second capacitor having a first terminal and a second terminal, the first terminal of the second capacitor being connected directly to the second terminal of the inductor and the second terminal of the second capacitor being connected directly to the peaking input terminal to supply the peaking input signal; and

a resistor having a first terminal and a second terminal, wherein the first terminal of the resistor is connected directly to the first terminal of the second capacitor and the second terminal of the resistor is connected to a ground node.

2. The device of claim 1 , wherein the resistor is a variable resistor and changes to a resistance of the variable resistance modify a magnitude of the main input signal and a magnitude of the peaking input signal.

3. The device of claim 1 , wherein an output terminal of the main amplifier and an output terminal of the peaking amplifier are connected to an output power combiner.

4. The device of claim 1 , wherein the inductor is a transmission line configured to introduce a 90 degree phase shift in a signal passing through the transmission line.

5. The device of claim 4 , wherein the transmission line is a coplanar waveguide transmission line.

6. The device of claim 1 , wherein at least one of the driver amplifier and the peaking amplifier includes a transistor formed on a substrate selected from a silicon substrate, a gallium nitride substrate, a gallium arsenide substrate, and an indium gallium phosphide substrate.

7. A packaged device, comprising:
a substrate;
a package input terminal configured to receive a radio frequency input signal;
a driver amplifier mounted to the substrate and configured to receive the radio frequency input signal;
a first amplifier mounted to the substrate, the first amplifier including a first amplifier input terminal;
a second amplifier mounted to the substrate, the second amplifier including a second amplifier input terminal;
an inter-stage network connected between the driver amplifier and the first amplifier and between the driver amplifier and the second amplifier, the inter-stage network including:
a first capacitor connected between the driver amplifier and the first amplifier input terminal,
an inductor having a first terminal and a second terminal, the first terminal of the inductor being connected to the first capacitor, and
a second capacitor connected between the second terminal of the inductor and the second amplifier input terminal; and

a variable resistor connected between the second capacitor and a ground node, wherein changes to a resistance of the variable resistor modify a magnitude of an input signal to the first amplifier and a magnitude of a second input signal to the second amplifier.

8. The packaged device of claim 7 , wherein a capacitance of the first capacitor is determined by a ratio of an output radio frequency voltage magnitude of the first amplifier and a radio frequency input drive voltage of the first amplifier.

9. The packaged device of claim 7 , wherein an output terminal of the first amplifier and an output terminal of the second amplifier are connected to an output power combiner.

10. The packaged device of claim 7 , wherein the inductor is a transmission line configured to introduce a 90 degree phase shift in a signal passing through the transmission line.

Assignees

• Nxp Usa Inc

Inventors

• Blednov Igor

Classifications

• H03F3/60

  Amplifiers in which coupling networks have distributed constants, e.g. with waveguide resonators (H03F3/54 takes precedence) · CPC title

• H10W44/234

  Arrangements for impedance matching · CPC title

• H10W44/20

  at high-frequency [HF] or radio frequency [RF] · CPC title

• H03F2200/75

  the amplifier stage being a common source configuration MOSFET · CPC title

• H03F2200/54

  Two or more capacitor coupled amplifier stages in cascade · CPC title