Methods and applications of non-planar imaging arrays

Patent metadata

Field	Value
Publication number	US-10325951-B2
Application number	US-201715620181-A
Country	US
Kind code	B2
Filing date	Jun 12, 2017
Priority date	Oct 7, 2008
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.

First claim

What is claimed is:

1. A flexible imaging sensor to sense an area of tissue, the sensor comprising:
at least one imaging element including a semiconductor based photo detector;
a processor in electrical communication to the at least one imaging element to capture an image of the area of tissue; and
at least one stretchable interconnect, the at least one stretchable interconnect coupling the at least one imaging element to the processor.

2. The flexible imaging sensor of claim 1 , wherein the at least one imaging element is one of a plurality of imaging elements arranged in an array, the array being flexible to adhere to the area of tissue.

3. The flexible imaging array of claim 2 , wherein each imaging element includes a pn junction blocking diode, an active amplifier, and an analog to digital converter each coupled to the photo detector.

4. The flexible imaging array of claim 1 , wherein the at least one imaging element is formed on a crystalline silicon substrate.

5. The flexible imaging array of claim 1 , wherein the at least one imaging element is encapsulated with a polymer layer.

6. The flexible imaging array of claim 2 , wherein each imaging element is an active pixel sensor.

7. The flexible imaging array of claim 1 , further comprising a light source to provide illumination to the at least one imaging element for illuminating the tissue of interest.

8. The flexible imaging array of claim 7 , wherein the light source is an optical fiber or a light emitting diode (LED).

9. The flexible imaging array of claim 1 , wherein the at least one imaging element includes a micro lens disposed over the photo detector.

10. The flexible imaging array of claim 1 , wherein the processor determines blood flow from the sensed optical characteristic of the tissue.

11. The flexible imaging array of claim 1 , wherein the processor determines a pulse or a photoplethysmography (PPG) based on the sensed optical characteristic of the tissue.

12. A blood flow sensor for attachment to an area of tissue, the sensor comprising:
a photo detector based pixel sensor operable for sensing the area of tissue when the area of tissue is in sufficient proximity to the photo detector;
a processor coupled to the pixel sensor to sense the blood flow through the area of tissue based on changes in the optical signal from the area of tissue detected by the pixel sensor; and
at least one stretchable interconnect, the at least one stretchable interconnect coupling the pixel sensor to the processor.

13. The flexible imaging sensor of claim 12 , wherein the pixel sensor is one of a plurality of pixel sensors arranged in an array, the array being flexible to adhere to the area of tissue.

14. A blood pressure sensor for attachment to an area of tissue, the sensor comprising:
a photo detector based pixel sensor operable for sensing the area of tissue when the area of tissue is in sufficient proximity to the pixel sensor;
a processor coupled to the pixel sensor to sense blood pressure or photoplethysmography (PPG) based on changes in the optical signals from the area of tissue detected by the pixel sensor; and
at least one stretchable interconnect, the at least one stretchable interconnect coupling the pixel sensor to the processor.

15. The blood pressure sensor of claim 14 , wherein the pixel sensor is one of a plurality of pixel sensors arranged in an array, the array being flexible to adhere to the area of tissue.

Assignees

• Mc10 Inc

Inventors

• Graff Bassel De
• Callsen Gilman
• Arora William J
• Ghaffari Roozbeh

Classifications

• H10W90/10

  Configurations of laterally-adjacent chips · CPC title

• H10W70/093

  Connecting or disconnecting other interconnections thereto or therefrom, e.g. connecting bond wires or bumps · CPC title

• H10W70/60

  Insulating or insulated package substrates; Interposers; Redistribution layers (leadframes H10W70/40) · CPC title

• A61B2562/0233

  Special features of optical sensors or probes classified in A61B5/00 · CPC title

• A61B5/01

  Measuring temperature of body parts {; Diagnostic temperature sensing, e.g. for malignant or inflamed tissue} (clinical contact thermometers G01K13/20) · CPC title