Thin film transistor, display substrate and display panel having the same, and fabricating method thereof

Patent metadata

Field	Value
Publication number	US-10325943-B2
Application number	US-201615533109-A
Country	US
Kind code	B2
Filing date	Dec 12, 2016
Priority date	Jun 23, 2016
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

The present application discloses a method of fabricating a thin film transistor, including forming a semiconductor layer having a pattern corresponding to that of the active layer on a base substrate; forming a first photoresist layer on a side of the semiconductor layer distal to the base substrate; the first photoresist layer being in an area corresponding to the channel region, the second doped region, and the fourth doped region; doping a region of the semiconductor layer corresponding to the first doped region and the third doped region using the first photoresist layer as a mask plate; forming a second photoresist layer by removing a portion of the first photoresist layer to expose an initial portion of the semiconductor layer corresponding to at least a portion of the second doped region and at least a portion of the fourth doped region; and doping the initial portion of the semiconductor layer using the second photoresist layer as a mask plate.

First claim

What is claimed is:

1. A method of fabricating a thin film transistor comprising:
forming an active layer having a channel region, a source contact region, and a drain contact region,
wherein forming the source contact region comprises forming a first doped region and forming a second doped region between the first doped region and the channel region,
forming the drain contact region comprises forming a third doped region and forming a fourth doped region between the third doped region and the channel region,
the first doped region is formed to have a higher dopant concentration than that of the second doped region, and
the third doped region is formed to have a higher dopant concentration that that of the fourth doped region;
wherein forming the active layer comprises:
forming a semiconductor layer having a pattern corresponding to that of the active layer on a base substrate;
forming a first photoresist layer on a side of the semiconductor layer distal to the base substrate; the first photoresist layer being in an area corresponding to the channel region, the second doped region, and the fourth doped region;
doping a region of the semiconductor layer corresponding to the first doped region and the third doped region using the first photoresist layer as a mask plate;
forming a second photoresist layer by removing a portion of the first photoresist layer to expose an initial portion of the semiconductor layer corresponding to at least a portion of the second doped region and at least a portion of the fourth doped region; and
doping the initial portion of the semiconductor layer using the second photoresist layer as a mask plate;
wherein doping the region of the semiconductor layer corresponding to the first doped region and the third doped region and doping the initial portion of the semiconductor layer are performed by doping a dopant directly on the semiconductor layer without permeating the dopant through an insulating layer.

2. The method of claim 1 , wherein doping the initial portion of the semiconductor layer is limited to only the second doped region and the fourth doped region, or portions thereof;
subsequent to doping the initial portion of the semiconductor layer, the region of the semiconductor layer corresponding to the first doped region and the third doped region has a higher dopant concentration than that of the initial portion of the semiconductor layer.

3. The method of claim 1 , subsequent to doping the initial portion of the semiconductor layer, further comprising performing following steps at least once:
removing a portion of the second photoresist layer to expose an additional portion of the semiconductor layer corresponding to an additional portion of the second doped region and an additional portion of the fourth doped region; and
doping the additional portion of the semiconductor layer using a remaining second photoresist layer as a mask plate;
wherein the additional portion of the second doped region is between the portion of the second doped region and the channel region, the additional portion of the fourth doped region is between the portion of the fourth doped region and the channel region; and
the initial portion of the semiconductor layer has a higher dopant concentration than that of the additional portion of the semiconductor layer.

4. The method of claim 3 , wherein removing the portion of the second photoresist layer is performed by ashing.

5. The method of claim 1 , wherein doping the initial portion of the semiconductor layer is performed by doping in a same process the region of the semiconductor layer corresponding to the first doped region and the third doped region, and the initial portion of the semiconductor layer; and
the region of the semiconductor layer corresponding to the first doped region and the third doped region has a higher dopant concentration than that of the initial portion of the semiconductor layer.

6. The method of claim 1 , subsequent to doping the initial portion of the semiconductor layer, further comprising performing following steps at least once:
removing a portion of the second photoresist layer to expose an additional portion of the semiconductor layer corresponding to an additional portion of the second doped region and an additional portion of the fourth doped region; and
doping in a same process the region of the semiconductor layer corresponding to the first doped region and the third doped region, the initial portion of the semiconductor layer, and any additional portion of the semiconductor layer;
wherein the additional portion of the second doped region is between the portion of the second doped region and the channel region, the additional portion of the fourth doped region is between the portion of the fourth doped region and the channel region;
the initial portion of the semiconductor layer has a higher dopant concentration than that of the additional portion of the semiconductor layer;
a dopant concentration in the source contact region decreases along a direction from the first doped region to the channel region; and
a dopant concentration in the drain contact region decreases along a direction from the third doped region to the channel region.

7. The method of claim 1 , wherein forming the semiconductor layer comprises:
forming a semiconductor material layer on the base substrate;
forming a photoresist material layer on a side of the semiconductor material layer distal to the base substrate;
exposing the photoresist material layer with a mask plate, and developing an exposed photoresist material layer to obtain a photoresist pattern having a first section corresponding to the active layer, a second section outside of the first section, the photoresist material layer being removed in the second section thereby forming a third photoresist layer in the first section; and
removing the semiconductor material layer in the second section thereby forming the semiconductor layer.

8. The method of claim 7 , wherein the mask plate is a half-tone mask plate or a gray-tone mask plate, the first section comprises a first zone and a second zone;
the first zone corresponding to the channel region, the second doped region, and the fourth doped region; the second zone corresponding to the first doped region and the third doped region;
the first zone is substantially unexposed, the second zone is partially exposed, and the second section is fully exposed;
the third photoresist layer in the first zone has a thickness greater than that in the second zone.

9. The method of claim 8 , wherein forming the first photoresist layer comprises ashing the third photoresist layer to remove the third photoresist layer in the second zone thereby exposing the region of the semiconductor layer corresponding to the first doped region and the third doped region;
wherein photoresist material in the first zone remains with a reduced thickness subsequent to ashing, thereby forming the first photoresist layer.

10. The method of claim 7 , subsequent to forming the semiconductor material layer and prior to forming the photoresist material layer, further comprising:
doping the semiconductor material layer;
wherein the channel region is doped with a dopant subsequent to doping the semiconductor material layer.

11. The method of claim 1 , wherein removing the portion of the first photoresist layer is performed by ashing.

12. The method of claim 1 , wherein the dopant is one of phosphor and boron.

13. The method of claim 1 , wherein the thin film transistor is a bottom gate-type thin film transistor, prior to forming the semiconductor layer, the method further comprising:
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Assignees

• Boe Technology Group Co Ltd
• Ordos Yuansheng Optoelectronics Co Ltd

Inventors

• Sun Chaochao
• Wang Chao
• Liu Huafeng
• Zhao Shengwei
• Shun Bule
• Yang Lei
• Hu Chongliang
• Yang Meng
• Lv Jingping
• Xie Lin
• Sun Shimin
• Ding Duolong

Classifications

• H10P76/2041

  Photolithographic processes · CPC title

• H10P30/204

  into Group IV semiconductors · CPC title

• H10P30/22

  using masks · CPC title

• H10P30/21

  of electrically active species · CPC title

• H10P14/3808

  using laser beams · CPC title