Electronic component handling apparatus, electronic component testing apparatus, and electronic component testing method

Patent metadata

Field	Value
Publication number	US-10324127-B2
Application number	US-201715617266-A
Country	US
Kind code	B2
Filing date	Jun 8, 2017
Priority date	Jun 8, 2017
Publication date	Jun 18, 2019
Grant date	Jun 18, 2019

Abstract

An electronic component handling apparatus ( 10 ) is provided which can improve the operation rate. The electronic component handling apparatus ( 10 ) includes: a contact arm ( 300 ) having a holding part ( 380 ) configured to hold a DUT ( 10 A), the contact arm ( 300 ) being configured to press the DUT ( 10 A) against a socket ( 410 ); an alignment device ( 200 ) including a camera ( 221 ) and a operation unit ( 230 ), the camera ( 221 ) being configured to image the DUT ( 10 A) to acquire image information, the operation unit ( 230 ) being configured to adjust a position of the holding part ( 380 ) within a range of a maximum alignment amount (AL max ); and a control device ( 105 ) configured to control the contact arm ( 300 ) and the alignment device ( 200 ). When a predetermined condition is not satisfied, the control device ( 105 ) controls the contact arm ( 300 ) and the alignment device ( 200 ) so as to perform preliminary alignment work at least once. When the predetermined condition is satisfied, the control device ( 105 ) controls the contact arm ( 300 ) and the alignment device ( 200 ) so as to perform main alignment work.

First claim

What is claimed is:

1. An electronic component handling apparatus configured to handle a device under test (DUT), the apparatus comprising:
a contact arm having a holding part configured to hold the DUT, the contact arm being configured to press the DUT against a socket;
an alignment device including an imaging part and a driving part, the imaging part being configured to image the DUT to acquire image information, and the driving part being configured to move the holding part within a maximum moveable amount so as to adjust a position of the holding part; and
a control device configured to control the contact arm and the alignment device, wherein,
the maximum movable amount is an invariable value,
the driving part cannot move the holding part over the maximum movable amount,
the control device calculates a correction amount for respectively positioning the holding part with respect to the socket on a basis of the image information,
the control device determines whether the correction amount is larger than the maximum movable amount,
when the correction amount is larger than the maximum movable amount, the control device controls the driving part to move the holding part by the maximum movable amount, and
when the correction amount is not larger than the maximum movable amount, the control device controls the driving part to move the holding part by the correction amount.

2. The electronic component handling apparatus according to claim 1 , wherein
when the correction amount is larger than the maximum movable amount, the control device controls the contact arm and the alignment device to perform a preliminary alignment work,
when the correction amount is not larger than the maximum movable amount, the control device controls the contact arm and the alignment device to perform main alignment work for relatively positioning the DUT with respect to the socket,
the preliminary alignment work includes:
a first operation in which the holding part holds the DUT,
a second operation in which the driving part moves the holding part by the maximum movable amount, and
a third operation in which the holding part places the DUT, and

the main alignment work includes:
a fourth operation in which the holding part holds the DUT again, and
a fifth operation in which the driving part moves the holding part by the correction amount, and

the control device controls the contact arm to press the DUT against the socket after the main alignment work.

3. The electronic component handling apparatus according to claim 2 , wherein
the socket is provided at a test head or at a tip of the holding part,
at least the preliminary alignment work of the preliminary alignment work and main alignment work includes an operation in which the imaging part images the DUT, and
the DUT imaged by the imaging part is in a state of being held by the holding part or in a state before being held by the holding part.

4. The electronic component handling apparatus according to claim 1 , wherein
the contact arm has
a base part,
an adjustment unit configured to relatively move and/or rotate the holding part with respect to the base part, and
a lock and free unit configured to restrain relative movement and/or rotation of the holding part with respect to the base part, and
the driving part includes an operation unit configured to operate the adjustment unit.

5. An electronic component testing apparatus configured to test a DUT, comprising:
the electronic component handling apparatus according to claim 1 ;
a test head to which the socket is attached; and
a tester to which the test head is electrically connected.

6. An electronic component testing method for relatively positioning a device under test (DUT) with respect to a socket using image information of the DUT and testing the DUT,
the electronic component testing method being performed using an electronic component handling apparatus,
the electronic component handling apparatus comprising:
a contact arm having a holding part configured to hold the DUT, the contact arm being configured to press the DUT against a socket; and
an alignment device including an imaging part and a driving part, the imaging part being configured to image the DUT to acquire image information, and the driving part being configured to move the holding part within a maximum movable amount so as to adjust a position of the holding part, wherein

the maximum alignment amount is an invariable value, and
the driving part cannot move the holding part over the maximum movable amount,
the method comprises:
calculating a correction amount for respectively positioning the holding part with respect to the socket on a basis of the image information,
determining whether the correction amount is larger than the maximum movable amount,
moving the holding part with the driving part by the maximum movable amount when the correction amount is larger than the maximum movable amount; and
moving the holding part with the driving part by the correction amount when the correction is not larger than the maximum movable amount.

Assignees

• Advantest Corp

Inventors

• Kato Yasuyuki
• Onozawa Masataka
• Nitta Keisuke

Classifications

• G01R31/2891 Primary

  related to sensing or controlling of force, position, temperature (G01R31/2874 takes precedence; sensing of force G01L; sensing of position G01B, G01D; sensing of temperature G01K; controlling in general G05) · CPC title

• G01R1/0433

  Sockets for IC's or transistors · CPC title

• G01R31/2893

  Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00) · CPC title