Heat sink for 5G massive antenna array and methods of assembling same

Patent metadata

Field	Value
Publication number	US-10320051-B2
Application number	US-201715638715-A
Country	US
Kind code	B2
Filing date	Jun 30, 2017
Priority date	Jun 30, 2017
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A massive array antenna apparatus is configured with a cantilevered heat pipe that allows a semiconductive millimeter-wave device to move independently from a heat-sink base during thermal expansion and contraction.

First claim

The invention claimed is:

1. A heat-transfer apparatus, comprising:
a heat-sink base including a heat-generating device mounting surface, a heat-pipe landing section set below the heat-generating device mounting surface, a cantilever ledge, and an access opening in the heat-sink base;
a pedestal;
a heat pipe including a pedestal section and a landing section that are separated by a cantilever section, wherein the heat pipe is physically attached to the pedestal at the pedestal section and physically attached to the heat-sink base at the heat-pipe landing section, wherein the heat pipe forms a cantilever at the cantilever ledge between the heat-pipe landing section and the pedestal section, and wherein the pedestal is suspended above the access opening.

2. The heat-transfer apparatus of claim 1 , wherein the cantilever ledge is a cantilever step, further including a recess set below the heat-pipe landing section and set apart from the heat-pipe landing section by the cantilever step.

3. The heat-transfer apparatus of claim 2 , wherein the heat-generating device mounting surface is a printed wiring board (PWB) mounting surface, further including:
a printed wiring board (PWB) including a heat-sink base mounting surface that is assembled to the PWB mounting surface, and a massive antenna array (MAA) mounting surface;
a massive antenna array (MAA) package substrate including a die side and an antenna-array side, wherein the MAA package substrate is mounted on the MAA mounting surface;
a millimeter-wave (mmWave) antenna array disposed on the antenna-array side;
a semiconductive mmWave device including an active surface and a backside surface, wherein the semiconductive mmWave device is flip-chip mounted on the die side; and
wherein the pedestal is physically bonded to the backside surface.

4. The heat-transfer apparatus of claim 3 , further including a front enclosure that mates to the heat-sink base and that exposes the mmWave antenna array.

5. The heat-transfer apparatus of claim 3 , wherein the pedestal is bonded to the semiconductive millimeter-wave device through a thermal interface material (TIM), wherein the TIM has a bond-line thickness (BLT) in a range from 20 micrometer (μm) to 50 μm.

6. The heat-transfer apparatus of claim 3 , wherein the pedestal is bonded to the semiconductive millimeter-wave device through a TIM, wherein the TIM has a BLT in a range from 25 μm to 40 μm.

7. The heat-transfer apparatus of claim 3 , wherein the PWB includes a through hole through which the pedestal inserts; and
an electrical bump array disposed on the MAA package substrate die side that surrounds the semiconductive mmWave device, wherein the electrical bump array is also disposed on the PWB.

8. The heat-transfer apparatus of claim 3 , wherein the heat-sink base includes a raised cooling structure and the PWB mounting surface is on a side opposite the raised cooling structure.

9. The heat-transfer apparatus of claim 3 , wherein the heat-sink base includes a raised cooling structure and the PWB mounting surface is on a side opposite the raised cooling structure, further including an enclosure that covers the semiconductive mmWave device that is attached to the pedestal and exposes the mmWave antenna array.

10. The heat-transfer apparatus of claim 3 , wherein the PWB includes a through hole through which the pedestal inserts;
an electrical bump array disposed on the MAA package substrate die side that surrounds the semiconductive mmWave device, wherein the electrical bump array is also disposed on the PWB; and
a front enclosure that mates to the heat-sink base and that exposes the mmWave antenna array.

11. The heat-transfer apparatus of claim 3 , wherein the cantilever step is a first step and the heat pipe is a first heat pipe, and wherein the first heat pipe pedestal section is exposed through the access opening, further including:
a subsequent heat pipe including a pedestal section and a landing section that are separated by a cantilever section, wherein the landing section is attached to a landing on the heat-sink base wherein the subsequent heat pipe landing section and the first heat pipe landing section are separated by the first heat pipe cantilever section, the subsequent heat pipe cantilever section, the first heat pipe pedestal section and the subsequent heat pipe pedestal section;
wherein the pedestal is a first pedestal, further including a subsequent pedestal attached to the subsequent heat pipe pedestal section;
wherein the PWB includes a through hole through which the first pedestal inserts, and a subsequent through hole through the subsequent pedestal inserts; and
an electrical bump array disposed on the MAA package substrate die side that surrounds the semiconductive millimeter-wave device, wherein the electrical bump array is also disposed on the printed wiring board.

12. The heat-transfer apparatus of claim 11 , further including a front enclosure that mates to the heat-sink base and that exposes the mmWave antenna array.

13. The heat-transfer apparatus of claim 3 , wherein the semiconductive millimeter-wave device is a first semiconductive mmWave device, further including:
a second- third- and fourth semiconductive mmWave device, each including an active surface and a backside surface, each of which is flip-chip mounted on the MAA package substrate die side, wherein each of the first, second, third and fourth semiconductive mmWave device is physically attached to the pedestal at respective backside surfaces;
wherein the PWB includes a through hole through which the pedestal inserts;
an electrical bump array disposed on the MAA package substrate die side that surrounds the semiconductive mmWave devices, wherein the electrical bump array is also disposed on the printed wiring board.

14. The heat-transfer apparatus of claim 3 , wherein the heat pipe is a first heat pipe, wherein the cantilever step is a first heat-sink step, and wherein the pedestal is a first pedestal, further including:
a third heat pipe also attached to the first heat-sink cantilever step;
a subsequent and a fourth heat pipe, each physically attached to a subsequent heat-sink cantilever step, wherein the first and subsequent heat-sink cantilever steps are part of the heat-sink base.

15. The heat-transfer apparatus of claim 3 , wherein the heat pipe is a first heat pipe, wherein the cantilever step is a first heat-sink cantilever step, and wherein the pedestal is a first pedestal, further including:
a third heat pipe also disposed on the first heat-sink cantilever step;
a subsequent and a fourth heat pipe physically attached to a subsequent heat-sink cantilever step, wherein the first and subsequent heat-sink cantilever steps are part of the heat-sink base.

16. The heat-transfer apparatus of claim 1 , further including:
wherein the MAA package substrate is a first MAA package substrate, further including subsequent, third and fourth MAA package substrates;
wherein the semiconductive millimeter-wave device is a first semiconductive millimeter-wave device and including subsequent, third and fourth semiconductive millimeter-wave devices;
wherein the heat pipe is a first heat pipe, further including subsequent, third and fourth heat pipes;
wherein the pedestal is a first pedestal, further including subsequent, third and fourth pedestals;
wherein each millimeter-wave device is flip-chip mounted on a respective MAA package substrate die side, wherein each millimeter-wave device is physically attached to a respective pedestal at respective backside surfaces;
wherein each pedestal is attached to a re

Assignees

• Intel Corp

Inventors

• Chiu Chia-Pin

Classifications

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W40/611

  Bolts or screws · CPC title

• H10W40/258

  Metallic materials (H10W40/254, H10W40/257, H10W40/255, H10W40/251, H10W40/253 take precedence) · CPC title

• H10W40/228

  the projecting parts being wire-shaped or pin-shaped · CPC title

• H10W40/70

  Fillings or auxiliary members in containers or in encapsulations for thermal protection or control · CPC title