Method for fully self-aligned via formation using a directed self assembly (DSA) process

Patent metadata

Field	Value
Publication number	US-10319637-B2
Application number	US-201715808473-A
Country	US
Kind code	B2
Filing date	Nov 9, 2017
Priority date	Nov 9, 2016
Publication date	Jun 11, 2019
Grant date	Jun 11, 2019

Abstract

A formed back-end-of-line (BEOL) metal line layer may include a plurality of metal lines with dielectric oxide caps that are disposed in between each metal lines. To overlay an interconnecting layer of metal lines on a selected metal line of the BEOL metal line layer, a block copolymer (BCP) may be formed on a patterning layer. Thereafter, a selective etching of the formed BCP creates a recess above the selected metal line. The created recess facilitates the overlaying of the interconnecting layer of metal lines.

First claim

What is claimed is:

1. A method of self-aligned via formation comprising:
depositing a guide pattern layer on a first layer that includes an alternating dielectric oxide caps and metal lines;
performing an etching process on the deposited guide pattern layer to expose a surface of the metal line and a portion of dielectric oxide caps adjacent to the surface of the metal line, the performing the etching process resulting in a guide pattern;
depositing a block copolymer (BCP) on the exposed surface of the metal line and the portion of the adjacent dielectric oxide caps;
annealing the deposited BCP to graft a first polymer and a second polymer on the exposed surface of the metal line and the portion of the adjacent dielectric oxide caps, respectively;
recessing the first polymer and the second polymer until uncovering a top surface of the guide pattern, wherein the recessing the first polymer and the second polymer is executed after annealing the deposited BCP;
etching the grafted first polymer on the exposed surface of the metal line after recessing the first polymer and the second polymer; and
forming a second layer of metal lines that interconnects with the exposed surface of the metal line.

2. The method of claim 1 further comprising:
forming a plurality of recesses on a layer of dielectric oxide material and a low-k insulating material;
forming the metal line on each recess;
performing an etching process on the dielectric oxide material and the formed metal lines to form the first layer that includes the alternating dielectric oxide caps and the metal lines.

3. The method of claim 1 , wherein the performing of the etching process on the guide pattern forms an initial isolation of the metal lines that are selected to interconnect with the second layer of metal lines.

4. The method of claim 1 , wherein the performing of the etching process on the guide pattern forms a guide pattern recess that is greater than the exposed surface of the metal line.

5. The method of claim 4 , wherein the grafted second polymer on the portion of adjacent dielectric oxide caps are aligned with walls of the formed guide pattern recess.

6. The method of claim 1 , wherein the exposed surface of the metal line includes a pitch width of 32 nm or less.

7. The method of claim 1 , wherein the grafted second polymer includes a type of insulating material.

8. The method of claim 1 , wherein the first layer that includes the alternating dielectric oxide caps and the metal lines is a back-end-of-line (BEOL) metal line layer.

9. A device comprising:
a back-end-of-line (BEOL) metal line layer that includes alternating dielectric oxide caps and metal lines;
a guide pattern formed on the BEOL metal line layer, wherein the guide pattern is etched to expose a surface of the metal line and a portion of dielectric oxide caps adjacent to the surface of the metal line;
a block copolymer (BCP) that is formed on the exposed surface of the metal line and the portion of the adjacent dielectric oxide caps, the BCP is annealed to graft a first polymer and a second polymer on the exposed surface of the metal line and the portion of the adjacent dielectric oxide caps, respectively, wherein the grafted first polymer is selectively etched to form an opening above the exposed surface of the metal line;
an interconnecting layer of metal lines that is formed on the opening above the exposed surface of the metal line.

10. The device of claim 9 , wherein a BEOL metal line layer formation includes:
forming a plurality of recesses on a layer of dielectric oxide material and a low-k insulating material;
forming the metal line on each recess; and
performing an etching process on the dielectric oxide material and the formed metal lines to form the BEOL metal line layer that includes the alternating dielectric oxide caps and the metal lines.

11. The device of claim 9 , wherein the guide pattern forms an initial isolation of the metal lines that are selected to interconnect with the interconnecting layer of metal lines.

12. The device of claim 9 , wherein guide pattern is etched to form a guide pattern recess that is greater than the exposed surface of the metal line.

13. The device of claim 12 , wherein the grafted second polymer on the portion of adjacent dielectric oxide caps are aligned with walls of the formed guide pattern recess.

14. The device of claim 9 , wherein the exposed surface of the metal line includes a pitch width of 32 nm or less.

15. The device of claim 9 , wherein the grafted second polymer includes a type of insulating material.

16. The device of claim 9 , wherein after the BCP annealing and before grafting of the first polymer on the exposed surface of the metal line and the portion of the adjacent dielectric oxide caps, recessing the first polymer and the second polymer until uncovering a top surface of the guide pattern.

17. A method of processing a substrate, the method comprising:
depositing a guide pattern layer on a back-end-of-line (BEOL) metal line layer that includes an alternating dielectric oxide caps and metal lines;
performing an etching process on the deposited guide pattern layer to expose a surface of the metal lines and a portion of dielectric oxide caps adjacent to the surface of the metal line of the BEOL metal line layer, the performing the etching process resulting in a guide pattern, wherein the performing of the etching process on the guide pattern forms an initial isolation of the metal lines that are selected to interconnect with an interconnecting layer of metal lines;
forming a block copolymer (BCP) on the exposed surface of the metal line and the portion of the adjacent dielectric oxide caps;
annealing the formed BCP to graft a first polymer and a second polymer on the exposed surface of the metal line and the portion of the adjacent dielectric oxide caps, respectively;
etching the grafted first polymer on the exposed surface of the metal line; and
forming the interconnecting layer of metal lines that interconnects with the exposed surface of the metal line of the BEOL metal line layer.

18. The method of claim 17 further comprising:
forming a plurality of recesses on a layer of dielectric oxide material and a low-k insulating material;
forming the metal line on each recess;
performing an etching process on the dielectric oxide material and the formed metal lines to form the BEOL metal line layer that includes the alternating dielectric oxide caps and the metal lines.

19. The method of claim 17 , wherein the performing of the etching process on the guide pattern forms a guide pattern recess having a greater width than the exposed surface of the metal line.

20. The method of claim 19 , wherein the grafted second polymer on the portion of adjacent dielectric oxide caps are aligned with walls of the formed guide pattern recess.

21. The method of claim 17 further comprising after annealing and before etching the grafted first polymer, recessing the first polymer and the second polymer until uncovering a top surface of the guide pattern.

Assignees

• Tokyo Electron Ltd

Inventors

• Mohanty Nihar
• Franke Elliott
• Farrell Richard

Classifications

• H10P50/287

  by chemical means · CPC title

• H10P50/283

  by chemical means · CPC title

• H10P14/6516

  of treatments performed after formation of the materials · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• H10W20/076

  in via holes or trenches · CPC title