High-current connector and high-current connection device

Patent metadata

Field	Value
Publication number	US-10312612-B2
Application number	US-201815981515-A
Country	US
Kind code	B2
Filing date	May 16, 2018
Priority date	May 25, 2017
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

A high-current connector and a high-current connection device, the high-current connection device comprises a circuit board and at least one group of (two) high-current connectors. Each high-current connector comprises a conductive mating member and a conductive combined shunt. The conductive mating member has a main body and an alignment soldering leg, the main body is formed as a columnar body and has a bottom surface and a top surface, the alignment soldering leg integrally extends from the bottom surface and protrudes from the bottom surface. The conductive combined shunt has a base portion combined with the main body and a plurality of shunt pins extending from at least two opposite sides of the base portion, and the plurality of shunt pins are positioned on both sides of the alignment soldering leg. The alignment soldering leg of the high-current connector is inserted into and electrically connected to the middle conductive holes of the circuit board, and the shunt pins of the high-current connector are respectively inserted into and electrically connected to the first conductive holes of the circuit board.

First claim

The invention claimed is:

1. A high-current connector, comprising:
a conductive mating member having a main body and one alignment soldering leg, the main body formed as a columnar body and having a bottom surface and a top surface opposite to the bottom surface, the alignment soldering leg integrally extending from the bottom surface and protruding from the bottom surface; and
a conductive combined shunt having a base portion combined with the main body and a plurality of shunt pins extending from at least two opposite sides of the base portion, and the plurality of shunt pins being positioned on both sides of the alignment soldering leg.

2. The high-current connector of claim 1 , wherein the main body further has a central axis passing through the bottom surface and the top surface and is formed as an axisymmetric columnar body with respect to the central axis, the alignment soldering leg integrally extends from the bottom surface along the central axis.

3. The high-current connector of claim 2 , wherein
the conductive mating member further has a ring flange adjacent to the bottom surface and integrally protruding outwardly from the main body in a radial direction and an engaging portion adjacent to the ring flange and integrally protruding outwardly from the main body in the radial direction and positioned between the ring flange and the top surface,
the base portion of the conductive combined shunt has an engaging hole which cooperates with the engaging portion and into which the engaging portion is inserted so that the conductive combined shunt and the conductive mating member are engaged and fixed in interference fit.

4. The high-current connector of claim 3 , wherein the engaging portion is formed as an annular comb.

5. The high-current connector of claim 3 , wherein the ring flange connects with the engaging portion, and an outer diameter of the ring flange is larger than an outer diameter of the engaging portion so that a portion of the ring flange protruding from the engaging portion can prevent the base portion of the conductive combined shunt from moving toward the bottom surface.

6. The high-current connector of claim 1 , wherein the main body further has a slot recessed from the top surface toward the bottom surface, the conductive mating member further has a plurality of elastic terminals provided in the slot of the main body.

7. A high-current connection device, comprising:
a circuit board having at least two mounting regions, each mounting region being provided with a middle conductive hole and a plurality of first conductive holes positioned on at least two sides of the middle conductive hole; and
at least one group of high-current connectors, each group having two high-current connectors, each high-current connector comprising:
a conductive mating member having a main body and an alignment soldering leg, the main body being formed as a columnar body and having a bottom surface and a top surface opposite to the bottom surface, the alignment soldering leg integrally extending from the bottom surface and protruding from the bottom surface, and
a conductive combined shunt having a base portion combined with the main body and a plurality of shunt pins extending from at least two opposite sides of the base portion, and the plurality of shunt pins being positioned on both sides of the alignment soldering leg;

the two high-current connectors being respectively provided in the two mounting regions, and the alignment soldering leg of each high-current connector being inserted into and electrically connected to the middle conductive hole of the corresponding mounting region, and the shunt pins of each high-current connector being respectively inserted into and electrically connected to the first conductive holes of the corresponding mounting region.

8. The high-current connection device of claim 7 , wherein each mounting region is further provided with a plurality of second conductive holes surrounding a periphery of the middle conductive hole and positioned between the middle conductive hole and the plurality of first conductive holes and a conductive medium provided on a surface of the mounting region, the plurality of second conductive holes are electrically connected with the corresponding high-current connector via the conductive medium.

9. The high-current connection device of claim 8 , wherein the conductive medium comprises a conductive pad provided on the surface of the mounting region in advance.

10. The high-current connection device of claim 8 , wherein the conductive medium comprises a solder layer coated on the surface of the mounting region during a soldering process.

11. The high-current connection device of claim 8 , wherein the conductive medium comprises a conductive pad provided on the surface of the mounting region in advance and a solder layer coated on the surface of the conductive pad during a soldering process.

12. The high-current connection device of claim 8 , wherein the conductive medium on the surface of each mounting region electrically connects the middle conductive hole, the plurality of first conductive holes and the plurality of second conductive holes in the mounting region together.

13. The high-current connection device of claim 7 , wherein the main body of each high-current connector further has a central axis passing through the bottom surface and the top surface and is formed as an axisymmetric columnar body with respect to the central axis, the alignment soldering leg integrally extends from the bottom surface along the central axis.

14. The high-current connection device of claim 13 , wherein
the conductive mating member of each high-current connector further has a ring flange adjacent to the bottom surface and integrally protruding outwardly from the main body in a radial direction and an engaging portion adjacent to the ring flange and integrally protruding outwardly from the main body in the radial direction and positioned between the ring flange and the top surface,
the base portion of the conductive combined shunt of each high-current connector has an engaging hole which cooperates with the engaging portion and into which the engaging portion is inserted so that the conductive combined shunt and the conductive mating member are engaged and fixed in interference fit.

15. The high-current connection device of claim 14 , wherein the engaging portion of each high-current connector is formed as an annular comb.

16. The high-current connection device of claim 15 , wherein the ring flange connects with the engaging portion, and an outer diameter of the ring flange is larger than an outer diameter of the engaging portion so that a portion of the ring flange protruding from the engaging portion can prevent the base portion of the conductive combined shunt from moving toward the bottom surface.

17. The high-current connection device of claim 7 , wherein the main body of each high-current connector further has a slot recessed from the top surface toward the bottom surface, the conductive mating member further has a plurality of elastic terminals provided in the slot of the main body.

Assignees

• Molex Llc

Inventors

• Ho Yi-Tse

Classifications

• H05K2201/10295

  Metallic connector elements partly mounted in a hole of the PCB · CPC title

• H01R12/707 Primary

  Soldering or welding · CPC title

• H05K2201/1059

  Connections made by press-fit insertion · CPC title

• H01R12/7052 Primary

  characterised by the locating members · CPC title

• H05K2201/10537

  Attached components · CPC title