Pane having an electrical connection element

US9967967B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9967967-B2
Application numberUS-201314424936-A
CountryUS
Kind codeB2
Filing dateJul 10, 2013
Priority dateSep 14, 2012
Publication dateMay 8, 2018
Grant dateMay 8, 2018

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A pane having an electrical connection element, the pane having: a substrate; an electrically conductive structure in a region of the substrate; and a connection element in a region of the electrically conductive structure, the connection element containing at least a chromium-containing steel. The connection element has a region which is crimped about a connecting cable and a soldering region connected to the electrically conductive structure by means of a lead-free solder.

First claim

Opening claim text (preview).

The invention claimed is: 1. A pane with at least one electrical connection element, comprising: a substrate; on a region of the substrate, an electrically conductive structure; and on a region of the electrically conductive structure, a connection element that comprises at least a chromium-containing steel, wherein the connection element has, at a distal end of the connection element, a region crimped around a connection cable, and a solder region that is connected to the electrically conductive structure via a leadfree solder material, and wherein the connection element comprises at least 66.5 wt.-% to 89.5 wt.-% iron, 10.5 wt.-% to 20 wt.-% chromium, 0 wt.-% to 1 wt.-% carbon, 0 wt.-% to 5 wt.-% nickel, 0 wt.-% to 2 wt.-% manganese, 0 wt.-% to 2.5 wt.-% molybdenum, 0 wt.-% to 2 wt.-% niobium, and 0 wt.-% to 1 wt.-% titanium. 2. The pane according to claim 1 , wherein an angle between the solder region and the crimped region is from 120° to 180°. 3. The pane according to claim 1 , which includes two to six connection elements disposed in a line. 4. The pane according to claim 1 , wherein a material thickness of the connection element is from 0.1 mm to 2 mm. 5. The pane according to claim 1 , wherein a difference between a coefficient of thermal expansion of the substrate and the coefficient of thermal expansion of the connection element is less than 5×10 −6 /° C. 6. The pane according to claim 1 , wherein the connection element comprises at least 77 wt.-% to 84 wt.-% iron, 16 wt.-% to 18.5 wt.-% chromium, 0 wt.-% to 0.1 wt.-% carbon, 0 wt.-% to 1 wt.-% manganese, 0 wt.-% to 1 wt.-% niobium, 0 wt.-% to 1.5 wt.-% molybdenum, and 0 wt.-% to 1 wt.-% titanium. 7. The pane according to claim 1 , wherein the substrate contains glass. 8. The pane according to claim 1 , wherein the electrically conductive structure contains at least silver and has a layer thickness of 5 μm to 40 μm. 9. The pane according to claim 1 , wherein a layer thickness of the solder material is less than or equal to 6.0×10 −4 m. 10. The pane according to claim 1 , wherein the solder material contains tin and bismuth, indium, zinc, copper, silver, or compositions thereof. 11. The pane according to claim 10 , wherein the solder material contains 35 wt.-% to 69 wt.-% bismuth, 30 wt.-% to 50 wt.-% tin, 1 wt.-% to 10 wt.-% silver, and 0 wt.-% to 5 wt.-% copper. 12. The pane according to claim 1 , wherein the connection element has at least a wetting layer that contains nickel, tin, copper, and/or silver. 13. A method for production of the pane with at least one electrical connection element, comprising: connecting a connection element to a connection cable by crimping in a region at a distal end of the connection element; applying a solder material on a bottom of a solder region of the connection element; disposing the connection element with the solder material on a region of an electrically conductive structure that is applied on a region of a substrate; and connecting the connection element, with energy input, to the electrically conductive structure. 14. A method comprising: applying the pane with at least one electrical connection element according to claim 1 , in buildings or in means of transportation for travel on land, in the air, or on water. 15. The pane according to claim 2 , wherein the angle between the solder region and the crimped region is from 150° to 170°. 16. The pane according to claim 3 , wherein a distance between adjacent connection elements is from 5 mm to 50 mm. 17. The pane according to claim 3 , wherein a distance between adjacent connection elements is from 10 mm to 20 mm. 18. The pane according to claim 4 , wherein a material thickness of the connection element is from 0.2 mm to 1 mm. 19. The pane according to claim 4 , wherein a material thickness of the connection element is from 0.3 mm to 0.5 mm. 20. The pane according to claim 7 , wherein the glass comprises: float glass, quartz glass, borosilicate glass, and/or soda lime glass. 21. The pane according to claim 8 , wherein the at least silver comprises silver particles and glass frits. 22. The method according to claim 14 , comprising: applying the pane with at least one electrical connection element according to claim 1 as a windshield, rear window, side window, and/or glass roof. 23. The method according to claim 14 , comprising: applying the pane with at least one electrical connection element according to claim 1 as a heatable pane or as a pane with an antenna function.

Assignees

Inventors

Classifications

  • for applying solder (H01R43/0228 takes precedence) · CPC title

  • comprising a U-shaped wire-receiving portion · CPC title

  • H05K1/0212Primary

    Printed circuits or mounted components having integral heating means · CPC title

  • Use of materials for the {conductive, e.g. } metallic pattern · CPC title

  • for antennas · CPC title

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What does patent US9967967B2 cover?
A pane having an electrical connection element, the pane having: a substrate; an electrically conductive structure in a region of the substrate; and a connection element in a region of the electrically conductive structure, the connection element containing at least a chromium-containing steel. The connection element has a region which is crimped about a connecting cable and a soldering region …
Who is the assignee on this patent?
Saint Gobain
What technology area does this patent fall under?
Primary CPC classification H05K1/0212. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue May 08 2018 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 2 related publications on this page (citations in our corpus or others sharing the same primary CPC).