Package comprising switches and filters

Patent metadata

Field	Value
Publication number	US-10312193-B2
Application number	US-201615235790-A
Country	US
Kind code	B2
Filing date	Aug 12, 2016
Priority date	Aug 12, 2016
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

A package includes a redistribution portion, a first portion, and a second portion. The first portion is coupled to the redistribution portion. The first portion includes a first switch comprising a plurality of switch interconnects, and a first encapsulation layer that at least partially encapsulates the first switch. The second portion is coupled to the first portion. The second portion includes a first plurality of filters. Each filter includes a plurality of filter interconnects. The second portion also includes a second encapsulation layer that at least partially encapsulates the first plurality of filters. The first portion includes a second switch positioned next to the first switch, where the first encapsulation layer at least partially encapsulates the second switch. The second portion includes a second plurality of filters positioned next to the first plurality of filters, where the secod encapsulation layer at least partially encapsulates the second plurality of filters.

First claim

What is claimed is:

1. A package comprising:
a redistribution portion including:
at least one dielectric layer; and
at least one redistribution interconnect, wherein the at least one redistribution interconnect is configured to provide impedance matching between a first switch die and at least one first filter die from a plurality of first filter dies;

a first portion coupled to the redistribution portion, the first portion including:
the first switch die comprising a plurality of switch interconnects, wherein the first switch die is configured to operate as a switch; and
a first encapsulation layer at least partially encapsulating the first switch die, wherein the first encapsulation layer touches the at least one dielectric layer of the redistribution portion; and

a second portion coupled to the first portion, the second portion including:
the plurality of first filter dies, each first filter die comprising a plurality of first filter interconnects, wherein each first filter die is configured to operate as a filter;
a second encapsulation layer at least partially encapsulating the plurality of first filter dies; and
a passivation layer coupled to the second encapsulation layer, the first encapsulation layer, and the first switch die, wherein the passivation layer is located between the first encapsulation layer and the second encapsulation layer.

2. The package of claim 1 , wherein the first portion further comprises a second switch die positioned next to the first switch die, wherein the first encapsulation layer at least partially encapsulates the second switch die.

3. The package of claim 1 , wherein the second portion further comprises a plurality of second filter dies positioned next to the plurality of first filter dies, wherein the second encapsulation layer at least partially encapsulates the plurality of second filter dies.

4. The package of claim 1 , wherein two neighboring filter dies from the plurality of first filter dies have a spacing of about 100 microns (μm) or less.

5. The package of claim 1 , wherein the second portion further comprises a through encapsulation interconnect that travels through the second portion, the through encapsulation interconnect is configured to provide an electrical path between the plurality of first filter dies and the redistribution portion.

6. The package of claim 5 , wherein the plurality of first filter dies and the first switch die are electrically coupled to each other through at least one electrical path that includes the plurality of first switch interconnects, the redistribution portion, the through encapsulation interconnect and the plurality of first filter interconnects.

7. The package of claim 1 , wherein the first switch die is located between the redistribution portion and the plurality of first filter dies.

8. The package of claim 1 , wherein the package is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.

9. An apparatus comprising:
a redistribution portion including:
at least one dielectric layer; and
at least one redistribution interconnect, wherein the at least one redistribution interconnect is configured to provide impedance matching between a first switching means and at least one first filtering means from a plurality of first filtering means;

a first portion coupled to the redistribution portion, the first portion including:
the first switching means comprising a plurality of switch interconnects, wherein the first switching means is configured to operate as a switch; and
a first encapsulation layer at least partially encapsulating the first switching means, wherein the first encapsulation layer touches the at least one dielectric layer of the redistribution portion; and

a second portion coupled to the first portion, the second portion including:
the plurality of first filtering means, each first filtering means comprising a plurality of filter interconnects, wherein each first filtering means is configured to operate as a filter;
a second encapsulation layer at least partially encapsulating the plurality of first filtering means; and
a passivation layer coupled to the second encapsulation layer, the first encapsulation layer, and the first switching means, wherein the passivation layer is located between the first encapsulation layer and the second encapsulation layer.

10. The apparatus of claim 9 , wherein the first portion further comprises a second switching means positioned next to the first switching means, the second switching means configured to operate as a switch, wherein the first encapsulation layer at least partially encapsulates the second switching means.

11. The apparatus of claim 9 , wherein the second portion further comprises a plurality of second filtering means positioned next to the plurality of first filtering means, each second filtering means configured to operate as a filter, wherein the second encapsulation layer at least partially encapsulates the plurality of second filtering means.

12. The apparatus of claim 9 , wherein two neighboring filtering means from the plurality of first filtering means have a spacing of about 100 microns (μm) or less.

13. The apparatus of claim 9 , wherein the second portion further comprises a through encapsulation interconnect that travels through the second portion, the through encapsulation interconnect configured to provide an electrical path between the plurality of first filtering means and the redistribution portion.

14. The apparatus of claim 9 , wherein the apparatus is incorporated into a device selected from the group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, an Internet of things (IoT) device, a laptop computer, a server, and a device in an automotive vehicle.

15. A method for fabricating a package, comprising:
forming a second portion that includes:
providing a plurality of first filter dies, each first filter die including a plurality of filter interconnects, wherein each filter die is configured to operate as a filter;
forming a second encapsulation layer that at least partially encapsulates the plurality of first filter, and
forming a passivation layer over the second encapsulation layer;

forming a first portion over the second portion, wherein forming the first portion includes:
providing a first switch die over the passivation layer, the first switch including a plurality of switch interconnects, wherein the first switch is configured to operate as a switch; and
forming a first encapsulation layer that at least partially encapsulates the first switch die; and

forming a redistribution portion over the first portion, wherein forming the redistribution portion includes:
forming at least one dielectric layer over the first encapsulation layer; and
forming at least one redistribution interconnect, wherein the at least one redistribution interconnect is configured to provide impedance matching between the first switch die and at least one first filter die from the plurality of first filter dies.

16. The method of claim 15 , where

Assignees

• Qualcomm Inc

Inventors

• Gu Shiqun
• Zuo Chengjie
• Fanelli Steve
• Masaracioglu Husnu Ahmet

Classifications

• H10W70/099

  Connecting interconnections to insulating or insulated package substrates, interposers or redistribution layers · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/874

  On different surfaces · CPC title

• H10W72/9413

  on encapsulations · CPC title

• H10W72/0198

  batch processes · CPC title