Epoxy resin containing silicone-modified epoxy resin and polyvalent carboxylic acid compound, and cured product thereof

Patent metadata

Field	Value
Publication number	US-10308803-B2
Application number	US-201514973162-A
Country	US
Kind code	B2
Filing date	Dec 17, 2015
Priority date	Dec 18, 2014
Publication date	Jun 4, 2019
Grant date	Jun 4, 2019

Abstract

A silicone-modified epoxy resin composition that offers a cured product excellent in low permeability to gas, mechanical strength, and heat resistance and transparency and further offers an optical semiconductor sealing material excellent in heat cycle resistance, and a cured epoxy resin product obtained by curing the composition. The epoxy resin composition comprises the following components (A) to (C):
(A) a silicone-modified epoxy resin having a cyclic siloxane structure, (B) a silicone-modified epoxy resin having a branched siloxane structure, and (C) an epoxy resin curing agent containing a polyvalent carboxylic acid having a tricyclodecane structure and a carboxylic anhydride compound.

First claim

What is claimed is:

1. An epoxy resin composition comprising the following components (A) to (C):
(A) a silicone-modified epoxy resin represented by the formula (1),

 wherein R 1 represents a monovalent aliphatic hydrocarbon group having 1 to 6 carbon atoms or a monovalent aromatic hydrocarbon group having 6 to 12 carbon atoms; X is selected from a group consisting of a 3,4-epoxycyclohexylethyl group and a 3-glycidoxypropyl group; n represents an integer of 1 to 3; and a plurality of groups R 1 or X present in the formula are the same or different from each other;
(B) a silicone-modified epoxy resin represented by the formula (2),

wherein R 1 and X are each as defined above; and a plurality of groups R 1 or X present in the formula are the same or different from each other; and
(C) an epoxy resin curing agent containing a polyvalent carboxylic acid represented by the formula (3) and a carboxylic anhydride compound:

wherein R is selected from the group consisting of methyl, COOH and H, wherein the components (A) to (C) are contained at the following ratios:
the amount of the component (A) is 20 to 80% by mass with respect to the total amount of the component (A) and the component (B),
the amount of the component (B) is 20 to 80% by mass with respect to the total amount of the component (A) and the component (B), and
wherein the mixing ratio is set such that the total number of carboxyl groups and carboxylic anhydride groups in the epoxy resin curing agent (C) is 0.4 to 0.7 mol with respect to 1 mol of the total number of epoxy groups in the whole epoxy resin composition.

2. The epoxy resin composition according to claim 1 ,
wherein X is a 3,4-epoxycyclohexylethyl group.

3. The epoxy resin composition according to claim 1 , further comprising (D) an epoxy resin curing accelerator.

4. The epoxy resin composition according to claim 3 , further comprising (E) an antioxidant.

5. The epoxy resin composition according to claim 1 , wherein the epoxy resin composition offers a cured product in which the temperature at a relative maximum point of the loss coefficient (tanδ=E″/E′) indicated by a quotient of a loss elastic modulus (E″) divided by a storage elastic modulus (E′) is 145° C. or higher in DMA (dynamic mechanical analysis) analysis.

6. A cured product prepared by curing an epoxy resin composition according to claim 1 .

7. The epoxy resin composition according to claim 1 , wherein the epoxy resin composition is used for optical semiconductor sealing.

8. The epoxy resin composition according to claim 1 ,
wherein the component (B) is a silicone-modified epoxy resin represented by the following formula:

Assignees

• Shinetsu Chemical Co
• Nippon Kayaku Kk
• Nippon Kayaku Kabuhiki Kaisha

Inventors

• Shiobara Toshio
• Sawada Junichi
• Wakao Miyuki
• Kashiwagi Tsutomu
• Miyagawa Naofusa
• Kawada Yoshihiro
• Sasaki Chie

Classifications

• H10W74/476

  Organic materials comprising silicon · CPC title

• C08L2205/025

  containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure · CPC title

• C08G59/42

  Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• H01L2924/00

  Electricity · mapped topic