Aluminum-diamond composite, and heat dissipating component using same

Patent metadata

Field	Value
Publication number	US-10302375-B2
Application number	US-201515305262-A
Country	US
Kind code	B2
Filing date	Apr 23, 2015
Priority date	Apr 25, 2014
Publication date	May 28, 2019
Grant date	May 28, 2019

Abstract

An aluminum-diamond composite that exhibits both high thermal conductivity and a coefficient of thermal expansion close to that of semiconductor devices, and that can suppress the occurrence of swelling, etc., of a surface metal layer portion even in actual use under a high load. An aluminum-diamond composite includes 65-80 vol % of a diamond powder having a roundness of at least 0.94, for which a first peak in a volumetric distribution of grain size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of the volumetric distribution of grain sizes of 1-35 μm and the area of the volumetric distribution of grain sizes of 45-205 μm is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

First claim

The invention claimed is:

1. An aluminum-diamond composite comprising: 65-80 vol % of a diamond powder having a roundness of at least 0.94 and a roughened surface, for which a first peak in a volumetric distribution of grain size lies at 5-25 μm, and a second peak lies at 55-195 μm, and a ratio between the area of a volumetric distribution of grain sizes of 1-35 μm and the area of a volumetric distribution of grain sizes of 45-205 μm is from 1:9 to 4:6; the balance being composed of a metal containing aluminum.

2. The aluminum-diamond composite in accordance with claim 1 , wherein the diamond powder is one that has been heat-treated, in an air atmosphere, at a temperature of at least 600° C. and at most 900° C., for at least 30 minutes and at most 180 minutes.

3. A heat-dissipating component comprising the aluminum-diamond composite in accordance with claim 1 , formed in the shape of a flat plate, wherein both surfaces of the aluminum-diamond composite are covered with a surface layer comprising at least 80 vol % of a metal containing aluminum and having a film thickness of 0.03-0.2 mm.

4. The heat-dissipating component in accordance with claim 3 , wherein
both surfaces have, in sequence from the aluminum-diamond composite-side,
an Ni layer having a film thickness of 0.5-6.5 μm,
an amorphous Ni alloy layer having a film thickness of 0.5-6.5 μm, and
a metal layer consisting of an Au layer having a film thickness of at least 0.05 μm,
such that the sum of the film thicknesses of the Ni layer and the Ni alloy layer is 1.0-10 μm.

5. The heat-dissipating component in accordance with claim 3 , wherein the thickness of the aluminum-diamond composite is 0.4-6 mm.

Assignees

• Denka Company Ltd

Inventors

• Ishihara Yosuke
• Miyakawa Takeshi
• Tsukamoto Hideo
• Narita Shinya

Classifications

• H10W40/254

  Diamond · CPC title

• H10W40/25

  characterised by their materials · CPC title

• C22C26/00

  Alloys containing diamond {or cubic or wurtzitic boron nitride, fullerenes or carbon nanotubes} · CPC title

• Y10T428/12076

  Next to each other · CPC title

• Y10T428/12944

  Ni-base component · CPC title