Differently oriented layered thermal conduit

US10299407B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-10299407-B2
Application numberUS-201514754483-A
CountryUS
Kind codeB2
Filing dateJun 29, 2015
Priority dateJun 29, 2015
Publication dateMay 21, 2019
Grant dateMay 21, 2019

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal conduction of the plurality of sheets may change stepwise in a stacking direction to form a curved thermal flow path.

First claim

Opening claim text (preview).

The invention claimed is: 1. A thermal conduit configured to conduct heat from a heat source to a heat sink, the conduit comprising: a plurality of stacked sheets formed of an anisotropically thermally conductive material, each sheet with two respective a-axes of thermal conduction and a respective c-axis along which the anisotropically thermally conductive material has a lower thermal conductivity compared to the a-axes, each sheet having an angle θ between a plane of that sheet and a plane of thermal conduction defined by the a-axes of that sheet; wherein, for at least one sheet of the plurality of stacked sheets, the angle θ of the sheet differs stepwise in a stacking direction relative to at least one corresponding angle θ of an adjacent sheet in the plurality of stacked sheets to form a curved thermal flow path. 2. The thermal conduit of claim 1 , wherein the anisotropically thermally conductive material is graphite. 3. The thermal conduit of claim 1 , wherein the plurality of stacked sheets are slices from blocks of the anisotropically thermally conductive material that have been sliced at corresponding angles and stacked such that the planes of thermal conduction of the one sheet and the adjacent sheet change stepwise in the stacking direction. 4. The thermal conduit of claim 1 , wherein the curved thermal flow path comprises at least a first curve from the heat source to a mid portion of the thermal conduit and a second curve from the mid portion to the heat sink. 5. The thermal conduit of claim 4 , wherein the heat source is a first heat source, the thermal conduit further comprising an introduction path to conduct heat from a second heat source to the heat sink, the introduction path including a third curve and merging with the curved thermal flow path. 6. The thermal conduit of claim 4 , wherein the plurality of stacked sheets are formed in a plurality of stacks arranged orthogonally relative to the stacking direction, and the planes of thermal conduction of at least some of the sheets at corresponding positions in the stacking direction in neighboring stacks are different from each other. 7. The thermal conduit of claim 1 , at least a portion of which has an elongated rectangular shape. 8. The thermal conduit of claim 1 , wherein the curved thermal flow path traverses the thermal conduit in three dimensions. 9. The thermal conduit of claim 1 , wherein the heat source is a heat generating component mounted in a head-mounted display (HMD) device and the heat sink is a heat dissipating component mounted in the HMD device. 10. The thermal conduit of claim 1 , wherein: of the plurality of stacked sheets, an entry sheet adjacent to the heat source is configured such that the c-axis of the entry sheet forms an entry angle with an adjacent surface of the heat source that is greater than 0° and less than 90°. 11. A method of forming a thermal conduit configured to conduct heat from a heat source to a heat sink, the method comprising: stacking a plurality of sheets formed of an anisotropically thermally conductive material, each sheet with two respective a-axes of thermal conduction and a respective c-axis along which the anisotropically thermally conductive material has a lower thermal conductivity compared to the a-axes, each sheet having an angle θ between a plane of that sheet and a plane of thermal conduction defined by the a-axes of that sheet; and for at least one sheet of the plurality of stacked sheets, changing the angle θ of the sheet stepwise in a stacking direction relative to at least one corresponding angle θ of an adjacent sheet in the plurality of stacked sheets to form a curved thermal flow path through the thermal conduit. 12. The method of claim 11 , wherein the anisotropically thermally conductive material is graphite. 13. The method of claim 11 , further comprising: slicing the plurality of sheets from blocks of the anisotropically thermally conductive material at corresponding angles to give each sheet the respective plane of thermal conduction. 14. The method of claim 11 , wherein the curved thermal flow path comprises at least a first curve from the heat source to a mid portion of the thermal conduit and a second curve from the mid portion to the heat sink. 15. The method of claim 11 , wherein the heat source is a first heat source, the method further comprising forming an introduction path to conduct heat from a second heat source to the heat sink, the introduction path including a third curve and merging with the curved thermal flow path. 16. The method of claim 11 , further comprising: forming the plurality of stacked sheets in a plurality of stacks arranged orthogonally relative to the stacking direction; wherein the planes of thermal conduction of at least some of the sheets at corresponding positions in the stacking direction in neighboring stacks are different from each other. 17. The method of claim 11 , wherein the curved thermal flow path traverses the thermal conduit in three dimensions. 18. The method of claim 11 , wherein the heat source is a heat generating component mounted in a head-mounted display (HMD) device and the heat sink is a heat dissipating component mounted in the HMD device. 19. The method of claim 11 , the method further comprising configuring, of the plurality of stacked sheets, an entry sheet adjacent to the heat source such that the c-axis of the entry sheet forms an entry angle with an adjacent surface of the heat source that is greater than 0° and less than 90°. 20. A thermal conduit configured to conduct heat from a heat source to a heat sink, the conduit comprising: a plurality of stacked sheets formed of an anisotropically thermally conductive material, each sheet with two respective a-axes of thermal conduction and a respective c-axis along which the anisotropically thermally conductive material has a lower thermal conductivity compared to the a-axes, each sheet having an angle θ between a plane of that sheet and a plane of thermal conduction defined by the a-axes of that sheet; wherein: for at least one sheet of the plurality of stacked sheets, the angle θ of the sheet differs stepwise in a stacking direction relative to at least one corresponding angle θ of an adjacent sheet in the plurality of stacked sheets to form a curved thermal flow path; the anisotropically thermally conductive material is graphite; and the heat source is a heat generating component mounted in a head-mounted display (HMD) device and the heat sink is a heat dissipating component mounted in the HMD device.

Assignees

Inventors

Classifications

  • comprising thermal conductors between chips and the and the arrangements for cooling, e.g. compliant heat-spreaders · CPC title

  • having a heterogeneous or anisotropic structure, e.g. powder or fibres in a matrix, wire mesh or porous structures (H10W40/254, H10W40/251 take precedence) · CPC title

  • characterised by their materials · CPC title

  • characterised by mechanical features · CPC title

  • for cooling heat generating elements, e.g. for cooling electronic components or electric devices · CPC title

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What does patent US10299407B2 cover?
A thermal conduit configured to conduct heat from a heat source to a heat sink and method of forming said conduit are disclosed herein. The thermal conduit may comprise a plurality of stacked sheets formed of an anisotropically thermally conductive material, a non-limiting example of which is graphite, each sheet with a respective orientation of thermal conduction. The orientations of thermal c…
Who is the assignee on this patent?
Microsoft Technology Licensing Llc
What technology area does this patent fall under?
Primary CPC classification F28F21/02. Mapped technology areas include Mechanical Engineering.
When was this patent published?
Publication date Tue May 21 2019 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).