Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment

Patent metadata

Field	Value
Publication number	US-10294547-B2
Application number	US-201414907193-A
Country	US
Kind code	B2
Filing date	Jul 29, 2014
Priority date	Jul 31, 2013
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

The present invention provides a copper alloy for electronic and electronic device which has excellent mechanical properties and is capable of suppressing generation of defects even in a case in which the copper alloy is worked to a thin plate thickness or a smaller wire diameter than in the related art, a plastically-worked copper alloy material, and a component and a terminal for electronic and electronic device. The copper alloy for electronic and electronic device of the present invention includes Mg in a range of 1.3 mass % to 2.8 mass % with a remainder substantially being Cu and inevitable impurities, in which a content of H is set to 10 mass ppm or lower, a content of O is set to 100 mass ppm or lower, a content of S is set to 50 mass ppm or lower, and a content of C is set to 10 mass ppm or lower.

First claim

The invention claimed is:

1. A copper alloy for electronic and electrical devices, comprising:
Mg in a range of 1.3 mass % to 2.8 mass %; and
a remainder substantially being Cu and inevitable impurities,
wherein a content of H is set to 10 mass ppm or lower, a content of O is set to 100 mass ppm or lower, a content of S is set to 50 mass ppm or lower, and a content of C is set to 10 mass ppm or lower, and
wherein, R{220} is 0.9 or lower, where an X-ray diffraction intensity from a {111} plane on a plate surface is represented by I{111}, an X-ray diffraction intensity from a {200} plane on the plate surface is represented by I{200}, an X-ray diffraction intensity from a {220} plane on the plate surface is represented by I{220}, an X-ray diffraction intensity from a {311} plane on the plate surface is represented by I{311}, and a fraction {220} of the X-ray diffraction intensity from the {220} plane on the plate surface is R{220}=I{220}/(I{111}+I{200}+I{220}+I{311}).

2. The copper alloy for electronic and electrical devices according to claim 1 ,
wherein, in a scanning electron microscopic observation, an average number of intermetallic compounds which have a particle diameter of 0.1 μm or larger and include Cu and Mg as major components is set to 1 compound/μm 2 or less.

3. The copper alloy for electronic and electrical devices according to claim 1 ,
wherein, in a case where a content of Mg is defined as A atomic %, a conductivity σ (% IACS) is set in a range of σ≤1.7241/(−0.0347×A 2 +0.6569×A+1.7)×100.

4. The copper alloy for electronic and electrical devices according to claim 1 , comprising:
one or more of Sn, Zn, Al, Ni, Si, Mn, Li, Ti, Fe, Co, Cr, Zr, and P in a range of 0.01 mass % to 3.0 mass % in total.

5. The copper alloy for electronic and electrical devices according to claim 1 ,
wherein the copper alloy for electronic and electrical devices has mechanical properties such that a 0.2% yield strength is 400 MPa or higher.

6. The copper alloy for electronic and electrical devices according to claim 1 ,
wherein R{220} is set in a range of 0.3 to 0.9.

7. The copper alloy for electronic and electrical devices according to claim 1 ,
wherein a yield ratio YS/TS, which is calculated from a strength TS and a 0.2% yield strength YS obtained in a tensile test carried out in a direction parallel to a rolling direction, exceeds 90%.

8. The copper alloy for electronic and electrical devices according to claim 7 ,
wherein an average crystal grain size is set to 50 μm or smaller.

9. A plastically-worked copper alloy material for electronic and electrical devices formed by plastically working a copper material made of the copper alloy for electronic and electrical devices according to claim 1 .

10. The plastically-worked copper alloy material for electronic and electrical devices according to claim 9 , wherein the copper alloy material is metal-formed by a manufacturing method including a heat treatment step of heating a copper material to a temperature in a range of 400° C. to 900° C. and cooling the heated copper material to 200° C. or lower at a cooling rate of 60° C./min or greater and a plastic working step of plastically working the copper material.

11. The plastically-worked copper alloy material for electronic and electrical devices according to claim 9 ,
wherein Sn plating is carried out on a surface of the plastically-worked copper alloy material for electronic and electrical devices.

12. A component for electronic and electrical devices made of the plastically-worked copper alloy material for electronic and electrical devices according to claim 9 .

13. A terminal made of the plastically-worked copper alloy material for electronic and electrical devices according to claim 9 .

Assignees

• Mitsubishi Materials Corp

Inventors

• Ito Yuki
• Maki Kazunari

Classifications

• Y02P10/212

  Cross-Sectional Technologies · mapped topic

• C21D9/0068

  for particular articles not mentioned below · CPC title

• H01R13/03

  characterised by the material, e.g. plating, or coating materials · CPC title

• C22C9/00 Primary

  Alloys based on copper · CPC title

• H01R4/58

  characterised by the form or material of the contacting members (H01R4/01 takes precedence) · CPC title