Micromechanical sensor and method for producing a micromechanical sensor

Patent metadata

Field	Value
Publication number	US-10294095-B2
Application number	US-201715582333-A
Country	US
Kind code	B2
Filing date	Apr 28, 2017
Priority date	May 24, 2016
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

A micromechanical sensor that is produced surface-micromechanically includes at least one mass element formed in a third functional layer that is non-perforated at least in certain portions. The sensor has a gap underneath the mass element that is formed by removal of a second functional layer and at least one oxide layer. The removal of the at least one oxide layer takes place by introducing a gaseous etching medium into a defined number of etching channels arranged substantially parallel to one another. The etching channels are configured to be connected to a vertical access channel in the third functional layer.

First claim

What is claimed is:

1. A micromechanical sensor configured to be produced surface-micromechanically, comprising:
a third functional layer defining at least one movable mass element that includes:
a first portion that is at least substantially unperforated; and
a second portion that is perforated;

wherein:
the third functional layer is positioned so as to form a first gap located underneath the first portion , and a second gap located underneath the second portion; and
the first gap is about two to about ten times greater than the second gap.

2. The micromechanical sensor according to claim 1 , wherein the first gap is about five μm to about eight μm.

3. The micromechanical sensor according to claim 2 , wherein the first gap is about seven μm.

4. The micromechanical sensor according to claim 1 , wherein the first portion includes a defined number of through-holes located exclusively in a side region of the first portion facing toward the second portion such that the first portion is substantially unperforated.

5. The micromechanical sensor according to claim 1 , further comprising a first functional layer that defines a conductor track level underneath the first portion of the at least one movable mass element.

6. The micromechanical sensor according to claim 1 , further comprising a substrate disposed underneath the first portion of the at least one movable mass element.

7. The micromechanical sensor according to claim 1 , wherein the first gap is about three to about six times greater than the second gap.

8. The micromechanical sensor according to claim 1 , wherein the sensor is at least one of an accelerometer and a rotation sensor.

9. The micromechanical sensor according to claim 8 , further comprising:
a torsion spring; and
a pair of bottom electrodes that are fixed relative to the at least one movable mass element on opposite sides of the torsion spring;
wherein:
the at least one movable mass element is a mass asymmetrical rocker rotatably supported by the torsion spring;
the rocker includes a pair of top electrodes that are positioned on opposite sides of the torsion spring such that each top electrode forms a respective capacitance pair with a corresponding bottom electrode; and
an acceleration or rotation of the sensor causes the rocker to twist about the torsion spring, resulting in a relative change in capacitance between the capacitance pairs that is indicative of the acceleration or rotation.

10. A micromechanical device configured to be produced surface-micromechanically, comprising:
a third functional layer that defines a vertical slot;
at least one oxide layer positioned underneath the third functional layer; and
a second functional layer positioned underneath the third functional layer and including at least one horizontal etching channel in communication with the vertical slot such that introducing gaseous etching material into the at least one horizontal etching channel via the vertical slot removes the at least one oxide layer and the second functional layer from the device and forms a first gap underneath the third functional layer.

11. The micromechanical device according to claim 10 , wherein the at least one horizontal etching channel is positioned such that the first gap is formed underneath an unperforated portion of the third functional layer.

12. The micromechanical device according to claim 11 , wherein the at least one oxide layer includes:
a first oxide layer positioned underneath the second functional layer;
a second oxide layer positioned at least partially within the second functional layer so as to at least partially define the at least one horizontal etching channel; and
a third oxide layer positioned between the third functional layer and the second oxide layer so as to vertically seal off the at least one horizontal etching channel.

13. The micromechanical device according to claim 12 , further comprising a first functional layer positioned underneath the first oxide layer.

14. The micromechanical device according to claim 13 , further comprising a further oxide channel positioned underneath the first functional layer.

15. The micromechanical device according to claim 10 , wherein the at least one oxide layer and the second functional layer together have a thickness such that the gap forms with a size of about five μm to about eight μm.

Assignees

• Bosch Gmbh Robert

Inventors

• Pekka Herzogenrath Benny
• Classen Johannes

Classifications

• B81B2203/0181

  See-saws · CPC title

• B81B2203/0338

  Channels · CPC title

• G01P2015/0814

  for translational movement of the mass, e.g. shuttle type · CPC title

• G01P2015/0837

  the mass being suspended so as to only allow movement perpendicular to the plane of the substrate, i.e. z-axis sensor · CPC title

• B81B2201/025

  Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242 · CPC title