Polishing pad having polishing surface with continuous protrusions

Patent metadata

Field	Value
Publication number	US-10293459-B2
Application number	US-201715479779-A
Country	US
Kind code	B2
Filing date	Apr 5, 2017
Priority date	Jan 22, 2013
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

Polishing pads having a polishing surface with continuous protrusions are described. Methods of fabricating polishing pads having a polishing surface with continuous protrusions are also described.

First claim

What is claimed is:

1. A polishing pad for polishing a substrate, the polishing pad comprising:
a polishing body having a polishing side opposite a back surface; and
a polishing surface comprising a plurality of protrusions continuous with the polishing side of the polishing body, each protrusion having a modified-quadrilateral polygon shape in a plane of the polishing surface, wherein the plurality of protrusions is arranged in an X-Y grid pattern, wherein the polishing body and polishing surface are together homogeneous and unitary, and wherein the polishing body and polishing surface comprise a molded polyurethane material, and further comprising:
a solid ring encompassing the plurality of protrusions at an outer most edge of the polishing side of the polishing body, the solid ring continuous with the polishing side of the polishing body, wherein a continuous groove is disposed between the solid ring and the plurality of protrusions.

2. The polishing pad of claim 1 , wherein the modified-quadrilateral polygon shape is selected from the group consisting of a quadrilateral polygon with one or more rounded corners, a quadrilateral polygon with one or more notched corners and a quadrilateral polygon with one or more arced sides.

3. The polishing pad of claim 1 , wherein the modified-quadrilateral polygon shape is selected from the group consisting of a modified-square shape, a modified-rectangular shape, a modified-rhombus shape, and a modified-trapezoidal shape.

4. The polishing pad or claim 1 , wherein the modified-quadrilateral polygon shape is a square with all four corners rounded.

5. The polishing pad or claim 1 , wherein the modified-quadrilateral polygon shape is a square with all four corners notched.

6. The polishing pad of claim 1 , further comprising:
a button region disposed centrally within the X-Y grid pattern of the plurality of protrusions, the button region having a square shape with notched corners.

7. The polishing pad of claim 6 , wherein the button region further comprises a clocking mark on one side of the square shape.

8. The polishing pad of claim 1 , wherein the plurality of protrusions is arranged in a plurality of high density regions having less spacing between adjacent protrusions within a high density region than between adjacent protrusions of adjacent high density regions.

9. The polishing pad of claim 8 , wherein each of the high density regions is substantially square or rectangular, and spacing between each of the high density regions of the plurality of high density regions forms an X-Y grid pattern.

10. The polishing pad of claim 1 , wherein each of the plurality of protrusions has a maximum lateral dimension approximately in the range of 1-30 millimeters, with a spacing between one another approximately in the range of 0.1-3 millimeters.

11. The polishing pad of claim 1 , wherein each protrusion of a first portion of the plurality of protrusions has a first maximum lateral dimension, and each protrusion of a second portion of the plurality of protrusions has a second, different, maximum lateral dimension.

12. The polishing pad of claim 11 , wherein a pattern of the plurality of protrusions comprises a protrusion having a maximum lateral dimension of approximately 10 millimeters surrounded by a plurality of protrusions each having a maximum lateral dimension of approximately 1 millimeter.

13. The polishing pad of claim 1 , wherein each protrusion of a first portion of the plurality of protrusions has a first shape in the plane of the polishing surface, and each protrusion of a second portion of the plurality of protrusions has a second, different, shape in the plane of the polishing surface.

14. The polishing pad of claim 1 , wherein the height of each of the plurality of protrusions is approximately in the range of 0.5-1 millimeter.

15. The polishing pad of claim 1 , wherein the plurality of protrusions comprises approximately between 50,000 and 200,000 protrusions for a polishing pad having a diameter approximately in the range of 29-32 inches.

16. The polishing pad of claim 1 , wherein the plurality of protrusions has a randomized pattern.

17. The polishing pad of claim 1 , wherein each protrusion of a first portion of the plurality of protrusions has a first height from the polishing body, and each protrusion of a second portion of the plurality of protrusions has a second, different, height from the polishing body, but all of the plurality of protrusions are substantially co-planar distal from the polishing body.

18. The polishing pad of claim 1 , wherein the molded polyurethane material has a pore density of closed cell pores approximately in the range of 6%-50% total void volume.

19. The polishing pad of claim 1 , further comprising:
a foundation layer disposed on the back surface of the polishing body.

20. The polishing pad of claim 1 , further comprising:
a detection region disposed in the back surface of the polishing body.

21. The polishing pad of claim 1 , further comprising:
an aperture disposed in the polishing surface and polishing body; and
an adhesive sheet disposed on the back surface of the polishing body, the adhesive sheet providing an impermeable seal for the aperture at the back surface of the polishing body.

22. The polishing pad of claim 1 , further comprising:
a sub pad disposed on the back surface of the polishing body.

23. The polishing pad of claim 1 , further comprising:
a local area transparency (LAT) region disposed in the polishing body, the LAT region interrupting a pattern of the plurality of protrusions.

Assignees

• Nexplanar Corp
• Cabot Microelectronics Corp

Inventors

• Lefevre Paul Andre
• Allison William C
• Simpson Alexander William
• Scott Diane
• Huang Ping
• Charns Leslie M
• Rinehart James Richard
• Kerprich Robert

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B37/26 Primary

  characterised by the shape of the lapping pad surface, e.g. grooved · CPC title

• B24B37/205

  provided with a window for inspecting the surface of the work being lapped · CPC title

• B24B37/22

  characterised by a multi-layered structure · CPC title