Polishing apparatus

Patent metadata

Field	Value
Publication number	US-10293455-B2
Application number	US-201615150279-A
Country	US
Kind code	B2
Filing date	May 9, 2016
Priority date	Nov 1, 2004
Publication date	May 21, 2019
Grant date	May 21, 2019

Abstract

A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.

First claim

The invention claimed is:

1. An apparatus for polishing a substrate by pressing the substrate against a polishing surface, the apparatus comprising:
a top ring configured to press the substrate,
a retainer ring arranged at peripheral portion of the top ring, and configured to be brought into contact with the polishing surface when polishing the substrate,
a stage on which the substrate to be received or delivered is placed,
a mechanism configured to move the stage toward the top ring for receiving or delivering the substrate, and
a measuring unit configured to measure a position of the stage,
wherein, when the substrate is received or delivered, the upper surface of the stage is brought into contact with the lower surface of the retainer ring,
wherein the position of the stage is measured in a state such that the upper surface of the stage is brought into contact with the lower surface of the retainer ring, and
wherein an amount of wear of the retainer ring is calculated by comparing the position of the stage measured with a reference value.

2. The apparatus according to claim 1 , wherein the amount of wear of the retainer ring is calculated based on the distance moved or the position of the stage measured when the substrate is loaded or unloaded.

3. The apparatus according to claim 1 , wherein a guide for alignment with the retainer ring is provided on the upper surface of the stage.

4. The apparatus according to claim 1 , wherein an amount of wear of the retainer ring or a time-varied amount of wear of the retainer ring is detected, and a lifetime of the retainer ring is detected based on the amount of wear of the retainer ring or the time-varied amount of wear of the retainer ring.

5. The apparatus according to claim 1 , wherein a time-varied amount of wear of the retainer ring is detected, and a timing of replacement of the retainer ring is predicted based on the time-varied amount of wear of the retainer ring.

6. The apparatus according to claim 1 , wherein an amount of wear of the retainer ring or a time-varied amount of wear of the retainer ring is detected, and a timing of replacement of the retainer ring is detected based on the amount of wear of the retainer ring or the time-varied amount of wear of the retainer ring.

7. The apparatus according to claim 1 , wherein an amount of wear of the retainer ring or a time-varied amount of wear of the retainer ring is detected, and polishing condition is controlled based on the amount of wear of the retainer ring or the time-varied amount of wear of the retainer ring.

8. The apparatus according to claim 1 , wherein an amount of wear of the retainer ring or a time-varied amount of wear of the retainer ring is detected, and anomaly of a polishing process is detected based on the amount of wear of the retainer ring or the time-varied amount of wear of the retainer ring.

9. A method performed by an apparatus for polishing a substrate, the apparatus comprising: a top ring configured to press the substrate, a retainer ring arranged at peripheral portion of the top ring, and configured to be brought into contact with the polishing surface when polishing the substrate, and a stage on which the substrate to be received or delivered is placed, wherein
the method comprises:
moving the stage toward the top ring for receiving or delivering the substrate to bring the upper surface of the stage into contact with the lower surface of the retainer ring,
measuring a position of the stage in a state such that the upper surface of the stage is brought into contact with the lower surface of the retainer ring, and
calculating an amount of wear of the retainer ring by comparing the position of the stage measured with a reference value.

10. An apparatus for polishing a substrate by pressing the substrate against a polishing surface, the apparatus comprising:
a top ring configured to press the substrate,
a retainer ring arranged at peripheral portion of the top ring, and configured to be brought into contact with the polishing surface when polishing the substrate,
a stage on which the substrate to be received or delivered is placed,
a mechanism configured to move the stage toward the top ring for receiving or delivering the substrate, and
a measuring unit configured to measure a distance moved of the stage,
wherein, when the substrate is received or delivered, the upper surface of the stage is brought into contact with the lower surface of the retainer ring,
wherein the distance moved of the stage is measured until the upper surface of the stage is brought into contact with the lower surface of the retainer ring, and
wherein an amount of wear of the retainer ring is calculated from the distance moved of the stage measured by referring data stored in the apparatus, the data representing interrelationship between the distance moved of the stage and the amount of wear of the retainer ring.

11. The apparatus according to claim 10 , wherein the amount of wear of the retainer ring is calculated based on the distance moved or the position of the stage measured when the substrate is loaded or unloaded.

12. The apparatus according to claim 10 , wherein a guide for alignment with the retainer ring is provided on the upper surface of the stage.

13. The apparatus according to claim 10 , wherein an amount of wear of the retainer ring or a time-varied amount of wear of the retainer ring is detected, and a lifetime of the retainer ring is detected based on the amount of wear of the retainer ring or the time-varied amount of wear of the retainer ring.

14. The apparatus according to claim 10 , wherein a time-varied amount of wear of the retainer ring is detected, and a timing of replacement of the retainer ring is predicted based on the time-varied amount of wear of the retainer ring.

15. The apparatus according to claim 10 , wherein an amount of wear of the retainer ring or a time-varied amount of wear of the retainer ring is detected, and a timing of replacement of the retainer ring is detected based on the amount of wear of the retainer ring or the time-varied amount of wear of the retainer ring.

16. The apparatus according to claim 10 , wherein an amount of wear of the retainer ring or a time-varied amount of wear of the retainer ring is detected, and polishing condition is controlled based on the amount of wear of the retainer ring or the time-varied amount of wear of the retainer ring.

17. The apparatus according to claim 10 , wherein an amount of wear of the retainer ring or a time-varied amount of wear of the retainer ring is detected, and anomaly of a polishing process is detected based on the amount of wear of the retainer ring or the time-varied amount of wear of the retainer ring.

18. A method performed by an apparatus for polishing a substrate, the apparatus comprising: a top ring configured to press the substrate, a retainer ring arranged at peripheral portion of the top ring, and configured to be brought into contact with the polishing surface when polishing the substrate, and a stage on which the substrate to be received or delivered is placed, wherein
the method comprises:
moving the stage toward the top ring for receiving or delivering the substrate to bring the upper surface of the stage into contact with the lower surface of the retainer ring,
measuring the distance moved of the stage until the upper surface of the stage is brought into contact with the lower surface of the retainer ring, and
calculating an amount of wear of the retainer ring from the distance moved of the stage measured by referring data stor

Assignees

• Ebara Corp

Inventors

• Nabeya Osamu
• Togawa Tetsuji
• Fukushima Makoto
• Yasuda Hozumi

Classifications

• H10P52/00 Primary

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title

• B24B37/042

  operating processes therefor · CPC title

• B24B47/22 Primary

  Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation · CPC title

• B24B49/16

  taking regard of the load · CPC title

• B24B37/005

  Control means for lapping machines or devices · CPC title