Defect control and stability of dc bias in rf plasma-based substrate processing systems using molecular reactive purge gas
US-2015354061-A1 · Dec 10, 2015 · US
US10283390B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-10283390-B2 |
| Application number | US-201615167414-A |
| Country | US |
| Kind code | B2 |
| Filing date | May 27, 2016 |
| Priority date | May 29, 2015 |
| Publication date | May 7, 2019 |
| Grant date | May 7, 2019 |
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An apparatus for processing a substrate includes a load port on that a substrate transfer container accommodating a substrate is laid, a processing part configured to process a substrate, and an index part including an index robot configured to carry a substrate between the substrate transfer container and the processing part, wherein the processing part includes a first transfer chamber configured to have a first main carrying robot carrying a substrate and disposed adjacent to the index part, a second transfer chamber configured to have a second main carrying robot carrying a substrate and disposed adjacent to the first transfer chamber, and a shuttle buffer part configured to move between the first transfer chamber and the second transfer chamber for transferring a substrate between the second main carrying robot and the index robot.
Opening claim text (preview).
What is claimed is: 1. An apparatus configured to process a substrate, the apparatus comprising: a load port configured to hold a substrate transfer container accommodating the substrate; an index part including an index robot configured to transfer the substrate from the substrate transfer container; a processing part configured to receive the substrate from the indexing robot, and to process the substrate, the processing part including, a first transfer chamber adjacent to the index part, the first transfer chamber including a first main carrying robot configured to rotate to carry the substrate, and a second transfer chamber adjacent to the first transfer chamber such that the index part, the first transfer chamber and the second transfer chamber are sequentially arranged in a first direction with the first transfer chamber between the index part and the second transfer chamber, the second transfer chamber including a second main carrying robot configured to rotate to carry the substrate; and a shuttle buffer part configured to move between the first transfer chamber and the second transfer chamber to transfer the substrate at least from the second main carrying robot to the index robot, the shuttle buffer part including, a first shuttle buffer configured to carry substrates to the second main carrying robot before processing, and a second shuttle buffer configured to move independently of the first shuttle buffer to carry substrates to the index robot after processing. 2. The apparatus of claim 1 , wherein the processing part comprises: two or more first processing chambers stacked in a second direction; and two or more second processing chambers stacked in the second direction adjacent to the two or more first processing chambers such that the two or more first processing chambers and the two or more second processing chambers are sequentially arranged in the first direction, the second direction being perpendicular to the first direction. 3. The apparatus of claim 1 , wherein the shuttle buffer part further comprises: a moving axis extending from the first transfer chamber to the second transfer chamber, the shuttle buffer part configured to move along the moving axis. 4. An apparatus configured to process a substrate, the apparatus comprising: a load port configured to hold a substrate transfer container accommodating the substrate; an index part including an index robot configured to transfer the substrate from the substrate transfer container; a processing part configured to receive the substrate from the indexing robot, and to process the substrate, the processing part including, a first transfer chamber adjacent to the index part, the first transfer chamber including a first main carrying robot configured to rotate to carry the substrate, and a second transfer chamber adjacent to the first transfer chamber such that the index part, the first transfer chamber and the second transfer chamber are sequentially arranged in a first direction with the first transfer chamber between the index part and the second transfer chamber, the second transfer chamber including a second main carrying robot configured to rotate to carry the substrate; a shuttle buffer part configured to move between the first transfer chamber and the second transfer chamber to transfer the substrate at least from the second main carrying robot to the index robot; and a controller configured to move the first main carrying robot out of a transfer path of the shuttle buffer part to prevent collision with the first main carrying robot while the shuttle buffer part is moving. 5. An apparatus configured to process a substrate, the apparatus comprising: an index part including an index robot; a fixed buffer in contact with the index part; a first processing part adjacent to the index part the first processing part having a first processing chamber including a first main carrying robot configured to rotate to carry the substrate from the fixed buffer; a second processing part adjacent to the first processing part such that the index part, the first processing part and the second processing part are sequentially arranged in a first direction with the first processing part between the index part and the second processing part, the second processing part having a second processing chamber including a second main carrying robot; and a shuttle buffer configured to transfer the substrate at least from the second main carrying robot to the index robot, the shuttle buffer including, a first shuttle buffer configured to carry the substrate to the second main carrying robot before processing, and a second shuttle buffer configured to move independently of the first shuttle buffer to carry the substrate to the index robot after processing. 6. An apparatus configured to process a substrate, the apparatus comprising: an index part including an index robot configured to transfer the substrate; a first processing part adjacent to the index part; a second processing part adjacent to the first processing part such that the index part, the first processing part and the second processing part are sequentially arranged in a first direction with the first processing part between the index part and the second processing part; and a shuttle buffer configured to directly carry the substrate, which is to be processed in the second processing part, from the index robot and to directly carry the substrate, which is processed in the second processing part, to the index robot, the shuttle buffer including, a first shuttle buffer configured to carry the substrate to the second processing part before processing; and a second shuttle buffer configured to move independently of the first shuttle buffer to carry the substrate to the index robot after processing. 7. The apparatus of claim 6 , wherein the first processing part includes two or more first processing chambers stacked in a second direction, and the second processing part includes two or more second processing chambers stacked in the second direction adjacent to the two or more first processing chambers such that the two or more first processing chambers and the two or more second processing chambers are sequentially arranged in the first direction, the second direction being perpendicular to the first direction. 8. An apparatus configured to process a substrate, the apparatus comprising: an index part including an index robot; a fixed buffer in contact with the index part; a first processing part adjacent to the index part the first processing part having a first processing chamber including a first main carrying robot configured to rotate to carry the substrate from the fixed buffer; a second processing part adjacent to the first processing part such that the index part, the first processing part and the second processing part are sequentially arranged in a first direction with the first processing part between the index part and the second processing part, the second processing part having a second processing chamber including a second main carrying robot; and a shuttle buffer configured to transfer the substrate at least from the second main carrying robot to the index robot, the shuttle buffer being configured to move between a first position, to which the second main carrying robot is approachable, and a second position to that the index robot is approachable. 9. The apparatus of claim 8 , wherein the first processing part includes two or more first processing chambers stacked in a second direction, and the second processing part includes two or more second processing chambers stacked in the second direction adjacent to the two or more first processing chambers such that the two or mo
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