High-aspect ratio structure production method, ultrasonic probe production method using same, and high-aspect ratio structure

Patent metadata

Field	Value
Publication number	US-10283229-B2
Application number	US-201715428262-A
Country	US
Kind code	B2
Filing date	Feb 9, 2017
Priority date	Mar 15, 2016
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

A high-aspect ratio structure production method and an ultrasonic probe production method of the present invention include: forming, in a principal surface of a substrate, a plurality of pores each extending in a direction intersecting the principal surface; plugging, among the plurality of pores, one or more pores formed in a first region; and forming a recess in a second region by a wet etching process. A high-aspect ratio structure includes a grating having a plurality of convex portions, wherein each of the plurality of convex portions is provided with a plugging member plugging a plurality of pores formed therein in a thickness direction of the structure.

First claim

The invention claimed is:

1. A method for producing a high-aspect ratio structure, comprising:
a pore forming step of forming, in at least one principal surface of a given substrate, a plurality of pores each extending in a direction intersecting the principal surface;
a resist layer forming step of forming a resist layer on the principal surface;
a patterning step of subjecting the resist layer to patterning, and removing a part of the resist layer after being subjected to the patterning;
a plugging step of plugging, among the plurality of pores, one or more pores formed in a first region from which the part of the resist layer has been removed in the patterning step;
a resist layer removing step of removing the remaining resist layer left after the patterning step; and
a recess forming step of forming, by a wet etching process, a recess in a second region from which the remaining resist layer has been removed in the resist layer removing step,
wherein the pores in the second region are prevented from being plugged during the plugging step by the remaining resist layer.

2. The method as recited in claim 1 , wherein the pore forming step is a step of forming the plurality of pores by one of an anodic oxidation process and an anodic chemical conversion process.

3. The method as recited in claim 1 , wherein the given substrate is formed of one selected from the group consisting of aluminum (Al), tungsten (W), molybdenum (Mo), silicon (Si), gallium arsenide (GaAs) and indium phosphorus (InP).

4. The method as recited in claim 1 , which further comprises an X-ray absorptive material burying step of burying an X-ray absorptive material capable of absorbing X-rays, in the recess.

5. The method as recited in claim 4 , wherein the X-ray absorptive material burying step includes burying a metal as the X-ray absorptive material by an electroforming process.

6. The method as recited in claim 1 , wherein the high-aspect ratio structure is an X-ray metal grating structure for use in one of an X-ray Talbot interferometer and an X-ray Talbot-Lau interferometer.

7. The method as recited in claim 1 , wherein the high-aspect ratio structure is an ultrasonic probe production mold for use in producing an ultrasonic probe.

8. A method for producing an ultrasonic probe, comprising:
a metal mold forming step of filling the recess of the ultrasonic probe production mold as recited in claim 7 , with a metal to form a metal mold having a metal mold recess;
a resin mold forming step of filling the metal mold recess of the metal mold with a resin filler made of a resin material to form a resin mold having a resin mold recess;
a fine structure forming step of filling the resin mold recess of the resin mold with a slurry containing a piezoelectric material to form a fine structure having a structure recess; and
an ultrasonic probe body forming step of filling the structure recess of the fine structure with a synthetic resin to form an ultrasonic probe body in which a piezoelectric layer made of the piezoelectric material and a synthetic resin layer made of the synthetic resin are alternately arranged to form an array.

Assignees

• Konica Minolta Inc

Inventors

• Yokoyama Mitsuru
• Yoshida Yuko

Classifications

• G03F7/2002

  with visible light or UV light, through an original having an opaque pattern on a transparent support, e.g. film printing, projection printing; by reflection of visible or UV light from an original such as a printed image · CPC title

• H01L41/333

  Electricity · mapped topic

• G01N29/222

  Constructional or flow details for analysing fluids (optoacoustic fluid cells G01N29/2425) · CPC title

• C25D1/10

  Moulds; Masks; Masterforms · CPC title

• C25D1/003

  3D structures, e.g. superposed patterned layers · CPC title