System and method for operating chemical mechanical polishing process

Patent metadata

Field	Value
Publication number	US-10279311-B2
Application number	US-201213591167-A
Country	US
Kind code	B2
Filing date	Aug 21, 2012
Priority date	Aug 21, 2012
Publication date	May 7, 2019
Grant date	May 7, 2019

Abstract

A chemical mechanical polishing (CMP) chamber is disclosed. The CMP chamber includes a chamber body, a door mounted on the chamber body and a chamber substructure being one selected from a group consisting of a moisture separator separating a moisture generated in the CMP chamber, a supplementary exhaust port, a transparent window mounted on the door, a sampling port mounted on the door, a sealing material including a metal frame, an o-ring for sealing the door and a combination thereof.

First claim

What is claimed is:

1. A chemical mechanical polishing (CMP) system, comprising:
a working region comprising a polishing chamber for a III-V CMP process or a Ru CMP process, wherein the III-V CMP process or Ru CMP process generates an airborne toxic byproduct, including a toxic gas and moisture in the polishing chamber;
an exhaust to remove the airborne toxic byproduct from the polishing chamber;
an exhaust port coupled between the polishing chamber and the exhaust; and
a moisture separator comprising:
a separator body;
an exhaust inlet to receive the airborne byproduct from a first portion of the exhaust into the separator body;
a cooling element to condense the moisture into a liquid within the separator body;
a drain to allow the liquid to flow out of the separator body; and
an exhaust outlet to discharge the hazardous airborne byproduct from within the separator body to a second portion of the exhaust,

wherein the polishing chamber is a closed chamber comprising:
a transparent window with a metal frame and an o-ring seal; and
a sampling port configured to allow the withdrawal of a gas sample including the toxic gas from the polishing chamber on the transparent window.

2. The CMP system as claimed in claim 1 , wherein the airborne byproduct is a mixture including one selected from a group consisting of a manufacturing remainder, a toxic gas, a polishing debris, a slurry, a fine particle, a dust, a solid, the moisture, and a combination thereof.

3. The CMP system as claimed in claim 2 , wherein the separator body further comprises a first side and a second side that is orthogonal to the first side, wherein the exhaust inlet is coupled to the first side and the exhaust outlet is coupled to second side, and wherein the cooling element is disposed on a wall of the body.

4. The CMP system as claimed in claim 2 , further comprising a platen plenum adjacent to the working region to provide a negative pressure within the polishing chamber.

5. The CMP system as claimed in claim 4 , wherein the platen plenum comprises a sealing bracket, a handle and a latch.

6. The CMP system as claimed in claim 5 , wherein the platen plenum is mounted on the polishing chamber below the window.

7. The CMP system as claimed in claim 1 ,
wherein the separator body has a wall, and
the cooling element is disposed on the wall.

8. The CMP system as claimed in claim 7 , wherein the moisture separator further comprises an exhaust inlet coupled to the separator body to receive gases and byproducts including the moisture from the chamber into the separator body.

9. The CMP system as claimed in claim 8 , further comprising an exhaust outlet coupled to the separator body to discharge the gases and byproducts without the moisture from the separator body.

10. The CMP system as claimed in claim 8 , wherein the byproduct is a mixture being one selected from a group consisting of a manufacturing remainder, a toxic gas, a polishing debris, a slurry, a fine particle, a dust, a solid, the moisture, a liquid, and a combination thereof.

11. The CMP system as claimed in claim 7 , wherein the cooling element is one of a cooling chip and a cooling coil.

12. The CMP system as claimed in claim 7 , wherein the moisture separator further comprises a sealing plane attached to the separator body, the sealing plane comprising an opening that provides an overflow element providing an additional outlet for the liquid.

13. The CMP system as claimed in claim 12 , wherein the moisture separator further comprises a level sensor monitoring a level of the liquid within the separator body.

14. A chemical mechanical polishing (CMP) system, comprising:
a chamber body for a III-V CMP process or for a Ru CMP process for semiconductor wafers;
a door mounted on the chamber body;
a platen plenum to provide a negative pressure within the chamber body; and
a supplementary exhaust port that is separate from the platen plenum, the supplementary exhaust port removes toxic gases and byproducts generated in the III-V CMP process or Ru CMP process,
wherein the platen plenum is configured to be pulled out from the chamber body, and comprises:
a handle, configured to enable an operator to pull out the platen plenum;
a latch, configured to fix the platen plenum in position below its corresponding polishing chamber; and
a sealing bracket, configured to seal the platen plenum.

15. The CMP system as claimed in claim 14 , wherein the platen plenum is mounted on the chamber body below the door.

16. The CMP system as claimed in claim 14 , further comprising a sampling port on the door configured to allow the withdrawal of a gas sample including a toxic gas generated by the III-V CMP process or the Ru CMP process from the polishing chamber.

17. A chemical mechanical polishing (CMP) system, comprising:
a plurality of polishing chambers each for a III-V CMP process or a Ru CMP process therein, wherein a toxic CMP byproduct is generated by the III-V CMP process or Ru CMP process, each polishing chamber comprising:
a chamber body at least partially defined by a door;

a metal frame, configured around the door for enhancing a strength of the door; and
an O-ring seal disposed in the metal frame and configured to attach to a wall of the polishing chamber for sealing the door;
a plurality of platen plenums, each disposed below a corresponding one of the polishing chambers to provide a negative pressure within that polishing chamber,
wherein each platen plenum is configured to be pulled out from the chamber body, and comprises:
a handle, configured to enable an operator to pull out the platen plenum;
a latch, configured to fix the platen plenum in position below its corresponding polishing chamber; and

a sealing bracket, configured to seal the platen plenum;

a sampling port disposed in the door, wherein the sampling port allows withdrawal of a sample of gases including a toxic gas generated by the III-V CMP process or Ru CMP process inside the polishing chamber before opening the door;
a plurality of exhaust ports, each disposed on a wall of a corresponding one of the polishing chambers; and
an exhaust, connected to each of the exhaust ports, the exhaust comprising:
a moisture separator, for condensing moisture in the CMP byproduct into liquid for flowing out of the CMP system.

18. The CMP system as claimed in claim 17 , wherein the door is a plastic door.

19. The CMP system as claimed in claim 17 , wherein the door is a transparent door.

20. The CMP system as claimed in claim 17 , wherein the platen plenum is mounted on the chamber body below the door.

Assignees

• Peng Chih I
• Chang Hsiang Pi
• Lo Cary Chia Chiung
• Tsai Teng Chun
• Lin Kuo Yin
• Yang Chih Yuan
• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Peng Chih-I
• Chang Hsiang-Pi
• Lo Cary Chia-Chiung
• Tsai Teng-Chun
• Lin Kuo-Yin
• Yang Chih-Yuan

Classifications

• H10P72/0428

  Apparatus for mechanical treatment or grinding or cutting · CPC title

• F24F3/161

  Mechanical Engineering · mapped topic

• H01L21/67092

  Electricity · mapped topic

• B24B37/04

  designed for working plane surfaces · CPC title

• B01D53/265 Primary

  by refrigeration (condensation) · CPC title