Device structure and method of producing the same

Patent metadata

Field	Value
Publication number	US-10276827-B2
Application number	US-201414896572-A
Country	US
Kind code	B2
Filing date	May 21, 2014
Priority date	Jun 7, 2013
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A device structure 10 according to an embodiment of the present invention includes a substrate (base) 2, a device layer 3, a first inorganic material layer (convex portion) 41, and a first resin material 51. The substrate 2 has a first surface 2a and a second surface 2c opposite to the first surface 2a. The device layer 3 is arranged on at least the first surface 2a out of the first and second surfaces 2a and 2c. The first inorganic material layer 41 is formed on the first surface 2a. The first resin material 51 is unevenly arranged around the first inorganic material layer 41.

First claim

The invention claimed is:

1. A device structure, comprising:
a substrate having a first surface and a second surface opposite to the first surface;
a device layer arranged on the first surface of the substrate;
a first convex portion formed on the first surface, the first convex portion being made of a first inorganic material layer covering the device layer;
a first resin material selectively arranged around the first convex portion to fill a gap between the first convex portion and the first surface; and
a second convex portion made of a second inorganic material layer fully covering the first resin material and an upper surface and a side surface of the first inorganic material layer,
wherein the second inorganic material layer is in direct contact with the substrate, the first resin material, and the first inorganic material layer.

2. The device structure according to claim 1 , further comprising:
a second resin material that is interposed between the first inorganic material layer and the second inorganic material layer and is unevenly arranged on a surface of the first convex portion apart from the first resin material.

3. The device structure according to claim 1 , further comprising:
a second resin material filled in boundaries between a surface of the first convex portion and a particle attached to the surface of the first convex portion.

4. The device structure according to claim 1 , wherein
the first resin material is continuously provided along boundaries between a side surface of the first convex portion and the first surface.

5. The device structure according to claim 4 , wherein
an angle between the side surface of the first convex portion and the first surface on the boundaries is less than 90°; and
the boundaries are filled with the first resin material.

6. The device structure according to claim 1 , wherein
the first inorganic material layer includes a silicon compound.

7. The device structure according to claim 1 , wherein
the first resin material includes any one of acrylic resin and polyurea resin.

8. The device structure according to claim 1 , wherein
the device layer includes an organic luminescent layer.

9. A method of producing a device structure, comprising:
forming a convex portion made of first inorganic material layer covering a device layer provided on a surface of a substrate;
forming a resin layer selectively arranged around the convex portion to fill a gap between the convex portion and the surface of the substrate by supplying an organic material in the form of liquid to the surface of the substrate and selectively flocculating the organic material on boundaries between a side surface of the convex portion and the surface of the substrate; and
forming a second inorganic material layer fully covering the side surface of the convex portion and the material, so that the second inorganic material layer is in direct contact with the substrate, the resin material, and the first inorganic material layer, by deposition of an inorganic material on the surface of the substrate.

Assignees

• Ulvac Inc

Inventors

• Oka Tadashi
• Kato Yuko
• Yajima Takahiro
• Matsumoto Yousuke
• Kanai Shouta
• Murata Yasuaki

Classifications

• H01L51/5253 Primary

  Electricity · mapped topic

• H01L51/5246

  Electricity · mapped topic

• H01L51/004

  Electricity · mapped topic

• H01L2251/301

  Electricity · mapped topic

• H01L51/56

  Electricity · mapped topic