Micro-lensed light emitting device

Patent metadata

Field	Value
Publication number	US-10276764-B2
Application number	US-201715822504-A
Country	US
Kind code	B2
Filing date	Nov 27, 2017
Priority date	Dec 21, 2016
Publication date	Apr 30, 2019
Grant date	Apr 30, 2019

Abstract

A micro-lensed, light emitting device including, a backplane, light emitting diodes (LEDs) disposed on the backplane, an encapsulation layer encapsulating the LEDs, and micro-lenses disposed on the encapsulation layer and configured to reduce an emission angle of light emitted from the LEDs.

First claim

What is claimed is:

1. A micro-lensed, light emitting device, comprising:
a backplane;
light emitting diodes (LEDs) disposed on the backplane;
an encapsulation layer encapsulating the LEDs;
micro-lenses disposed on the encapsulation layer and configured to reduce an emission angle of light emitted from the LEDs;
conductive bonding structures located between the backplane and the LEDs, the conductive bonding structures operatively connected to a first side of the LEDs; and
conductive interconnect structures located in the encapsulation layer, the conductive interconnect structures operatively connected to a second side of the LEDs, wherein the second side is opposite the first side.

2. The device of claim 1 , wherein the device is configured such that each micro-lens receives at least 75% of light emitted from one of the LEDs.

3. The device of claim 1 , wherein the device is configured such that each micro-lens receives at least 75% of light emitted from at least three of the LEDs.

4. The device of claim 1 , further comprising an interlayer disposed between the encapsulation layer and the micro-lenses.

5. The device of claim 1 , wherein the encapsulation layer is transparent.

6. The device of claim 1 , wherein the conductive bonding structures are electrically attached to a circuitry located in the back plane.

Assignees

• Glo Ab

Inventors

• Jansen Michael
• Wang Sheng-Min
• Huang Hui-Yu

Classifications

• H10P72/7412

  the auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W90/00

  Package configurations · CPC title

• H01L33/52

  Electricity · mapped topic